PH12016000032A1 - Palladium (pd)-coated copper wire for ball bonding - Google Patents

Palladium (pd)-coated copper wire for ball bonding

Info

Publication number
PH12016000032A1
PH12016000032A1 PH12016000032A PH12016000032A PH12016000032A1 PH 12016000032 A1 PH12016000032 A1 PH 12016000032A1 PH 12016000032 A PH12016000032 A PH 12016000032A PH 12016000032 A PH12016000032 A PH 12016000032A PH 12016000032 A1 PH12016000032 A1 PH 12016000032A1
Authority
PH
Philippines
Prior art keywords
palladium
copper
layer
exuded
wire
Prior art date
Application number
PH12016000032A
Other languages
English (en)
Other versions
PH12016000032B1 (en
Inventor
Hiroyuki Amano
takuya Hamamoto
Yuka Nagae
Yusuke Sakita
Syuichi Mitoma
Mitsuo Takada
Takeshi Kuwahara
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of PH12016000032A1 publication Critical patent/PH12016000032A1/en
Publication of PH12016000032B1 publication Critical patent/PH12016000032B1/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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PH12016000032A 2015-02-23 2016-01-21 Palladium (pd)-coated copper wire for ball bonding PH12016000032B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033170A JP5807992B1 (ja) 2015-02-23 2015-02-23 ボールボンディング用パラジウム（Ｐｄ）被覆銅ワイヤ

Publications (2)

Publication Number Publication Date
PH12016000032A1 true PH12016000032A1 (en) 2017-07-31
PH12016000032B1 PH12016000032B1 (en) 2017-07-31

Family

ID=54545812

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016000032A PH12016000032B1 (en) 2015-02-23 2016-01-21 Palladium (pd)-coated copper wire for ball bonding

Country Status (5)

Country Link
JP (1) JP5807992B1 (ja)
CN (1) CN105914195B (ja)
PH (1) PH12016000032B1 (ja)
SG (1) SG10201510489VA (ja)
TW (2) TWI553130B (ja)

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Publication number Priority date Publication date Assignee Title
WO2017013796A1 (ja) * 2015-07-23 2017-01-26 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR102012143B1 (ko) * 2015-12-15 2019-08-19 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 반도체 장치용 본딩 와이어
SG10201600329SA (en) * 2016-01-15 2017-08-30 Heraeus Materials Singapore Pte Ltd Coated wire
JP6507329B1 (ja) 2019-02-08 2019-04-24 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、ワイヤ接合構造、半導体装置及び半導体装置の製造方法

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JP4349641B1 (ja) * 2009-03-23 2009-10-21 田中電子工業株式会社 ボールボンディング用被覆銅ワイヤ
JP4866490B2 (ja) * 2009-06-24 2012-02-01 新日鉄マテリアルズ株式会社 半導体用銅合金ボンディングワイヤ
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