NZ286847A - Capacitor heat shield provides protection during soldering - Google Patents
Capacitor heat shield provides protection during solderingInfo
- Publication number
- NZ286847A NZ286847A NZ286847A NZ28684796A NZ286847A NZ 286847 A NZ286847 A NZ 286847A NZ 286847 A NZ286847 A NZ 286847A NZ 28684796 A NZ28684796 A NZ 28684796A NZ 286847 A NZ286847 A NZ 286847A
- Authority
- NZ
- New Zealand
- Prior art keywords
- plastic film
- shield
- film capacitor
- capacitor
- infrared
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 122
- 238000005476 soldering Methods 0.000 title claims abstract description 14
- 239000002985 plastic film Substances 0.000 claims abstract description 63
- 229920006255 plastic film Polymers 0.000 claims abstract description 63
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 230000006378 damage Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 20
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 abstract description 14
- 229920003023 plastic Polymers 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000000475 sunscreen effect Effects 0.000 description 3
- 239000000516 sunscreening agent Substances 0.000 description 3
- 230000003685 thermal hair damage Effects 0.000 description 3
- SYJPAKDNFZLSMV-HYXAFXHYSA-N (Z)-2-methylpropanal oxime Chemical compound CC(C)\C=N/O SYJPAKDNFZLSMV-HYXAFXHYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229940024548 aluminum oxide Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D3/00—Yielding couplings, i.e. with means permitting movement between the connected parts during the drive
- F16D3/16—Universal joints in which flexibility is produced by means of pivots or sliding or rolling connecting parts
- F16D3/26—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected
- F16D3/38—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected with a single intermediate member with trunnions or bearings arranged on two axes perpendicular to one another
- F16D3/382—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected with a single intermediate member with trunnions or bearings arranged on two axes perpendicular to one another constructional details of other than the intermediate member
- F16D3/387—Fork construction; Mounting of fork on shaft; Adapting shaft for mounting of fork
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49350495A | 1995-06-21 | 1995-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NZ286847A true NZ286847A (en) | 1997-04-24 |
Family
ID=23960496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NZ286847A NZ286847A (en) | 1995-06-21 | 1996-06-19 | Capacitor heat shield provides protection during soldering |
Country Status (15)
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10112355C1 (de) | 2001-03-13 | 2002-06-13 | Daimler Chrysler Ag | Verfahren und Schutzvorrichtung zur Montage eines temperaturempfindlichen elektronischen Bauteils |
| US6681771B2 (en) * | 2002-03-22 | 2004-01-27 | Jean-Francois Durette | Organ shields for medical procedures |
| DE102014100469A1 (de) * | 2013-11-29 | 2015-06-03 | Epcos Ag | Elektronisches Bauelement und Verwendung desselben |
| DE102017206386A1 (de) * | 2017-04-13 | 2018-10-18 | Robert Bosch Gmbh | Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit |
| US11153976B2 (en) | 2018-05-24 | 2021-10-19 | International Business Machines Corporation | Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper |
| CN110858514A (zh) * | 2018-08-24 | 2020-03-03 | 南通三鑫电子科技股份有限公司 | 一种反光电容器 |
| CN113012940A (zh) * | 2021-02-26 | 2021-06-22 | 宁波央腾汽车电子有限公司 | 一种集成屏蔽功能的薄膜电容结构 |
| CN117321714A (zh) * | 2021-03-31 | 2023-12-29 | 基美电子公司 | 耐热性改进的电子元件 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3718800A (en) | 1968-03-05 | 1973-02-27 | Argus Eng Co | Infrared heating apparatus |
| US3592992A (en) | 1969-03-13 | 1971-07-13 | Argus Eng Co | Soldering method and apparatus |
| US3612963A (en) | 1970-03-11 | 1971-10-12 | Union Carbide Corp | Multilayer ceramic capacitor and process |
| US4123309A (en) * | 1973-11-29 | 1978-10-31 | Minnesota Mining And Manufacturing Company | Transfer letter system |
| US4462062A (en) | 1981-02-27 | 1984-07-24 | Illinois Tool Works Inc. | Capacitive structure |
