JPS59127829A - Chip film capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip-shaped film capacitor that has soldering heat resistance and excellent electrical characteristics.

2. Description of the Related Art Conventional Structures and Problems With the miniaturization of electrical and electronic equipment, high-density mounting of electronic components is being promoted, and chip mounting is one of the effective means for this. Up until now, the only solid dancer that could be made into a chip was the three-piece capacitor, but recently tantalum electrolytic capacitors, aluminum electrolytic capacitors, and even 7-dancers have been made into chips.

Of these, only film capacitors are
response was delayed. The biggest cause of this is the poor heat resistance of the plastic film itself, which is the dielectric material of plastic film capacitors, and immersing it in a solder bath can lead to fatal defects such as deformation of the element, missing capacitance, and short circuits between lead wires. followed one after another. On the other hand, the heat-resistant films currently on the market are too thick, resulting in insufficient capacity and poor electrical properties.
In particular, the m-voltage liquid is too large and too expensive, so it is unsuitable as a dielectric for a capacitor when used alone.

Purpose of the Invention The present invention eliminates the drawbacks of the heat-resistant film itself by using the heat-resistant film only as a base material rather than as a dielectric, and makes full use of its degraded thermal stability. The object of this invention is to provide a chip-shaped film capacitor with excellent electrical properties.

Structure of the Invention In order to achieve the above object, the chip-shaped film capacitor of the present invention is provided by forming a vapor-deposited metal electrode on the entire surface of a heat-resistant plastic film, leaving one end in the same direction.
A thermosetting resin layer is formed on one side of the film, and a heat-resistant thermoplastic resin layer is formed on the other side so that only the vapor-deposited metal electrode portion close to the edge of the film is exposed. Plastic films having electrodes and resin layers are laminated so that the exposed electrode portions of each layer are in opposite directions, and the thermosetting resin layer and the heat-resistant thermoplastic resin layer are overlapped. A molten metal layer is provided on vapor-deposited metal electrodes exposed on both sides.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

First, before explaining embodiments using drawings, a basic explanation of the present invention will be given.

A heat-resistant thermoplastic resin and a thermosetting resin were coated on each side of a heat-resistant film with metal electrodes deposited on both sides, and the films were cut to size and laminated in multiple layers. The electrode is drawn out from the vapor-deposited electrode by metal spraying on both sides. Here, the heat-resistant film refers to a film that does not melt or undergo extreme deformation at 260° C., and specifically refers to plastic films such as Boli-3, Boria-3, and Boria-3-8.

△ Also, the heat-resistant thermoplastic resin has a heat deformation temperature of 170℃ or higher,
In addition, it is a plastic having a dielectric loss tangent of 0.01 or less at I KHz, and specifically, polysulfone, polyester sulfone, polyphenylene fluorine resin, etc. are used. On the other hand, thermosetting resin has a thermal decomposition temperature of 300°C or higher, IK
Materials with a dielectric voltage contact of 0.02 or less at Hz, such as epoxy resin, unsaturated polyester resin, polybutadiene, silicone resin, diallyl phthalate resin, triazine resin, etc. The role of the heat-resistant thermoplastic resin is to improve the performance of the capacitor by taking advantage of its excellent dielectric properties, and also to bond between each layer. - The universally curable resin layer acts as a brake against reductions in withstand voltage and insulation resistance due to creep and flow of the thermoplastic resin under high temperatures such as during solder dipping.

Embodiments of the present invention will be described below with reference to the drawings.

As shown in Figure 1, the heat-resistant film (1) has a width A of 4
Cut out a piece with a length B of 3 sm, and evaporate aluminum on both sides, leaving 0.5 mm from one end on the same side in the width direction, to form electrodes (2) and 1). . Next, as shown in Figure 2, a heat-resistant film (1) is made of thermoplastic resin on the side where the electrode (2) is present.
A thermoplastic resin layer (4) is formed to have a width of 8.5 mm, leaving 0.5 mm so that a part of the electrode (2) adjacent to the end face in the width direction of the -dielectric m(a) is exposed. A thermosetting resin layer (5) is formed in the same manner on the side and completely cured.

