JPS61102017A - Capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a capacitor using a double-sided metallized film based on polyphenylene sulfide (hereinafter abbreviated as PP3) film.

BACKGROUND OF THE INVENTION In recent years, in order to reduce the size and weight of electronic devices, demands for miniaturization of electronic devices and components have become increasingly strict. Under these circumstances, in plastic film capacitors, the exterior portion occupies a large proportion of the total component volume, so by simplifying the exterior or eliminating the exterior, it is possible to significantly reduce the size. However, (1) the dielectric film does not have sufficient heat resistance, so it is necessary to firmly and repeatedly fix the element to withstand the high temperatures during component mounting; For conventional plastic film capacitors, an exterior is indispensable because it is necessary to reduce the amount of heat and stabilize the characteristics. In other words, conventional glass film capacitors are widely used because they have excellent characteristics in terms of temperature characteristics, frequency characteristics, and component reliability. Films are used, and these films do not have sufficient heat resistance, so in order to withstand the high temperatures during component mounting, a strong exterior must be applied.
It is necessary to suppress deformation of the element due to heat.Secondly, materials with high moisture absorption such as polyester films can cause significant changes in characteristics due to moisture absorption, and
As the main material, materials such as aluminum evaporated films are used, which scatter due to moisture and cause property deterioration.
Since an exterior for moisture absorption is essential, it is currently not possible to downsize capacitors by simplifying the exterior or eliminating the exterior.

OBJECTS OF THE INVENTION In view of the current situation, it is an object of the present invention to provide a capacitor that can be downsized by simple packaging or no packaging, and that also has the features of a plastic film capacitor.

Structure of the Invention In order to achieve this object, the present invention provides polyphenylene oxide (
A composite film is formed by forming a thin film whose main component is PPO (hereinafter abbreviated as PPO), and when this composite film is wound or laminated, the adhesive force between the facing films across the thin film increases the width of the bonded part. The bottom of the press is molded to give a weight of 90.03 to 3 grams per mm, and a metal material such as aluminum-copper alloy or lead-tin alloy is thermally sprayed on both end surfaces of the laminated composite film before winding. An electrode lead-out portion is formed.

In other words, when a capacitor is simply packaged or has no package in order to make it smaller, conventional plastic or film capacitors deform due to heat shrinkage of the film when exposed to high temperatures during component mounting, resulting in static Significant changes in capacitance occur. Furthermore, if an element is left in a high-temperature, high-humidity atmosphere, the capacitance will initially increase rapidly due to moisture absorption, and then the capacitance will rapidly decrease due to deterioration of the electrodes.

On the other hand, in the capacitor of the present invention, pps exhibits excellent heat resistance as a dielectric material.

By using ppo, it is possible to significantly reduce element deformation due to thermal shrinkage of the film due to high temperatures during component mounting, and to suppress element deformation by fixing the element by adhesion between the films by the coating thin film. This allows it to withstand high temperatures during component mounting, and even if the device is left in high temperature and high humidity, capacitance changes due to electrode deterioration, film moisture absorption, moisture intrusion between films, etc. can be significantly reduced.

Adhesive force between films due to coating thin film [for 0.0
It is necessary to set it as 3-3 grams (per 1u of width of the adhesive part). If the adhesive strength is less than 0.03 g, the adhesion will not be sufficient to suppress element deformation and prevent moisture from entering, so if the adhesive is exposed to high temperatures during component mounting or left in a high-temperature, high-humidity atmosphere. , the change in capacitance becomes large.

Furthermore, if the adhesive strength exceeds 3 grams, it is not preferable because the gas that occurs when self-healing does not escape easily and carbonized portions are formed, which tends to lower the insulation resistance.

Description of examples The following will explain based on Examples and Comparative Examples.

FIG. 1 (m), @) shows the structure of a capacitor according to an embodiment of the present invention. Figure 1 (A) is a laminated type, Figure 1 (B)
is a rolled type. In the figure, 1 is a wound or laminated composite film, 2 is an electrode lead-out part formed by thermally spraying a metal material on both end faces of the composite film 1, and 3 is a lead wire fixed to the electrode lead-out part 2 by welding or the like. It is.

Figure 2) and Φ) show cross sections of composite films used in capacitors according to embodiments of the present invention. FIG. 2(M) shows a composite film coated on both sides, and FIG. 2(B) shows a composite film coated on one side. In the figure, 4 is a PPS film, 5 is a vapor-deposited weather-resistant metal electrode layer, and 6 is a ppo
It is a coated thin film layer.

Table 1 shows the dielectric film materials, dielectric coating thin film materials, composite film structures, and
The element structure and exterior form are shown. In addition,
Regarding the exterior, "no exterior" means one without any exterior, "simple exterior" means a simple exterior to ensure electrical insulation such as the electrode lead-out part, and "Evokiku resin exterior" means one without any exterior. , which is similar to the exterior of conventional capacitors.

Tables 2 and 3 show that the adhesive strength between the base films was 0 for the capacitors of the examples and comparative examples shown in Table 1.
．． The results of tests on characteristic changes during component mounting (capacitance change rate) and initial insulation resistance characteristics are shown using samples with a weight of 0.01 to 6 g. The mounting conditions in Table 2 are solder bath dipping method, solder temperature 260°C, dipping time 10 seconds, delag count once, pre-heating) 90
℃ for 60 seconds, the lead shape of the capacitor element was a self-standing type, and the printed circuit board was made of glass epoxy with a thickness of 1.6B.

Figure 3 (A), @) shows the moisture resistance life of the Conde/l of the Examples and Comparative Examples shown in Table 1, using samples with adhesive strength between base films of 0.01 to 5 grams. The results of the test are shown. The test conditions shown in FIG. 3 are standing at 60° C. and 95% RH.

Table 1 Note) PJCT: Polyethylene Tele7 Talate PG: Polycarbonate Table 2 Note) Δc/c: Capacitance change during component mounting. rate(%)
Table 3 Note) 1) Engineering R, initial insulation resistance characteristic value (geometric mean value) 2) Defective rate: Incidence of pull/pull below the above engineering R value or IXI♂MΩ As is clear from the results, even when the capacitor of the present invention is simply packaged or is not packaged,
It withstands high temperatures during component mounting, maintains stable capacitance even when left in high-temperature atmospheres for long periods of time, and also has the excellent characteristics of metallized film capacitors. This makes it possible to significantly reduce the size of capacitors, which greatly contributes to the miniaturization of electronic devices.

[Brief explanation of the drawing]

Figure 1 (A), CB) is a perspective view showing a capacitor according to an embodiment of the present invention, Figure 2 (M), CB) is a cross-sectional view of a composite film used in the same capacitor, and Figure 3 (
1) and (B) are diagrams showing the moisture resistance life characteristics of containers of Examples of the present invention and Comparative Examples. DESCRIPTION OF SYMBOLS 1... Composite film, 2... Electrode extraction part, 3... Lead wire, 4... PPS
Film, 6...Electrode layer, 6...pp
o Coated thin film layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure

Claims (1)

[Claims] A thin film containing polyphenylene oxide as a main component is formed on one or both sides of a double-sided metallized film in which electrodes made of a metal material such as nickel or nickel alloy are formed on both sides of a polyphenylene sulfide film to form a composite film. A composite film in which the films are wound or laminated and then press-molded so that the adhesive force between the facing films with a thin film in between is 0.03 to 3 grams per 1 mm of the width of the adhesive part, and then wound or laminated. A capacitor characterized in that electrode extension parts are formed on both end faces of the capacitor by spraying a metal material such as an aluminum-copper alloy or a lead-tin alloy.