PH12017500284A1 - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents
Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coatingInfo
- Publication number
- PH12017500284A1 PH12017500284A1 PH12017500284A PH12017500284A PH12017500284A1 PH 12017500284 A1 PH12017500284 A1 PH 12017500284A1 PH 12017500284 A PH12017500284 A PH 12017500284A PH 12017500284 A PH12017500284 A PH 12017500284A PH 12017500284 A1 PH12017500284 A1 PH 12017500284A1
- Authority
- PH
- Philippines
- Prior art keywords
- protective coating
- protective
- coating
- forming sheet
- semiconductor chip
- Prior art date
Links
- 239000011253 protective coating Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000001681 protective effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 abstract 4
- 101100243022 Mus musculus Pcnt gene Proteins 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Formation Of Insulating Films (AREA)
- Paints Or Removers (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014169266 | 2014-08-22 | ||
| JP2014169267 | 2014-08-22 | ||
| PCT/JP2015/073545 WO2016027888A1 (ja) | 2014-08-22 | 2015-08-21 | 保護膜形成用シートおよび保護膜付き半導体チップの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12017500284B1 PH12017500284B1 (en) | 2017-07-03 |
| PH12017500284A1 true PH12017500284A1 (en) | 2017-07-03 |
Family
ID=55350823
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12017500284A PH12017500284A1 (en) | 2014-08-22 | 2017-02-16 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
| PH12017500285A PH12017500285B1 (en) | 2014-08-22 | 2017-02-16 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12017500285A PH12017500285B1 (en) | 2014-08-22 | 2017-02-16 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Country Status (8)
| Country | Link |
|---|---|
| JP (2) | JP6589209B2 (zh) |
| KR (2) | KR102376017B1 (zh) |
| CN (2) | CN106660332B (zh) |
| MY (2) | MY186759A (zh) |
| PH (2) | PH12017500284A1 (zh) |
| SG (2) | SG11201701270QA (zh) |
| TW (4) | TWI712670B (zh) |
| WO (2) | WO2016027883A1 (zh) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201803325QA (en) * | 2015-10-29 | 2018-05-30 | Lintec Corp | Film for protective film formation and composite sheet for protective film formation |
| CN108271381B (zh) * | 2016-03-04 | 2022-06-07 | 琳得科株式会社 | 半导体加工用片 |
| JP6573841B2 (ja) * | 2016-03-04 | 2019-09-11 | リンテック株式会社 | 半導体加工用シート |
| CN108243616B (zh) * | 2016-03-04 | 2022-10-28 | 琳得科株式会社 | 半导体加工用片 |
| SG11201805895XA (en) * | 2016-03-04 | 2018-09-27 | Lintec Corp | Protective film-forming composite sheet |
| KR102516392B1 (ko) * | 2016-03-04 | 2023-03-30 | 린텍 가부시키가이샤 | 보호막 형성용 복합 시트 |
| JP6617056B2 (ja) * | 2016-03-04 | 2019-12-04 | リンテック株式会社 | 半導体加工用シート、その巻取体および当該巻取体の製造方法 |
| TWI721158B (zh) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | 保護膜形成用膜及保護膜形成用複合片 |
| TWI731964B (zh) * | 2016-04-28 | 2021-07-01 | 日商琳得科股份有限公司 | 保護膜形成用複合片 |
| TWI796297B (zh) * | 2016-04-28 | 2023-03-21 | 日商琳得科股份有限公司 | 保護膜形成用複合片 |
| TWI778960B (zh) * | 2016-04-28 | 2022-10-01 | 日商琳得科股份有限公司 | 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法 |
| CN109071845A (zh) * | 2016-04-28 | 2018-12-21 | 琳得科株式会社 | 保护膜形成用膜以及保护膜形成用复合片 |
| JP6278164B1 (ja) * | 2016-05-12 | 2018-02-14 | 住友ベークライト株式会社 | 半導体基板加工用粘着テープ |
| JP6776081B2 (ja) * | 2016-09-28 | 2020-10-28 | リンテック株式会社 | 保護膜付き半導体チップの製造方法及び半導体装置の製造方法 |
| CN110622302B (zh) * | 2017-05-17 | 2022-11-22 | 琳得科株式会社 | 半导体装置及其制造方法 |
| SG11202001719RA (en) * | 2017-08-28 | 2020-03-30 | Lintec Corp | Film-like transparent adhesive and infrared sensor module |
| WO2019146607A1 (ja) * | 2018-01-24 | 2019-08-01 | リンテック株式会社 | 長尺積層シートおよびその巻収体 |
| KR102487552B1 (ko) | 2018-02-05 | 2023-01-11 | 삼성전자주식회사 | 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법 |
