JPH0754784B2 - Chip type electronic component and manufacturing method thereof - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component such as a chip capacitor in which an electrode is formed by a metallikon or the like, and a manufacturing method thereof.

(Prior Art) A film capacitor will be described as an example of a chip-type electronic component. As is well known, the conventional chip type capacitor is generally of the mold type as the exterior, but recently, a simple exterior type has been put into practical use in place of this, and the performance such as moisture resistance is further improved. There is a need for research and development into superior products, improvement of mass productivity, and reduction of manufacturing cost.

FIGS. 13 to 15 show a method of manufacturing a conventional chip-type film capacitor that is simply packaged. In this case, the capacitor element is a wound or laminated element a, which is a long insulating sheet member (conventional element). (It is called a porotector sheet)
As shown in FIG. 13, a plurality of them are arranged on the surface b at a predetermined interval, and then a thermosetting resin d such as epoxy is supplied to the gap c between the elements a, and as shown in FIG. The long insulating sheet member e is adhered from above. Then, after the resin is hardened, as shown in FIG.
To form a mother capacitor g. After that, each element a is cut by a rotary blade i to form a chip-type film capacitor. According to such a method, it is possible to form a chip-type film capacitor having a simple exterior by a simple method without using a resin molding die such as a conventional mold type.

(Problems to be Solved by the Invention) However, according to the conventional simple exterior as described above, the individually formed capacitors have the exterior body formed of the insulating sheet members b and e and the thermosetting resin d. Since the metallikon electrode part f is formed later, and the joint part h has a porous metallikon directly formed on the end face of the element as an electrode layer, it has a weak surface in terms of moisture resistance.

On the other hand, in the conventional simple exterior type manufacturing method, from the viewpoint of the manufacturing method, each element a is bonded onto the insulating sheet member b, and the thermosetting resin d is interposed between the elements a and a. Since the method of dripping is adopted, the production efficiency was poor and it was difficult to connect to mass production.

(Object of the present invention) Therefore, the present invention has been made in view of the conventional problems as described above, and a chip-type electronic component that can improve moisture resistance and at the same time improve mass productivity and reduce manufacturing cost, It is an object to provide a manufacturing method thereof.

(Structure of the present invention) In order to achieve the above object, the present invention has a structurally substantially rectangular parallelepiped or flat chip-type electronic component element having electrode layers such as metallikon impregnated with a curable resin such as epoxy at both ends. Is inserted between two rectangular insulating sheet members facing each other substantially in parallel, the length of at least one side of the sheet member is equal to the element length, and the element electrode end surface is approximately at the center of the sheet member. Is located, the space portions on both sides surrounded by the side surface of the element and the sheet member are filled with the resin, and the metallikon electrode is exposed in an arbitrary shape by cutting.

Further, as a manufacturing method, a large number of electronic component elements having an electrode layer such as a metallikon are aligned vertically and horizontally by a transfer device or the like, and the aligned elements have two insulating sheet members of a predetermined size. One of them is attached or a plurality of elements are fixed and aligned on the insulating sheet member by an element mounting device, and the element groups are formed by arranging so that the end faces of electrodes such as metallikon are adjacent to each other. . Next, this element group is housed in an impregnation filling tank having a resin peeling means inside, with the insulating sheet member facing downward.

After that, in a vacuum atmosphere, at least the surface of the element is filled with a resin that has thermosetting, ultraviolet ray curable, or both properties, and then impregnated by pressure, and the other insulating sheet member is attached onto the element. Then, after being hardened by heating, it is cut so that the adjacent electrode layers such as metallikons are exposed, and further, the elements positioned in parallel are cut and separated to obtain individual parts.

An embodiment of the present invention will be described below with reference to FIGS. In addition, Example 1 is a case where a wound element is used, Example 2 is a case where a laminated element is used, and Example 3 is a case where an element mounting device is used.

