JPH03208325A - Production of laminated film capacitor - Google Patents

Abstract

PURPOSE:To allow excellent moisture and heat resistance by improving production process so as to impregnate elements with resin after cutting a mother element into the small elements. CONSTITUTION:A capacitor mother element 5 is formed by winding a strip metallized film, outer sheets 2 are firmly fixed to the top and bottom planes and an electrode layer is formed by metallizing. Then, numerous elements 1 are formed by cutting the mother element 5 and are impregnated with softening resin 4 and the impregnating resin 4 is softened. Namely, the impregnating resin 4 permeates into the finely divided small elements 1 from the cut edge planes and the inner part of the small elements 1 is evenly impregnated. Thus, when the impregnating resin 4 is softened, the electrode in the element is completely wrapped and since the whole planes of both cut edge planes are covered with resin simultaneously, moisture and heat resistance are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a laminated film capacitor with a simple packaging and effective for surface mounting.

BACKGROUND OF THE INVENTION As is well known, in recent years electronic devices have become lighter, thinner, and smaller, and as a result, various electronic components have also become smaller and smaller.

The need for parts is increasing. Among electronic components, laminated film capacitors are considered to be difficult to convert into chips, but dielectric films and other new materials have been developed, or structural improvements have been made, making it possible to convert them into chips just like other capacitors. It's coming. In addition, recently, in order to further downsize and reduce costs, many products with simple exteriors have been manufactured that omit the exterior as much as possible. Improvements are desired.

In the case of such a chip-shaped laminated film capacitor with a simple exterior, the manufacturing method is, for example, applying a force /zj- to the upper and lower surfaces of laminated strip-shaped metallized films constituting a pair of opposing electrodes so that they are integrated. After forming a mother element by fixing the sheet and applying metallicon to the electrode side surface of the metallized film layer, the process diagram shown in Fig. 4 is completed.
In the process shown in Figure 1, the mother element is impregnated in a resin tank containing a thermosetting resin, and then the resin adhering to the surface of the mother element is removed, and the impregnated resin is heated and cured. A large number of small elements are formed by cutting at predetermined intervals in the longitudinal direction.

Thereafter, a chip-shaped multilayer film capacitor is manufactured by processing the cut surface and plating the metallicon electrode portion, which has been conventionally done.

1. Problems to be Solved by the Invention] However, in the conventional manufacturing method as described above, resin is impregnated in the step before cutting into small elements, and the mother element is long. Therefore, it was difficult to ensure sufficient moisture resistance and heat resistance.

F. Purpose of the Invention The present invention was made in view of the above problems, and it is an object of the present invention to provide a method for manufacturing a laminated film condenser with excellent moisture resistance and heat resistance by devising the manufacturing process. With the goal.

Means for Solving Problem 1] In order to achieve the above object, the present invention forms a capacitor mother element by winding or laminating strip-shaped metallized films, and the width of the capacitor mother element is the same as that of the capacitor mother element. An exterior sort or the like having a width close to that of 2 is fixed to the upper and lower surfaces of the metallized film layer, and electrode layers are formed by metal spraying on both sides of the element including the exterior. After that, the mother element is cut to form a large number of elements, these elements are impregnated with a curable resin, the resin attached to the outer periphery of the element is removed, and the impregnated resin is cured, The manufacturing method includes a step of applying resin to the entire surface of both cut surfaces, including a part of the electrode layer.

``Function 2: By using the manufacturing method as described above, the impregnating resin permeates through the cut end face of each divided small element or the metallicon part, and the resin is evenly distributed inside each small element. When the impregnated resin hardens, it completely envelops the electrodes within the element and simultaneously covers the entire surface of both cut ends with the resin, improving moisture resistance and heat resistance.

Embodiment C5 of the present invention will be described below based on the drawings.

[Example] Figure 1 shows this 1'! 1 shows a chip-shaped stacked filem content formed by a method of fabrication.

In this figure, a sectional view taken along the line X--X is shown in FIG. In the figure 1-, 1 is a laminated film content element (hereinafter simply referred to as X-element), 2 is an exterior cover, 3 is a sprayed metal layer (metallicon), and 4 is an impregnated resin.

The element 1 has a thickness of 1.5 to 5.0-1 and a width of 45 n+m.
By winding up two strips of metallized film made of polyethylene terephthalate with aluminum vapor-deposited on one side in multiple layers using a winding device, and wrapping an exterior sheet 2 made of glass epoxy resin or the like on the top and bottom surfaces. The laminated mother element 5 shown in FIG. 3 is cut at regular intervals in the longitudinal direction.

Next, the manufacturing process will be explained in detail. In addition,
FIG. 4 shows a book diagram comparing the main manufacturing processes of the present invention and the prior art, and one embodiment will be explained based on this.

