NZ725495A - Doped rare earth nitride materials and devices comprising same - Google Patents

Doped rare earth nitride materials and devices comprising same

Info

Publication number
NZ725495A
NZ725495A NZ725495A NZ72549515A NZ725495A NZ 725495 A NZ725495 A NZ 725495A NZ 725495 A NZ725495 A NZ 725495A NZ 72549515 A NZ72549515 A NZ 72549515A NZ 725495 A NZ725495 A NZ 725495A
Authority
NZ
New Zealand
Prior art keywords
rare earth
nitride materials
doped rare
earth nitride
devices
Prior art date
Application number
NZ725495A
Other languages
English (en)
Inventor
Franck Natali
Benjamin John Ruck
Harry Joseph Trodahl
Stéphane Ange Vézian
Original Assignee
Franck Natali
Benjamin John Ruck
Harry Joseph Trodahl
Vezian Stephane Ange
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Franck Natali, Benjamin John Ruck, Harry Joseph Trodahl, Vezian Stephane Ange filed Critical Franck Natali
Publication of NZ725495A publication Critical patent/NZ725495A/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3446—Transition metal elements; Rare earth elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
    • C30B23/066—Heating of the material to be evaporated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/025—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/38—Nitrides
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
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    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
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    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2921—Materials being crystalline insulating materials
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
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    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3216—Nitrides
    • H—ELECTRICITY
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416—Nitrides
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3442—N-type
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
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    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
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    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
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    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
    • H10P14/69396—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium

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  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Ceramic Products (AREA)
NZ725495A 2014-04-02 2015-03-31 Doped rare earth nitride materials and devices comprising same NZ725495A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NZ62333914 2014-04-02
PCT/NZ2015/050039 WO2015152737A2 (en) 2014-04-02 2015-03-31 Doped rare earth nitride materials and devices comprising same

Publications (1)

Publication Number Publication Date
NZ725495A true NZ725495A (en) 2020-05-29

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NZ725495A NZ725495A (en) 2014-04-02 2015-03-31 Doped rare earth nitride materials and devices comprising same

Country Status (7)

Country Link
US (1) US10415153B2 (enExample)
EP (1) EP3127146A4 (enExample)
JP (1) JP6618481B2 (enExample)
KR (1) KR102328525B1 (enExample)
CN (1) CN106460229B (enExample)
NZ (1) NZ725495A (enExample)
WO (1) WO2015152737A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373752B2 (en) * 2014-04-02 2019-08-06 Franck Natali Magnetic materials and devices comprising rare earth nitrides
US9673281B2 (en) * 2015-09-08 2017-06-06 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation using rare-earth oxide and/or rare-earth nitride diffusion barrier regions
US10229839B2 (en) * 2016-04-29 2019-03-12 The United States Of America, As Represented By The Secretary Of The Navy Transition metal-bearing capping film for group III-nitride devices
KR20190088556A (ko) * 2016-12-07 2019-07-26 빅토리아 링크 엘티디 희토류 질화물 구조체와 소자 및 패시베이션 캐핑 제거방법
US10043871B1 (en) * 2017-04-06 2018-08-07 Ecole Polytechnique Federale De Lausanne (Epfl) Rare earth nitride and group III-nitride structure or device
JP7146287B2 (ja) * 2017-07-03 2022-10-04 ビクトリア リンク リミテッド アンモニアの製造方法およびアンモニア製造のための装置
JP7398803B2 (ja) * 2020-02-27 2023-12-15 国立研究開発法人産業技術総合研究所 窒化物材料およびそれからなる圧電体並びにその圧電体を用いたmemsデバイス

