JPS59127828A - Chip film capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip-shaped film capacitor having soldering heat resistance.

2. Description of the Related Art Conventional Structures and Problems With the miniaturization of electrical and electronic equipment, high-density mounting of electronic components is being promoted, and chip mounting is one of the effective means for this. Until now, ceramic capacitors were the only capacitors that could be made into chips, but recently tantalum electrolytic capacitors and aluminum electrolytic condensers have also been made into chips. Of these, film capacitors were the only ones that were slow to adapt to chips. The biggest cause of this is the poor heat resistance of the plastic film itself, which is the dielectric material of plastic film capacitors, and immersing it in a solder bath can lead to fatal defects such as deformation of the element, missing capacitance, and short circuits between lead wires. followed one after another. On the other hand, the heat-resistant films currently on the market are too thick and lack capacity, have too large electrical properties, especially the dielectric loss tangent, and are too expensive, so they cannot be used alone as dielectrics for capacitors. It's inappropriate.

Purpose of the Invention The present invention eliminates the drawbacks of the heat-resistant film itself by using the heat-resistant film only as a part of the dielectric, and makes full use of its excellent thermal stability. The object of the present invention is to provide a chip film capacitor having excellent electrical characteristics.

Structure of the Invention In order to achieve the above object, the chip-shaped film of the present invention]
Sidensor forms vapor-deposited metal electrodes on the entire surface of the heat-resistant plastic film, leaving different ends on the other surface.
A thermosetting resin layer is formed on one surface and a heat-resistant thermoplastic resin J- is formed on the other surface so that the electrodes are exposed only in different directions from above, and these vapor-deposited metal electrodes and resin layers are formed. A plastic film with a heat-resistant thermoplastic resin layer and a thermosetting resin layer are laminated so that they overlap, and the exposed electrodes on the thermoplastic resin layer side and the exposed electrodes on the thermosetting resin layer side of this laminate are stacked. Each is provided with a molten metal layer.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

First, the basics of the present invention will be explained before explaining the embodiments with reference to the drawings.

A heat-resistant thermoplastic resin and a thermosetting resin are coated on each side of a heat-resistant film with gold@electrodes deposited on both sides from above the gold@electrodes, and the film is cut to size. It has a multi-layered structure, and the electrodes are drawn out from the W1 pole, which is vapor-deposited by spraying gold on both sides. Here, the heat-resistant film refers to a film that does not melt or undergo extreme deformation at 260°C, and specifically refers to plastic films such as polyimide, polyamide, and polyamideimide. Heat-resistant thermoplastic resins are plastics with a heat distortion temperature of 170°C or higher and a dielectric loss tangent of 0.01 or less at IK1-1z, and specifically include polysulfone, polyethersulfone, SYK fluorine resin, etc. On the other hand, thermosetting resin has a thermal decomposition temperature of 300°C.
The above-mentioned materials have a dielectric loss tangent of 0.02 or less at IK±, and include phosphor resins, unsaturated polyester resins, polybutadienes, silicone resins, diallyl phthalate resins, triazide resins, and the like.

The role of the heat-resistant thermoplastic resin is to improve the performance of the capacitor by taking advantage of its excellent dielectric properties, and also to bond between each layer. The universally curable resin J acts as a brake against a drop in voltage due to creep or flow of the thermoplastic resin at high temperatures such as during solder dipping.

Embodiments of the present invention will be described below with reference to the drawings.

