JPS6489501A - Chiplike resin-covered electronic component - Google Patents
Chiplike resin-covered electronic componentInfo
- Publication number
- JPS6489501A JPS6489501A JP24832087A JP24832087A JPS6489501A JP S6489501 A JPS6489501 A JP S6489501A JP 24832087 A JP24832087 A JP 24832087A JP 24832087 A JP24832087 A JP 24832087A JP S6489501 A JPS6489501 A JP S6489501A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin body
- chiplike
- electronic component
- covered electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
Abstract
PURPOSE:To prevent deterioration of electric properties by coating the upper surface of an outer covering resin body with a metal foil. CONSTITUTION:The circumference of a portion of an electrode lead 2 which comes out from a device 4 is press-formed together with the device 4 by using insulating resin for armoring. Then the remaining electrode lead 2 which exposes from the insulating resin body 3 is bended along the resin body 3 to form a chiplike resin-covered electronic component. The upper surface of the resin body 3 is coated with a metal foil 1. Therefore, it is possible to reduce absorption of heat from the resin body 3 at reflow of near or far infrared radiation at packaging to a circuit substrate and to prevent deterioration of electric properties.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24832087A JPS6489501A (en) | 1987-09-30 | 1987-09-30 | Chiplike resin-covered electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24832087A JPS6489501A (en) | 1987-09-30 | 1987-09-30 | Chiplike resin-covered electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6489501A true JPS6489501A (en) | 1989-04-04 |
Family
ID=17176327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24832087A Pending JPS6489501A (en) | 1987-09-30 | 1987-09-30 | Chiplike resin-covered electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6489501A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420745A (en) * | 1991-09-30 | 1995-05-30 | Matsushita Electric Industrial Co., Ltd. | Surface-mount type ceramic capacitor |
EP0750325A1 (en) * | 1995-06-21 | 1996-12-27 | Illinois Tool Works Inc. | Infrared shielded capacitor |
JP2014138083A (en) * | 2013-01-17 | 2014-07-28 | Panasonic Corp | Film capacitor |
-
1987
- 1987-09-30 JP JP24832087A patent/JPS6489501A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420745A (en) * | 1991-09-30 | 1995-05-30 | Matsushita Electric Industrial Co., Ltd. | Surface-mount type ceramic capacitor |
EP0750325A1 (en) * | 1995-06-21 | 1996-12-27 | Illinois Tool Works Inc. | Infrared shielded capacitor |
AU695731B2 (en) * | 1995-06-21 | 1998-08-20 | Illinois Tool Works Inc. | Infrared shield for capacitors |
CN100390909C (en) * | 1995-06-21 | 2008-05-28 | 伊利诺斯工具制造公司 | Infrared shield of capacitor |
JP2014138083A (en) * | 2013-01-17 | 2014-07-28 | Panasonic Corp | Film capacitor |
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