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8628609D0 (en) * 1986-11-29 1987-01-07 Bp Chemicals Additives Lubricating oil additives
GB9213723D0 (en) * 1992-06-27 1992-08-12 Bp Chemicals Additives Process for the production of lubricating oil additives
US5611955A (en) 1993-10-18 1997-03-18 Northrop Grumman Corp. High resistivity silicon carbide substrates for high power microwave devices
JPH11121215A (ja) 1997-10-15 1999-04-30 Hitachi Metals Ltd 希土類磁石粉末の製造方法
US5998232A (en) 1998-01-16 1999-12-07 Implant Sciences Corporation Planar technology for producing light-emitting devices
CA2311061C (en) 1999-06-11 2009-10-06 National Research Council Of Canada Molecular beam epitaxy (mbe) growth of semi-insulating c-doped gan
US7316837B2 (en) 2000-07-21 2008-01-08 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
FR2829868A1 (fr) 2001-09-20 2003-03-21 Centre Nat Rech Scient Memoire magnetique a ecriture par courant polarise en spin, mettant en oeuvre des alliages amorphes ferrimagnetiques et procede pour son ecriture
FR2829867B1 (fr) 2001-09-20 2003-12-19 Centre Nat Rech Scient Memoire magnetique a selection a l'ecriture par inhibition et procede pour son ecriture
JP3592282B2 (ja) 2001-10-01 2004-11-24 キヤノン株式会社 磁気抵抗効果膜、およびそれを用いたメモリ
JP2004172218A (ja) 2002-11-18 2004-06-17 Sony Corp 磁気記憶素子及びその記録方法、並びに磁気記憶装置
US7205662B2 (en) * 2003-02-27 2007-04-17 Symmorphix, Inc. Dielectric barrier layer films
US7170095B2 (en) 2003-07-11 2007-01-30 Cree Inc. Semi-insulating GaN and method of making the same
US20050122828A1 (en) 2003-09-29 2005-06-09 Matsushita Electric Industrial Co., Ltd. Magnetic switching device and memory using the same
US7271981B2 (en) 2003-11-20 2007-09-18 Seagate Technology Llc Ultrafast pulse field source utilizing optically induced magnetic transformation
JP4792714B2 (ja) 2003-11-28 2011-10-12 ソニー株式会社 記憶素子及び記憶装置
WO2005060657A2 (en) 2003-12-15 2005-07-07 Yale University Magnetoelectronic devices based on colossal magnetoresistive thin films
JP4830275B2 (ja) 2004-07-22 2011-12-07 ソニー株式会社 記憶素子
CN1914733A (zh) 2004-09-14 2007-02-14 松下电器产业株式会社 变电阻元件和使用其的非易失性存储器
US7313013B2 (en) 2004-11-18 2007-12-25 International Business Machines Corporation Spin-current switchable magnetic memory element and method of fabricating the memory element
US7253080B1 (en) 2005-02-09 2007-08-07 Translucent Inc. Silicon-on-insulator semiconductor wafer
US7037806B1 (en) 2005-02-09 2006-05-02 Translucent Inc. Method of fabricating silicon-on-insulator semiconductor substrate using rare earth oxide or rare earth nitride
DE112006000612T5 (de) 2005-03-23 2008-02-14 National Institute Of Advanced Industrial Science And Technology Nichtflüchtiges Speicherelement
JP2006269688A (ja) 2005-03-23 2006-10-05 National Institute Of Advanced Industrial & Technology 不揮発性メモリ素子
US7489073B2 (en) 2005-04-15 2009-02-10 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Blue to yellow-orange emitting phosphor, and light source having such a phosphor
US7489541B2 (en) 2005-08-23 2009-02-10 Grandis, Inc. Spin-transfer switching magnetic elements using ferrimagnets and magnetic memories using the magnetic elements
