JPS60148107A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional configuration and its problems Conventional so-called leadless electronic components of this type, and! For example, a chip-type aluminum electrolytic capacitor was constructed as shown in FIG. That is, an anode foil formed by roughening an aluminum foil and further forming a dielectric oxidation degree of all by anodizing, and a cathode foil formed by roughening an aluminum foil are wound through a separator and impregnated with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the open end is sealed with an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. The lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically connected to the comb-shaped terminal 6 by a method such as welding.

After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 6, resulting in a completed product.

When mounting such chip-type aluminum electrolytic capacitors on a printed circuit board, in order to have soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied, but generally molded resin exteriors are pressurized at a pressure of 10 kg/J for about 6 minutes at a temperature of 100°C to 160°C. Under these conditions, the driving electrolyte of the electrolytic capacitor evaporates, resulting in deterioration of characteristics such as a decrease in capacitance and an increase in -δ.Also, since the capacitor is covered with a molded resin exterior6, it becomes extremely expensive. It had the problem of becoming. Furthermore, since it is a horizontal type, when mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECTS OF THE INVENTION The present invention eliminates such conventional drawbacks, and aims to provide an inexpensive vertical type leadless electrolytic capacitor with no inferior characteristics, particularly excellent heat resistance. It is.

Structure of the Invention In order to achieve this object, the present invention provides an electronic component body whose surface is coated with a powder resin, and an end face of the electronic component body from which lead wires are drawn out. an insulating plate disposed so as to be in contact with the insulating plate and having a through hole through which the lead wire passes, and a recess connected to the through hole is provided on the outer surface of the insulating plate,
Further, the tip of the lead wire passing through the through hole is bent so as to fit within the recess.

With this configuration, since a resin coating layer is formed on the outermost layer, heat from the outside is difficult to be transmitted to the internal elements, and the heat resistance is improved.

Furthermore, since it is a vertical type leadless electronic component without a molded exterior, it is possible to provide a leadless electronic component that occupies a small area on a printed circuit board when mounted at low cost.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings regarding an aluminum electrolytic capacitor.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, an IJ-domain wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

A sealing member 7 having a two-layer structure of an elastic body 7m and an inelastic body 7b is attached to the open end of the metal case 2, and the opening of the metal case 2 is sealed by drawing. There is. The outer surface of the metal case 2 is coated with a resin coating layer 9 made of powdered resin.

The lead wire 4 connected to the capacitor element 1 passes through the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end face of the electrolytic capacitor main body from which the lead wire 4 is drawn out, and this insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes.

Further, a recess 8b connected to the through hole 8a is provided on the outer surface of the insulating plate 8, and the tip 4a of the lead wire 4 passing through the through hole 5at is bent so as to fit into the recess 8b. There is.

In this case, as shown in Fig. 4 f2L) and (b), even if the round bar lead wire 4 has been bent with the tip 4tLJ/C flattened, the round bar lead wire 4 remains as it is. It may be.

Next, the resin coating layer 9 on the outer surface of the metal case 2 will be explained.

A fluidized dipping method was used for resin coating. The fluidized dipping method has a structure as shown in Figure 6, and powder resin 1
0 is placed in a tank 11 and then brought into a fluidized state by air passing through a permeable membrane 12 from below, and vibration is applied to the tank 11 to disperse the air flow throughout and smooth the resin surface.

Coating is carried out by heating the electronic component body to be coated to approximately 100°C, immersing the heated electronic component body in flowing powder resin 10 and bringing it into contact with the powder.
0f! : Melt and make sticky. Then, the electronic component body was heated again to about 100° C. to melt and harden the adhesive powder resin 10, and the electronic component body was left to stand at 96° C. for 60 minutes as post-curing.

As a result, a uniform resin coating layer 9 of 0.1 ml to 0-15 mm was obtained. As the powder resin 10, an epoxy resin having a particle size of about 60 μm was used.

The heat insulation effect of the resin coating layer 9 is shown in Fig. 6(a).
As shown in FIG. 2, an electronic component 14 is placed on a hot plate 13 having a heater 13a, and the temperature inside the electronic component 14 is measured using a thermocouple 1.
6. As a result, a warming trend was observed as shown in FIG. 6(b). The rating of the electronic component 14 that was actually measured was 4V2.
At 20 μF, the outer diameter is 6.3φ×6711, and the resin coating thickness is 0.1 mm to 0.15 mm. As is clear from the figure, there is a large difference in the gradient of temperature rise, and even at the final temperature there is a temperature reduction effect of about 40°C. It is obvious that a further temperature reduction effect can be expected by increasing the resin thickness.

Furthermore, coating methods are not limited to the fluidized dipping method described above, but include cloud coating methods,
Methods such as an electrostatic gun method are also possible.

In these electrostatic methods, since resin particles uniformly adhere to the outer surface of the metal, it was necessary to mask the lead wire portion.

Effects of the Invention As described above, according to the present invention, an inexpensive vertical leadless electronic component can be manufactured easily because no mold exterior is used. This has the effect of producing electronic components with excellent heat resistance.

Fig. 6 is a structural diagram of the fluidized immersion device;
FIG. 6 (8L) is an explanatory diagram showing a method for evaluating the heat insulation effect, and FIG. 6 (b) is a characteristic diagram showing data on the heat insulation effect.

1...Capacitor element, 2...Metal case, 3...Sealing rubber, 4...Lead wire, 6...Comm-shaped terminal , 6...Mold resin, 7...Sealing member, 8a...Through hole, 8b...Recessed portion, 9...Resin coating layer.

Name of agent: Patent attorney Toshio Nakao (1 person)
1 Shout (Q) (J+ Male 2 ■ Figure 3 No. 4 @ ((Zl /A)

Claims (3)

[Claims] (1) The electronic component body is constructed by housing all the component elements in a case, and the lead wires connected to the component elements are drawn out from the same end face and coated with resin, and the lead wires of this electronic component body are an insulating plate provided with a negative through hole disposed so as to come into contact with the drawn-out end surface and through which the lead wire passes; a recess connected to the through hole is provided on the outer surface of the insulating plate; An electronic component characterized in that the entire tip of a lead wire passing through the recess is housed in the recess. (2) Claim 1, characterized in that the surface of the electronic component body is coated with a powder resin.
Electronic components listed in section. (3) The electronic component according to claim 1, wherein the electronic component main body is an electrolytic capacitor.