(Example 1) In the drawings, 1 is a metallized film capacitor element (hereinafter, simply referred to as a capacitor element), 2 is an insulating sheet member on one side to which the capacitor element 1 is adhered, 3 is thermosetting, ultraviolet curable or An epoxy resin having both properties, 4 is the other insulating sheet member, and 5 is a metallikon electrode layer. As shown in FIG. 3, the capacitor element 1 is formed by winding two polyethylene terephthalate films each having a thickness of 1.5 to 2 μm and a width of 4.5 mm and having aluminum or zinc vapor-deposited on one surface thereof, followed by heating and pressing. Flatten,
After forming the metallikon electrode layer 5, heat treatment is performed.

The metallikon electrode layer 5 is made of a metal containing tin, zinc, lead, antimony or the like, and as shown in FIG. 1, except for both end faces, upper and lower insulating sheet members 2 and 4 and both side parts. It is surrounded by an epoxy resin (hereinafter, simply referred to as a resin) 3 having a thermosetting property, an ultraviolet curable property, or both properties. Since the metallikon electrode layer 5 is porous, the resin 3 at the time of impregnation fills and fills the fine pores.

This further improves the moisture resistance. Even in this state, the chip component can sufficiently function, but in order to further improve the solderability, the end face is finally plated, or the external electrode 6 having a substantially U shape as shown in FIG. 2 is formed. May be attached.

Next, the manufacturing method will be described.

First, a large number of flattened capacitor elements 1 as shown in FIG. 3 are reserved in advance in the hopper 7 and the like shown in FIG. Then, a predetermined number of the capacitor elements 1 are supplied onto the transfer device 8 which successively passes under the hopper 7 at a constant speed. In this case, a large number of capacitor elements 1 are a single unaligned block, and when the transfer device 8 operates in the direction of the arrow, they are housed one by one in the recesses 9 that are vertically and horizontally aligned.

When all the capacitor elements 1 are housed in the respective recesses 9, next, the insulating sheet member 2 formed in a quadrangle according to the size of the transfer device 8 is attached to the upper surface of the element as shown in FIG. Stick it on. An adhesive is previously applied to the entire one surface of the insulating sheet member 2. Further, as the insulating sheet member 2, glass fiber reinforced plastic (glass epoxy resin) is effective in terms of heat resistance.
After that, it is confirmed that the adhesion is maintained with an appropriate strength, the adhered capacitor element group is taken out, and the impregnating and filling tank 10 shown in FIG. Put in. The impregnation filling tank 10 has a structure in which a resin is easily peeled off by applying a release agent to the bottom portion 11 and the inner portion of the impregnation filling tank 10 so that the resin can be easily peeled off. To do. Then, the resin 3 is poured into the impregnation filling tank 10. At that time, it is carried out in a vacuum atmosphere, and the amount of the resin to be poured is such that at least the upper surface of the capacitor element 1 is covered, and after pouring a predetermined amount of the resin 3, it is pressurized with an appropriate pressure, whereby the resin 3
Fully penetrates into the element and promotes impregnation. The resin 3 serves both as an impregnation and an exterior. Then, after a predetermined time has passed, after confirming that the impregnation is sufficient, while the resin 3 has a viscosity (in this case, when the resin 3 has ultraviolet curability, it is irradiated with ultraviolet rays to cure the surface). The other insulating sheet member 4 is covered from above as shown in FIG. Then, when the insulating sheet member 4 is pressed evenly with a predetermined pressure, the resin 3 and the insulating sheet member 4 are bonded to each other. When the resin 3 is completely cured by further heating, a plate-shaped component group can be formed. After that,
It is taken out from the impregnation filling tank 10 and, as shown in FIG. 8, is shown in FIG. 9 along a portion (broken line portion in the drawing) 13 in which cutting portions are previously displayed on the insulating sheet member 4 in the vertical and horizontal directions. The rotary blade 14 is used for cutting. When cutting the side of the metallikon electrode layer 5, it is necessary to bring the adjacent metallikon electrode layers 5 closer to each other in advance so that the metallikon electrode layers 5 of the adjacent elements 1 are exposed at the same time. FIG. 9 is an enlarged view of the adjacent metallikon electrode layer 5, in which the electrode end surface 5 becomes a concave curved surface due to the effect of masking on the side surface of the electrode used when performing metallikon. If the thickness t of 14 is thin,
In the state shown in the figure, the end face of the metallikon electrode layer 5 is exposed, and
If the thick rotary blade 14 is used, the electrode shape as shown in FIG. 11 can be selected. On the other hand, the cut display portion is also provided in a portion located approximately in the center between the elements and the side portions of the element, and the cut display is performed at that position. It should be noted that any of the front and rear relations when cutting in the vertical and horizontal directions may be performed first. And the electrode 1
If cut into pieces, the side surface of the metallikon electrode layer is completely surrounded by the resin, and a capacitor having good moisture resistance is completed. Even in this state, the function as a capacitor is not impaired, but in order to further improve the solderability, the metallikon electrode layer end face 5 is plated with solder or the external electrode 6 as shown in FIG. It may be attached. Further, in the conventional one, since the electrode end face is rough after the metallikon electrode is formed, it is necessary to polish or cut the electrode layer end face 5 evenly before the final product. However, according to such a method, these steps are also unnecessary because they are combined with the cutting step, and plating and electrode welding are facilitated.