Similarly, electrode (i) (3s), thermoplastic resin layer (4s)
, a heat-resistant film (1) formed with a thermosetting resin layer (51)
1 and the heat-resistant film (1) are bonded together so that the thermosetting resin layer (5) on one side and the thermoplastic resin layer (41) on the other side are in contact with each other as shown in FIG. At this time, the storm poles are exposed in the opposite direction for each layer. Also, at this time, the overlapping part between the opposing vapor deposition electrode (3) and the product is 3IIIE in length and 8 days in width. After laminating the films and laminating 100ff! films, press lightly from above and below in the stacking direction to 200 to 240 mm.
Heat at ℃ for 10 minutes. As a result, each layer is completely bonded to each other. 0.3 on both sides in the width direction of the laminated film
Aluminum is thermally sprayed to a thickness of ~0.5 mm, and as shown in Fig.
) and pull out the electrodes (7) from the evaporated electrodes (2'l (3')) facing in opposite directions. Next, as shown in Figure 4, nickel comb leads ( 8)(9)
After welding the elements and sheathing the entire element with commercially available molding resin αO, com leads (8) and (1) protrude from the molding resin 0().
) is bent as shown in FIG. 5 to complete the chip-shaped film capacitor of the present invention. Table 1 shows specific combinations of the heat-resistant film, thermoplastic resin, and thermosetting resin used in the above examples. Further, Table 2 shows the initial characteristics of each combination example and the characteristics after being immersed in a solder bath at 260° C. for 10 seconds. (7) For comparison, the performance of commercially available polyester film capacitors is also listed in Table 2.

Effects of the Invention As described above, according to the present invention, the following effects can be obtained. That is, as can be seen from Tables 1 and 2, the chip-shaped film capacitor of the present invention has a very low dielectric loss tangent compared to commercially available film capacitors, and has a dielectric loss tangent of 26
While commercially available products show a significant decrease in capacity and deterioration of insulation resistance after being immersed in a solder bath for 10 seconds at 0°C, the product of the present invention is a new product with excellent electrical properties, with almost no property deterioration. It is very useful as a chip-shaped film capacitor.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, in which Fig. 1 is a perspective view of a heat-resistant film l with electrodes deposited on both sides, Fig. 2 is a cross-sectional view showing the state of two-layer lamination, and Fig. 3 is a metal spraying film. FIG. 4 is a perspective view showing the state in which the com-lead is welded, and FIG. 5 is a cross-sectional view showing the completed state with exterior packaging. (1) (1')...Heat-resistant film, (2) (2S
(3) (3'l... Vapor deposited electrode, (4) (4) Thermoplastic resin layer, (5) (5) - Thermosetting resin layer, (
6) (71・Electrode, (8) (9)...Comlead, (
1 (1... Molding resin agent Yoshihiro Morimoto (0) 138-

Claims (1)

[Claims] 1. A vapor-deposited metal electrode is formed on the entire surface of the heat-resistant plastic film except for one end in the same direction, and only the vapor-deposited metal electrode portion near the edge of the film is atomized from above. A thermosetting resin layer is formed on one side, and a heat-resistant thermoplastic resin layer is formed on the other side, and the plastic film having the vapor-deposited metal electrode and the resin layer is layered layer by layer on the exposed electrode. A layer of molten gold is deposited on the vapor-deposited metal electrodes exposed on both sides of the laminate in such a way that the thermosetting resin 1 and the heat-resistant thermoplastic resin layer overlap each other. The provided chip-shaped film capacitor 〇2, the chip-shaped film capacitor 〇3 according to claim 1, wherein the heat-resistant plastic film is a film that does not melt or undergo extreme deformation at 260 ° C., the heat-resistant thermoplastic resin The resin of the layer has a heat distortion temperature of 170
℃ or higher, the cystoelectric tangent measured at z is 0.0
Claim 1, which is a heat-resistant thermoplastic resin of 1 or less
Chip-shaped film conductor 'j-0 4 described in section 4, the resin of the thermosetting resin layer is a thermosetting resin with a thermal decomposition temperature of 800 ° C. or more and a dielectric voltage contact at I Kl & of 0.02 or less. Chip-shaped film conductor 1J-0 according to claim 1