As shown in Figure 1, the heat-resistant film (1) has a width A of 4
Cut out the length B so that there are 3 stitches, and deposit aluminum on the entire surface, leaving 1.0mm on each side from the different ends in the width direction, to form one electrode (21 (31). Next, as shown in Figure 2, a thermoplastic resin is used on the side where the electrode (2) is present to make the heat resistant film (1) have a width of 8I+Im, leaving 0.5 mm from both ends in the width direction. A thermoplastic resin layer (4) is formed, and on the other hand, a thermosetting resin layer (5) is formed in the same way on the electrode (3) side and completely cured. Similarly, electrode +2) (3), As shown in FIG. 2, the heat-resistant film (1') on which the thermoplastic resin layer (4'l, thermosetting resin layer (5) is formed) and the heat-resistant film (1) are heat-cured by -10,000. The thermoplastic resin layer (5) and the other thermoplastic resin layer are pasted together so that they are in contact with each other. At this time, the overlapping part of the opposing vapor deposition electrodes (3) and (2) has a length of 87mm and a width of 2mm. Hereafter, films were laminated one after another in the same manner, and after laminating 1007- films, 200-24 films were laminated while lightly pressing from above and below in the stacking direction.
Heat at 0°C for 10 minutes. As a result, each layer is bonded to the base metal. 0 on both sides of the laminated film in the width direction
．． Aluminum was thermally sprayed to a thickness of 3 to 0.51 IIm, and the third
As shown in the figure and Fig. 4, the vapor deposition electrode (2), f21
... from the electrode (7) to the vapor deposition electrode (3).

(3) Each of the electric currents Fii (6'l and (7
)Made of nickel]Mreeds (8) and (9) are respectively welded, and the entire element is molded with a commercially available molded resin (1 (after being packaged with islands, protruding from molded resin 01))Mreeds (8) and (9) are welded to the sixth The chip-shaped film capacitor of the present invention is completed by bending as shown in the figure.Specific combinations of the heat-resistant film, heat r3.1 plastic resin, and thermosetting resin used in the following two examples. are shown in Table 1.The initial characteristics of each combination example and the characteristics after being immersed in oil for 10 seconds in a solder bath at 260°C are shown in Table 2.For comparison, commercially available polyester films, Second is the performance of the capacitor.
Also listed in the table.

Effects of the Invention As described above, according to the present invention, the following effects can be obtained (7). That is, as can be seen from Tables 1 and 2, the chip-shaped film capacitor of the present invention has excellent electrical properties comparable to or better than commercially available film capacitors.
Moreover, while commercially available products show a significant decrease in capacity and deterioration of insulation resistance after being immersed in a solder bath for 10 seconds at 260°C, the product of the present invention has excellent electrical properties, with almost no property deterioration. This is extremely useful as a new chip-type film capacitor.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention. Fig. 1 is a perspective view of a heat-resistant film with electrodes deposited on both sides, Fig. 2 is a cross-sectional view showing the state of lamination, and Fig. 3 is a metal sprayed film. FIG. 4 is a perspective view of the same, FIG. 5 is a perspective view of the com lead welded together, and FIG. 6 is a cross-sectional view of the completed state with the exterior packaged. (1)(1)...Heat-resistant film, (2)(2')(
3) (3')... Vapor deposited electrode, (4) (4) Thermoplastic resin layer, (5) Product Thermosetting resin layer, (6) (7)...
・Electrode, (8)(9)... Comlead, (10...
・Molded resin Figure 1 Figure 4 Figure 5

Claims (1)

[Claims] 1. Vapor-deposited metal electrodes are formed on the entire surface of the heat-resistant plastic film, leaving different ends, and one surface is formed so that the electrodes are exposed only in different directions from above. On one side, a thermosetting resin layer is formed, and on the other side, a heat-resistant thermoplastic resin layer is formed. Chip-shaped film capacitor-02, heat resistant, which is laminated so as to overlap, and a molten metal layer is provided on each of the exposed electrodes on the thermoplastic resin layer side and the exposed electrodes on the thermosetting resin layer side of this laminate. Chip-shaped film capacitor 08 according to claim 1, wherein the plastic film is a film that does not melt or undergo extreme deformation at 260°C, and the resin of the heat-resistant thermoplastic resin layer has a heat distortion temperature of 170°C.
The dielectric loss tangent measured at ℃ or above and I KHz is 0.0
Claim 1, which is a heat-resistant thermoplastic resin of 1 or less
The chip-shaped film capacitor described in Section 1. 4. The chip-shaped film capacitor according to claim 1, wherein the resin of the thermosetting resin layer is a thermosetting resin having a thermal decomposition temperature of 800° C. or more and a dielectric loss tangent of 0.02 or less at IKHz. .