(Example 2) The element in this case is different from that of the wound type in that a laminated type as shown in FIG. 12 is used. There is no difference with the process. However, in the case of the laminated type, it is necessary to pay attention to the dimensional accuracy, because it is cut from the mother element in the step before forming the individual elements 1. Therefore, if the size of the element 1 is uniform, it is possible to use the transfer sheet 8 and the impregnation filling tank 10 used in the first embodiment without changing the insulating sheet members 2 and 4, and The effect can be obtained.

(Embodiment 3) In each of the above embodiments, the method of using the transfer device for aligning a large number of elements 1 in a predetermined state has been described, but an element mounting device is used as a means other than the transfer device. You may. In this case, the elements are directly adhered to the upper surface of the rectangular insulating sheet member one by one or a large number of them at a time. Thereafter, the element group adhered in the same manner as in the above example is stored in the impregnation filling tank 10, and if the same process is repeated thereafter, an electronic component having the same performance in both a wound type and a laminated type element. Is obtained. In addition, in the said Example, although the case of a metallikon was demonstrated as an electrode layer, another electroconductive material may be applied and it may use together with a metallikon.

(Effect of the present invention) As described above, according to the present invention, structurally, first, the entire element is impregnated so that the fine pores of the metallikon electrode layer are filled with resin, and The two sides of the element, which is arranged approximately in the center of the insulating sheet member including the element length including the elements, are filled with resin, and the resin surrounding the elements including the metallikon electrode layer is cut, so that Metallicon electrodes of various shapes can be obtained.

Therefore, like the conventional one, even if the porous metallikon is directly formed on the element end surface as the electrode layer, by the resin or the insulating sheet member surrounding it,
Sufficient moisture resistance can be secured. Therefore, the moisture resistance is greatly improved as compared with the conventional one.

On the other hand, in manufacturing, a large number of electronic component elements were inserted as an element group between insulating sheet members of a predetermined size by a transfer device or an element mounting device, and a large number of treatments were performed at one time. After that, since it is cut into individual elements, the present invention is mass-produced and processed as compared with the conventional method of adhering the elements on the insulating sheet member one by one and dropping the resin between the elements. Is to be simplified,
As a result, the cost can be greatly reduced. In addition, according to the present invention, since the insulating sheet member uses the glass fiber reinforced plastic, it is possible to form an excellent one in terms of heat resistance. Further, the present invention can be applied to general electronic parts as well as the embodiments relating to the film capacitor, and various design changes can be made within the scope of the technical idea described in the claims. Further, in general, if the electrode layer such as metallikon contains even a small amount of resin, soldering tends to be poor, and the performance tends to be poor, but in the present invention, the exterior also serves as impregnation and solderability and moisture resistance This is due to a new technical idea that is not compatible with the conventional method for manufacturing electronic components and is characterized in that they have compatibility so as not to impair the above. Therefore, it is industrially useful and meaningful.