JP2007080311A (ja) 2005-09-12 2007-03-29 Sony Corp 記憶装置及び半導体装置
JP4719035B2 (ja) 2006-03-13 2011-07-06 株式会社東芝 不揮発性半導体メモリ装置及びその製造方法
US7518216B2 (en) 2006-03-20 2009-04-14 Sumitomo Electric Industries, Ltd. Gallium nitride baseplate, epitaxial substrate, and method of forming gallium nitride
US8012442B2 (en) 2006-03-31 2011-09-06 Tokyo Electron Limited Method of forming mixed rare earth nitride and aluminum nitride films by atomic layer deposition
US7816737B2 (en) 2006-03-31 2010-10-19 Tokyo Electron Limited Semiconductor device with gate dielectric containing mixed rare earth elements
US7466585B2 (en) 2006-04-28 2008-12-16 Taiwan Semiconductor Manufacturing Co., Ltd. Magnetic random access memory
US8399056B2 (en) 2006-06-02 2013-03-19 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnium precursors and their use for semiconductor manufacturing
US20080079111A1 (en) * 2006-09-29 2008-04-03 Tokyo Electron Limited Semiconductor devices containing nitrided high dielectric constant films
US7820552B2 (en) 2007-03-13 2010-10-26 International Business Machines Corporation Advanced high-k gate stack patterning and structure containing a patterned high-k gate stack
JP5103979B2 (ja) * 2007-03-27 2012-12-19 豊田合成株式会社 III族窒化物系化合物半導体に対する電極形成方法及びp型III族窒化物系化合物半導体の製造方法
JP2008274342A (ja) 2007-04-27 2008-11-13 Tosoh Corp プラズマ耐蝕性材料およびそれを含んでなる部材
CN100524863C (zh) * 2007-07-05 2009-08-05 武汉大学 一种电致发光二极管的制备方法
JP5050813B2 (ja) 2007-11-29 2012-10-17 ソニー株式会社 メモリセル
EP2232495B1 (en) 2007-12-13 2013-01-23 Crocus Technology Magnetic memory with a thermally assisted writing procedure
US7920416B2 (en) 2008-03-12 2011-04-05 International Business Machines Corporation Increased magnetic damping for toggle MRAM
JP5509731B2 (ja) 2008-08-04 2014-06-04 株式会社三徳 希土類窒化物およびその製造方法、ならびに磁気冷凍材料および蓄冷材料
WO2010051536A1 (en) 2008-10-31 2010-05-06 The Regents Of The University Of California Method of fabricating semi-insulating gallium nitride using an aluminum gallium nitride blocking layer
KR20170116180A (ko) 2009-09-17 2017-10-18 아이아이아이 홀딩스 3, 엘엘씨 자기저항소자 및 이를 이용한 비휘발성 반도체 기억장치
JP5825920B2 (ja) 2010-08-11 2015-12-02 太平洋セメント株式会社 金属窒化物の製造方法
JP5988017B2 (ja) 2011-10-19 2016-09-07 国立研究開発法人産業技術総合研究所 希土類窒化物系等方性焼結磁石とその製造方法
JP2013170098A (ja) 2012-02-21 2013-09-02 Nippon Telegr & Teleph Corp <Ntt> 遷移金属窒化物薄膜の製造方法および装置
US20130251942A1 (en) 2012-03-23 2013-09-26 Gisele Azimi Hydrophobic Materials Incorporating Rare Earth Elements and Methods of Manufacture
WO2013141953A2 (en) 2012-03-23 2013-09-26 Massachusetts Institute Of Technology Liquid-encapsulated rare-earth based ceramic surfaces

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JP2017511294A (ja) 2017-04-20
JP6618481B2 (ja) 2019-12-11
US20170022632A1 (en) 2017-01-26
US10415153B2 (en) 2019-09-17
KR20170005409A (ko) 2017-01-13
WO2015152737A2 (en) 2015-10-08
CN106460229A (zh) 2017-02-22
WO2015152737A3 (en) 2016-01-14
CN106460229B (zh) 2019-12-10
EP3127146A2 (en) 2017-02-08
EP3127146A4 (en) 2017-11-08
KR102328525B1 (ko) 2021-11-19

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