| CN111670231B (zh) * | 2018-03-23 | 2022-06-03 | 琳得科株式会社 | 膜状粘合剂及半导体加工用片 |
| WO2019187014A1 (ja) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | 支持シート及び保護膜形成用複合シート |
| WO2019187010A1 (ja) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | 保護膜形成用複合シート及びその製造方法 |
| JP6854983B1 (ja) * | 2019-04-26 | 2021-04-07 | リンテック株式会社 | 第三積層体の製造方法、第四積層体の製造方法及び裏面保護膜付き半導体装置の製造方法、並びに、第三積層体 |
| JP7453879B2 (ja) | 2020-08-12 | 2024-03-21 | リンテック株式会社 | 保護膜形成用シートロールおよび保護膜形成用シートロールの製造方法 |
| JP7484557B2 (ja) | 2020-08-18 | 2024-05-16 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着シート及び積層体 |
| JP7084972B2 (ja) * | 2020-10-06 | 2022-06-15 | リンテック株式会社 | 保護膜形成用複合シート |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3252806B1 (en) | 2002-03-12 | 2019-10-09 | Hamamatsu Photonics K.K. | Substrate dividing method |
| KR100633849B1 (ko) * | 2002-04-03 | 2006-10-13 | 가부시키가이샤 도모에가와 세이시쇼 | 반도체 장치 제조용 접착 시트 |
| JP3857953B2 (ja) * | 2002-05-16 | 2006-12-13 | 株式会社巴川製紙所 | 半導体装置製造用接着シート |
| JP4364508B2 (ja) * | 2002-12-27 | 2009-11-18 | リンテック株式会社 | チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法 |
| KR101177250B1 (ko) * | 2003-06-06 | 2012-08-24 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체 장치의 제조방법 |
| EP1650790B1 (en) * | 2003-07-08 | 2010-04-28 | LINTEC Corporation | Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
| JP4846406B2 (ja) * | 2006-03-28 | 2011-12-28 | リンテック株式会社 | チップ用保護膜形成用シート |
| US20110220728A1 (en) * | 2008-11-27 | 2011-09-15 | Du Pont-Mitsui Polychemicals Co., Ltd. | Protective film for electronic component, method for manufacturing the same, and use thereof |
| JP5335483B2 (ja) * | 2009-02-27 | 2013-11-06 | リンテック株式会社 | 粘着剤層付き偏光板の製造方法 |
| JP5603757B2 (ja) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | レーザーダイシング用粘着シート及び半導体装置の製造方法 |
| JP2011151362A (ja) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | ダイシングテープ一体型半導体裏面用フィルム |
| JP2012033637A (ja) | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法 |
| JP5580701B2 (ja) * | 2010-09-13 | 2014-08-27 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| CN103620742B (zh) * | 2011-07-01 | 2016-05-25 | 古河电气工业株式会社 | 粘接膜、切割芯片接合膜及使用该切割芯片接合膜的半导体加工方法 |
| JP5865045B2 (ja) * | 2011-12-07 | 2016-02-17 | リンテック株式会社 | 保護膜形成層付ダイシングシートおよびチップの製造方法 |
| JP6001273B2 (ja) * | 2012-02-13 | 2016-10-05 | 信越化学工業株式会社 | 半導体ウエハ用保護フィルム及び半導体チップの製造方法 |
| WO2013172328A1 (ja) * | 2012-05-14 | 2013-11-21 | リンテック株式会社 | 接着性樹脂層付シートおよび半導体装置の製造方法 |
| CN104871310B (zh) * | 2012-11-30 | 2018-03-09 | 琳得科株式会社 | 芯片用树脂膜形成用片及半导体装置的制造方法 |
| CN111180380B (zh) * | 2014-03-24 | 2023-11-10 | 琳得科株式会社 | 保护膜形成膜、保护膜形成用片及加工物的制造方法 |
| WO2015146936A1 (ja) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物 |
-
2015
- 2015-08-21 SG SG11201701270QA patent/SG11201701270QA/en unknown
- 2015-08-21 TW TW108128902A patent/TWI712670B/zh active
- 2015-08-21 MY MYPI2017700515A patent/MY186759A/en unknown
- 2015-08-21 WO PCT/JP2015/073503 patent/WO2016027883A1/ja active Application Filing
- 2015-08-21 MY MYPI2017700479A patent/MY182846A/en unknown
- 2015-08-21 TW TW108122914A patent/TWI706023B/zh active
- 2015-08-21 TW TW104127316A patent/TWI672354B/zh active
- 2015-08-21 CN CN201580044561.4A patent/CN106660332B/zh active Active
- 2015-08-21 CN CN201580044562.9A patent/CN106660333B/zh active Active
- 2015-08-21 JP JP2016544263A patent/JP6589209B2/ja active Active
- 2015-08-21 WO PCT/JP2015/073545 patent/WO2016027888A1/ja active Application Filing
- 2015-08-21 KR KR1020177004494A patent/KR102376017B1/ko active IP Right Grant
- 2015-08-21 TW TW104127314A patent/TWI668290B/zh active
- 2015-08-21 SG SG11201701272UA patent/SG11201701272UA/en unknown
- 2015-08-21 JP JP2016544268A patent/JPWO2016027888A1/ja active Pending
- 2015-08-21 KR KR1020177004497A patent/KR102368140B1/ko active IP Right Grant