[Brief description of drawings]

1 to 12 show the present invention, and FIGS. 13 to 15 show the prior art. FIG. 1 is a perspective view showing the external shape of a chip-type electronic component, FIG. 2 is a sectional view showing a state in which external electrodes are attached, FIG. 3 is a perspective view showing a winding element, and FIG. FIG. 5, FIG. 7 and FIG. 7 are sectional views, FIG. 6 and FIG. 8 are perspective views, FIG. 9 is a sectional view showing a method of cutting a series of parts, and FIG. 10 and FIG. 12 is a perspective view showing a laminated element in Example 2, FIGS. 13 and 14 are perspective views showing a manufacturing method, and FIG. 15 is a sectional view of a capacitor. In the figure, 1 is a capacitor element, 2 and 4 are insulating sheet members, 3 is an epoxy resin having a property of both thermosetting and ultraviolet curing or both, 5 is an electrode layer such as metallikon, 6 is an external electrode, 7 Is a hopper, 8 is a transfer device, 9 is a recess provided in the transfer device, 10 is an impregnation filling tank, 11 is a bottom part, 12
Is an inner portion, 13 is a cutting display portion, and 14 is a rotary blade.

Claims (6)

[Claims] 1. Two rectangular insulating sheet members in which substantially rectangular parallelepiped or flat chip-shaped electronic component elements having electrode layers such as metallikon impregnated with a curable resin such as epoxy are opposed in parallel. And a sheet member having at least one side equal to the length of the element, and the element electrode end face located substantially in the center of the sheet member, and both sides surrounded by the side surface of the element and the sheet member. A chip-type electronic component, characterized in that a space portion of the portion is filled with the curable resin and has an electrode whose exposed shape is selected by cutting. 2. A plurality of electronic component elements having an electrode layer such as a metallikon are aligned vertically and horizontally by a transfer device or the like, and one of the two insulating sheet members having a predetermined size is arranged on the aligned elements. Or a plurality of elements are fixedly aligned on the above-mentioned insulating sheet member by an element mounting device and arranged so that the end faces of electrodes such as metallikon are adjacent to each other to form an element group. The group is housed in an impregnation filling tank in which the resin peeling means is released with the insulating sheet member on the lower side, and then a curable resin is injected to at least the element surface in a vacuum atmosphere, and then a vacuum atmosphere By impregnating and filling the element body including the inside of the electrode such as metallikon by pressing the curable resin with a pressure that can at least impregnate, paste the other insulating sheet member on the upper surface of the element group, and heat or purple. A chip characterized by cutting the element group including the insulating sheet member so that the adjacent metallikon electrodes of the element are exposed after being cured by irradiation with rays and further cutting and separating the elements positioned in parallel. Method for manufacturing electronic components. 3. The chip-type electronic component according to claim 2, wherein the electronic component element is a wound-type or laminated-type capacitor element and, if necessary, heat treatment is performed after the metallikon electrode layer is formed. Production method. 4. The method for manufacturing a chip-type electronic component according to claim 2, wherein the insulating sheet member is glass fiber reinforced plastic. 5. The chip-type electronic according to claim 2, wherein the curable resin for impregnating and filling is an epoxy resin having thermosetting, ultraviolet curable, or thermosetting and ultraviolet curable properties. Manufacturing method of parts. 6. A chip-type electronic component according to claim 2, wherein in the case of the metallikon electrode layer, the metal-icon electrode layer is individually cut and separated, and then U-shaped external terminals are attached or the electrode end faces are plated. Manufacturing method.