JPS649607A - Chip shaped electronic component and manufacture thereof - Google Patents

Chip shaped electronic component and manufacture thereof

Info

Publication number
JPS649607A
JPS649607A JP62163893A JP16389387A JPS649607A JP S649607 A JPS649607 A JP S649607A JP 62163893 A JP62163893 A JP 62163893A JP 16389387 A JP16389387 A JP 16389387A JP S649607 A JPS649607 A JP S649607A
Authority
JP
Japan
Prior art keywords
electrode layer
resin
metallicon electrode
property
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62163893A
Other languages
Japanese (ja)
Other versions
JPH0754784B2 (en
Inventor
Masanobu Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Electric Co Ltd
Original Assignee
Nissei Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Electric Co Ltd filed Critical Nissei Electric Co Ltd
Priority to JP62163893A priority Critical patent/JPH0754784B2/en
Publication of JPS649607A publication Critical patent/JPS649607A/en
Publication of JPH0754784B2 publication Critical patent/JPH0754784B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To improve moisture resistance, by filling fine holes in a metallicon electrode layer with a resin, and filling the two side of an element, which is arranged at the approximately central part of an insulating sheet member whose length is equal to the length of the element including the metallicon electrode layer, with a resin. CONSTITUTION:A capacitor element 1 is wound around with two sheets of polyethylene terephthalate films, on one surface of which aluminum or zinc is evaporated. After the winding, the device is heated and compressed, and flat shape is formed. After a metallicon electrode layer 5 is formed, heat treatment is performed. The metallicon electrode layer 5 comprises metal, whose components are tin, zinc, lead, antimony and the like. Other than both end surfaces, the layer 5 is surrounded with two upper and lower protector sheets 2 and 4 and an epoxy resin, which has thermosetting property, or ultraviolet setting property or both. The resin is filled on both side parts. Since the metallicon electrode layer is porous, the fine holes are filled with a resin 3 at the time of impregnation. Thus moisture resistance is improved. In order to improve soldering property, the end surfaces are plated 7 as the final step, or an approximately a lateral U shaped outer electrode 6 is attached.
JP62163893A 1987-07-02 1987-07-02 Chip type electronic component and manufacturing method thereof Expired - Fee Related JPH0754784B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62163893A JPH0754784B2 (en) 1987-07-02 1987-07-02 Chip type electronic component and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62163893A JPH0754784B2 (en) 1987-07-02 1987-07-02 Chip type electronic component and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS649607A true JPS649607A (en) 1989-01-12
JPH0754784B2 JPH0754784B2 (en) 1995-06-07

Family

ID=15782807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62163893A Expired - Fee Related JPH0754784B2 (en) 1987-07-02 1987-07-02 Chip type electronic component and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH0754784B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250607A (en) * 1991-01-25 1992-09-07 Taiyo Yuden Co Ltd Chip-shaped electronic parts and their manufacture
JPH05308003A (en) * 1992-03-30 1993-11-19 Taiyo Yuden Co Ltd Method of manufacturing chip type thermistor
US5422614A (en) * 1993-02-26 1995-06-06 Andrew Corporation Radiating coaxial cable for plenum applications
EP0821374A1 (en) * 1996-01-24 1998-01-28 Matsushita Electric Industrial Co., Ltd. Electronic parts and method for manufacturing the same
GB2344222A (en) * 1998-11-27 2000-05-31 Taiyo Yuden Kk An electronic component with a ceramic body and terminals which include a synthetic resin
EP1158550A2 (en) * 2000-05-26 2001-11-28 Epcos Ag Capacitor and its manufacturing method
JP2009515367A (en) * 2005-11-09 2009-04-09 謝 清雄 Manufacturing method of surface mount type precision resistor
CN116741534A (en) * 2023-07-26 2023-09-12 广东微容电子科技有限公司 Chip type multilayer ceramic capacitor and preparation method thereof
CN116884766A (en) * 2023-07-26 2023-10-13 广东微容电子科技有限公司 Chip three-terminal capacitive filter and preparation method thereof
US11894197B2 (en) 2020-11-10 2024-02-06 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250607A (en) * 1991-01-25 1992-09-07 Taiyo Yuden Co Ltd Chip-shaped electronic parts and their manufacture
JPH05308003A (en) * 1992-03-30 1993-11-19 Taiyo Yuden Co Ltd Method of manufacturing chip type thermistor
US5422614A (en) * 1993-02-26 1995-06-06 Andrew Corporation Radiating coaxial cable for plenum applications
EP0821374A1 (en) * 1996-01-24 1998-01-28 Matsushita Electric Industrial Co., Ltd. Electronic parts and method for manufacturing the same
EP0821374A4 (en) * 1996-01-24 1999-09-01 Matsushita Electric Ind Co Ltd Electronic parts and method for manufacturing the same
US6400253B1 (en) 1996-01-24 2002-06-04 Matsushita Electric Industrial Co., Ltd. Electronic component and method of manufacture therefor
US6252481B1 (en) 1998-11-27 2001-06-26 Taiyo Yuden Co. Ltd. Chip type electronic part and method for the manufacture thereof
GB2344222A (en) * 1998-11-27 2000-05-31 Taiyo Yuden Kk An electronic component with a ceramic body and terminals which include a synthetic resin
GB2344222B (en) * 1998-11-27 2003-06-04 Taiyo Yuden Kk Chip type electronic part and method for the manufacture thereof
EP1158550A2 (en) * 2000-05-26 2001-11-28 Epcos Ag Capacitor and its manufacturing method
EP1158550A3 (en) * 2000-05-26 2008-03-12 Epcos Ag Capacitor and its manufacturing method
JP2009515367A (en) * 2005-11-09 2009-04-09 謝 清雄 Manufacturing method of surface mount type precision resistor
US11894197B2 (en) 2020-11-10 2024-02-06 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
CN116741534A (en) * 2023-07-26 2023-09-12 广东微容电子科技有限公司 Chip type multilayer ceramic capacitor and preparation method thereof
CN116884766A (en) * 2023-07-26 2023-10-13 广东微容电子科技有限公司 Chip three-terminal capacitive filter and preparation method thereof

Also Published As

Publication number Publication date
JPH0754784B2 (en) 1995-06-07

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Legal Events

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