-
2017
- 2017-02-16 PH PH12017500284A patent/PH12017500284A1/en unknown
- 2017-02-16 PH PH12017500285A patent/PH12017500285B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6589209B2 (ja) | 2019-10-16 |
| PH12017500284B1 (en) | 2017-07-03 |
| TW201938728A (zh) | 2019-10-01 |
| TWI712670B (zh) | 2020-12-11 |
| SG11201701272UA (en) | 2017-04-27 |
| TW201614023A (en) | 2016-04-16 |
| KR102368140B1 (ko) | 2022-02-25 |
| TWI706023B (zh) | 2020-10-01 |
| TW201940622A (zh) | 2019-10-16 |
| CN106660333A (zh) | 2017-05-10 |
| TWI672354B (zh) | 2019-09-21 |
| WO2016027883A1 (ja) | 2016-02-25 |
| MY186759A (en) | 2021-08-18 |
| KR20170044652A (ko) | 2017-04-25 |
| JPWO2016027883A1 (ja) | 2017-06-01 |
| MY182846A (en) | 2021-02-05 |
| SG11201701270QA (en) | 2017-03-30 |
| WO2016027888A1 (ja) | 2016-02-25 |
| TWI668290B (zh) | 2019-08-11 |
| JPWO2016027888A1 (ja) | 2017-06-01 |
| PH12017500285A1 (en) | 2017-06-28 |
| KR20170044108A (ko) | 2017-04-24 |
| CN106660332B (zh) | 2020-08-07 |
| CN106660333B (zh) | 2018-11-06 |
| TW201614024A (en) | 2016-04-16 |
| CN106660332A (zh) | 2017-05-10 |
| KR102376017B1 (ko) | 2022-03-17 |
| PH12017500285B1 (en) | 2017-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PH12017500284A1 (en) | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating | |
| PH12018500670A1 (en) | Sheet for semiconductor processing | |
| EP3513958A3 (en) | Method of making a laminate and a forming tool | |
| PH12016501986A1 (en) | Applicator | |
| PH12016501696A1 (en) | Release film for green sheet manufacturing, release film manufacturing method for green sheet manufacturing, green sheet manufacturing method, and green sheet | |
| SG11201902926YA (en) | Adhesive tape for semiconductor processing, and semiconductor device manufacturing method | |
| EP3207094A4 (en) | Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition | |
| MY182272A (en) | Mold release film and process for producing sealed body | |
| MX2016015582A (es) | Etiqueta, metodo de fabricacion de etiqueta, metodo para utilizar la etiqueta, y cuerpo con etiqueta. | |
| EP4218463A3 (en) | An article for use with an apparatus for heating an aerosol generating agent | |
| EP3121210A4 (en) | Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing same, semiconductor device, and led device. | |
| MY187016A (en) | First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip | |
| EP3626781A4 (en) | COMPOSITION OF HARDENABLE ORGANOPOLYSILOXANE CONTAINING A FLUOROALKYL GROUP, ASSOCIATED CURED PRODUCT, AND TRANSDUCER OR ANALOGUE PROVIDED WITH THE CURED PRODUCT | |
| EP3187516A4 (en) | Curable composition, cured product of functional polymer, stack or device provided with functional polymer film, amide compound and method for producing same | |
| MY181207A (en) | Dicing sheet | |
| PH12018500881A1 (en) | Curable resin film and first protective film forming sheet | |
| AU2016404531A1 (en) | Multilayer coating and process of preparing the multilayer coating | |
| PL3494420T3 (pl) | Podłoże wyposażone w stos o właściwościach termicznych zawierające co najmniej jedną warstwę zawierającą azotek krzemowo-cyrkonowy bogaty w cyrkon, jego zastosowanie i wytwarzanie | |
| SG11202005787TA (en) | Release film-equipped pressure sensitive adhesive sheet and method for manufacturing the same | |
| WO2015186076A3 (en) | Abrasive tool for machining surfaces | |
| SG11202100176VA (en) | Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film | |
| MY164338A (en) | Dicing film | |
| SG10201907601SA (en) | Film-like adhesive composite sheet and method for manufacturing semiconductor device | |
| MX2017003634A (es) | Envoltura de lamina con propiedades adhesivas. | |
| WO2016109203A3 (en) | Coated articles and methods for making same |