PH12016000032A1 - Palladium (pd)-coated copper wire for ball bonding - Google Patents

Palladium (pd)-coated copper wire for ball bonding

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Publication number
PH12016000032A1
PH12016000032A1 PH12016000032A PH12016000032A PH12016000032A1 PH 12016000032 A1 PH12016000032 A1 PH 12016000032A1 PH 12016000032 A PH12016000032 A PH 12016000032A PH 12016000032 A PH12016000032 A PH 12016000032A PH 12016000032 A1 PH12016000032 A1 PH 12016000032A1
Authority
PH
Philippines
Prior art keywords
palladium
copper
layer
exuded
wire
Prior art date
Application number
PH12016000032A
Other versions
PH12016000032B1 (en
Inventor
Hiroyuki Amano
takuya Hamamoto
Yuka Nagae
Yusuke Sakita
Syuichi Mitoma
Mitsuo Takada
Takeshi Kuwahara
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of PH12016000032A1 publication Critical patent/PH12016000032A1/en
Publication of PH12016000032B1 publication Critical patent/PH12016000032B1/en

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The present invention is devised so as to solve a problem that a molten ball or an FAB formed in mass production of bonding wire is not uniform in shape. An object of the present invention is to provide a palladium (Pd)-coated copper wire for ball bonding that is easily loosened and can form a molten ball uniform in shape. [Constitution of Invention] Provided is a palladium (Pd)-coated copper wire for ball bonding, the palladium (Pd)-coated copper wire having a copper (Cu) or copper-alloy core and a palladium (Pd) coating formed on the core and having a wire diameter of 10 to 25 mn, including a solid palladium (Pd) layer solely consisting of solid palladium (Pd), the solid palladium (Pd) layer being present in the palladium (Pd) coating, and a copper (Cu)-exuded layer formed of copper (Cu) exuded from the core, the copper (Cu)-exuded layer being formed on the palladium (Pd) coating, a surface of the copper (Cu)-exuded layer having been oxidized. Also provided is a palladium (Pdi-coated copper wire for ball bonding, the palladium (Pd)-coated copper wire having a copper (Cu) or copper-alloy core, having a palladium (Pd) coating and a gold (Au) skin layer on the core, and having a wire diameter of 10 to 25 mn, the palladium (Pd)-coated copper wire including a copper (Cu)-exuded layer, the copper (Cu)-exuded layer being formed on the gold (Au) skin layer, a surface ofthe copper (Cu)-exuded layer having been oxidized, and a solid palladium (Pd) layer solely consisting of solid palladium (Pd), the solid palladium (Pd) layer being present in the palladium (Pd) coating.
PH12016000032A 2015-02-23 2016-01-21 Palladium (pd)-coated copper wire for ball bonding PH12016000032B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033170A JP5807992B1 (en) 2015-02-23 2015-02-23 Palladium (Pd) coated copper wire for ball bonding

Publications (2)

Publication Number Publication Date
PH12016000032A1 true PH12016000032A1 (en) 2017-07-31
PH12016000032B1 PH12016000032B1 (en) 2017-07-31

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US10468370B2 (en) * 2015-07-23 2019-11-05 Nippon Micrometal Corporation Bonding wire for semiconductor device
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US20040245320A1 (en) * 2001-10-23 2004-12-09 Mesato Fukagaya Bonding wire
JP4349641B1 (en) * 2009-03-23 2009-10-21 田中電子工業株式会社 Coated copper wire for ball bonding
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CN101707194B (en) * 2009-11-11 2011-11-23 宁波康强电子股份有限公司 production method of palladium-plated bonded copper wire
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TWI553130B (en) 2016-10-11

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