| US4481708A (en) | 1982-01-18 | 1984-11-13 | Analog Devices, Inc. | Reduced internal temperature technique for hermetic sealing of enclosures |
| EP0130386B1 (de) | 1983-06-03 | 1987-09-09 | Wolfgang Westermann | Kunststoffolien-Wickelkondensator |
| US4603373A (en) * | 1983-07-13 | 1986-07-29 | Electronic Concepts, Inc. | Outer wrapping for a metallized wound capacitor |
| US4516187A (en) | 1983-07-13 | 1985-05-07 | Electronic Concepts, Inc. | Outer wrapping and planar terminations for a metallized wound capacitor and method therefor |
| JPH0656826B2 (ja) | 1984-06-04 | 1994-07-27 | 東レ株式会社 | コンデンサ |
| US4580190A (en) | 1984-12-07 | 1986-04-01 | Illinois Tool Works Inc. | Surface mountable electrical package |
| DE3505888C1 (de) | 1985-02-20 | 1986-08-14 | Wolfgang Dipl.-Ing. 6800 Mannheim Westermann | Kunststoffolien-Wickelkondensator in Chipbauweise |
| JPS61241949A (ja) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | 半導体装置 |
| DE3737457A1 (de) | 1987-11-04 | 1989-05-18 | Peter Gammelin | Loetvorrichtung |
| US4838475A (en) | 1987-08-28 | 1989-06-13 | Motorola, Inc. | Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device |
| JPS6469038A (en) * | 1987-09-10 | 1989-03-15 | Matsushita Electronics Corp | Resin-sealed semiconductor device |
| JPS6489501A (en) * | 1987-09-30 | 1989-04-04 | Nec Corp | Chiplike resin-covered electronic component |
| JPH0677830B2 (ja) | 1987-12-25 | 1994-10-05 | 松下電器産業株式会社 | 基板加熱方法 |
| US5268051A (en) * | 1988-11-09 | 1993-12-07 | Polysar Rubber Corporation | Self-bonding tapes |
| JPH0521655A (ja) * | 1990-11-28 | 1993-01-29 | Mitsubishi Electric Corp | 半導体装置および半導体装置用パツケージ |
| JPH07142624A (ja) * | 1993-11-17 | 1995-06-02 | Nec Corp | 半導体装置 |
| US5371650A (en) * | 1994-02-15 | 1994-12-06 | Electronic Concepts, Inc. | Hermetically sealed capacitor and method for making the same |
| DE4415950A1 (de) * | 1994-05-05 | 1995-11-09 | Siemens Matsushita Components | Elektrisches Bauelement |
-
1996
- 1996-05-08 AU AU52130/96A patent/AU695731B2/en not_active Ceased
- 1996-05-13 CA CA002176441A patent/CA2176441C/en not_active Expired - Fee Related
- 1996-06-05 CN CNB961079908A patent/CN100390909C/zh not_active Expired - Fee Related
- 1996-06-12 JP JP15081996A patent/JP3902262B2/ja not_active Expired - Fee Related
- 1996-06-14 TW TW085107131A patent/TW304271B/zh not_active IP Right Cessation
- 1996-06-17 KR KR1019960021752A patent/KR970003883A/ko not_active Withdrawn
- 1996-06-18 DE DE69625548T patent/DE69625548T2/de not_active Expired - Lifetime
- 1996-06-18 ES ES96304532T patent/ES2188723T3/es not_active Expired - Lifetime
- 1996-06-18 AT AT96304532T patent/ATE230516T1/de not_active IP Right Cessation
- 1996-06-18 DK DK96304532T patent/DK0750325T3/da active
- 1996-06-18 EP EP96304532A patent/EP0750325B1/en not_active Expired - Lifetime
- 1996-06-19 NZ NZ286847A patent/NZ286847A/en not_active IP Right Cessation
- 1996-06-19 BR BR9601868A patent/BR9601868A/pt not_active IP Right Cessation
- 1996-06-20 NO NO962618A patent/NO962618L/no not_active Application Discontinuation
- 1996-12-23 US US08/780,060 patent/US6278601B1/en not_active Expired - Lifetime
-
2006
- 2006-08-17 JP JP2006222467A patent/JP4012236B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69625548T2 (de) | 2009-09-17 |
| DE69625548D1 (de) | 2003-02-06 |
| EP0750325A1 (en) | 1996-12-27 |
| JP4012236B2 (ja) | 2007-11-21 |
| DK0750325T3 (da) | 2003-04-22 |
| JP3902262B2 (ja) | 2007-04-04 |
| CA2176441A1 (en) | 1996-12-22 |
| US6278601B1 (en) | 2001-08-21 |
| AU695731B2 (en) | 1998-08-20 |
| TW304271B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1997-05-01 |
| JP2006310892A (ja) | 2006-11-09 |
| BR9601868A (pt) | 1999-01-12 |
| ES2188723T3 (es) | 2003-07-01 |
| AU5213096A (en) | 1997-01-09 |
| KR970003883A (ko) | 1997-01-29 |
| NO962618D0 (no) | 1996-06-20 |
| CN1148723A (zh) | 1997-04-30 |
| CA2176441C (en) | 2000-07-11 |
| CN100390909C (zh) | 2008-05-28 |
| JPH097886A (ja) | 1997-01-10 |
| NO962618L (no) | 1996-12-23 |
| MX9602108A (es) | 1997-09-30 |
| EP0750325B1 (en) | 2003-01-02 |
| ATE230516T1 (de) | 2003-01-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RENW | Renewal (renewal fees accepted) | ||
| RENW | Renewal (renewal fees accepted) | ||
| RENW | Renewal (renewal fees accepted) | ||
| EXPY | Patent expired |