First, when winding a metallized film onto a winding drum (not shown) of a winding device, the metallized film is laminated while winding the outer sheet 2 at the beginning and end of the winding of the mother element 5. This exterior sheet 2 has approximately the same dimensions as the metallized film and a thickness of about 0.1 to 0.2 strokes, and is less likely to shrink due to heat. As shown in FIG. 5, sprayed metal layers 3 are formed on both sides of the metallized films laminated in this manner.

The sprayed metal layer 3 is made of a metal containing tin, zinc, lead, etc.1), and the surface of the metal layer may be smoothed by polishing or the like as necessary to improve solderability. .

The long mother elements 5 thus completed are cut according to dimensions corresponding to a predetermined amount of space, as shown in FIG. 6, to form a large number of small elements 1. Next, the large number of small elements 1 are immersed all together in a reduced pressure resin bath 6, as shown in FIG. 7, in order to be impregnated with resin. As the impregnating resin 4, a resin whose main ingredient is epoxy having properties such as thermosetting and ultraviolet curing is used.

After the small elements 1 are immersed in the reduced pressure resin tank 6 for a predetermined time, they are pulled out from the reduced pressure resin tank 6 to remove the resin attached to the surface of each small element 1. Thereafter, the impregnating resin 4 is cured or in a semi-cured state, and a heat-resistant and moisture-resistant thermosetting or ultraviolet curable resin 7 is applied to the entire surface of both cut surfaces. In this case, the coating may be applied so as to cover the entire side surface of the sprayed metal layer 3, or may be applied so that a part of the tip side of the sprayed metal layer 3 is exposed. This basically allows it to function as a chip-shaped capacitor.Furthermore, in order to further improve solderability, both end surfaces of the sprayed metal layer 3 are plated with tin or solder. apply.

In addition, in the examples mentioned above, two single-sided metalized films were used, or double-sided metalized films and raw films were alternately stacked, or double-sided metalized films coated with resin were laminated. Furthermore, in addition to polyethylene terephthalate, polysulfone, polyphenylene sulfite, etc. may be used as the film material, and further improvement in heat resistance can be expected. On the other hand, the exterior sheet is basically fixed to the upper and lower surfaces of the laminated film from the beginning when the mother element is formed, or does not necessarily have to be fixed at the same time. A plastic sheet with reinforcement or just a film may be used. Furthermore, the present invention is not limited to chip-type capacitors, but can also be applied to a method of manufacturing a multilayer film capacitor using lead wires, and various designs can be applied within the scope of the technical idea described in the claims. Some changes are possible.

"Effects of the Invention" As described above, in the method for producing a laminated film capacitor of the present invention, when impregnating an element with resin, the resin impregnates the element after cutting the mother element into small elements, so that the resin permeates from the cut surface as well. It is easy to apply the resin, and compared to conventional methods in which the mother element is impregnated, the resin can be spread throughout the element. In the state of the mother element, the resin mainly permeates through the sprayed metal layer. After the impregnated resin has hardened, the resin is applied to the entire surface of both cut surfaces, including the sides of the sprayed metal layer, resulting in very good moisture resistance.At the same time, the resin applied to both measuring parts allows soldering to the printed wiring board. When doing so, the molten solder does not go around to the sides, and only both end faces can be held, so the solderability is good without being adversely affected by the surface tension that accompanies solder melting and solidification. Therefore, this manufacturing method has the advantage of being extremely convenient for manufacturing high-quality chip-type film capacitors.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a chip-shaped film capacitor manufactured according to an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along the same section - FIG. 4 is a block diagram showing a process comparison between the present invention and the prior art, FIG. 5 is an enlarged perspective view with a portion of the mother element cut away, and FIG. FIG. 7 is a perspective view showing the state in which the same element is cut, and FIG. 7 is a sectional view showing the state in which it is impregnated with resin. In the figure, 1 is a laminated film content element, 2 is an exterior sheet, 3 is a sprayed metal layer, and 4 is an impregnated resin. District 1 Figure 2 Figure 3

Claims (1)

[Claims] A capacitor mother element is formed by winding or laminating strip-shaped metallized films, and an exterior sheet or film having a width that is the same as or close to the width of the capacitor mother element is fixed to the upper and lower surfaces of the metallized film layer. After forming electrode layers on both sides of the element including the exterior sheet etc. by metal spraying, the mother element is cut to form a large number of elements, these elements are impregnated with a curable resin, and then the outer periphery of the element is A laminated film comprising the steps of removing the resin attached to the electrode layer, and applying the resin to the entire surface of both cut surfaces, including a part of the electrode layer, while the impregnated resin is cured or in a semi-cured state. Method of manufacturing capacitors.