JPH01223713A - Manufacture of chip type film capacitor - Google Patents
Manufacture of chip type film capacitorInfo
- Publication number
- JPH01223713A JPH01223713A JP4923788A JP4923788A JPH01223713A JP H01223713 A JPH01223713 A JP H01223713A JP 4923788 A JP4923788 A JP 4923788A JP 4923788 A JP4923788 A JP 4923788A JP H01223713 A JPH01223713 A JP H01223713A
- Authority
- JP
- Japan
- Prior art keywords
- viscosity
- capacitor
- metallicon
- resin
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract 2
- 238000004804 winding Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 125000006850 spacer group Chemical group 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 6
- 239000002985 plastic film Substances 0.000 claims description 4
- 229920006255 plastic film Polymers 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000013007 heat curing Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000004593 Epoxy Substances 0.000 abstract description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000007493 shaping process Methods 0.000 abstract 1
- 229920000134 Metallised film Polymers 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 235000007688 Lycopersicon esculentum Nutrition 0.000 description 1
- 240000003768 Solanum lycopersicum Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 235000008960 ketchup Nutrition 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 235000010746 mayonnaise Nutrition 0.000 description 1
- 239000008268 mayonnaise Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はチップ形フィルムコンデンサの製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a chip-type film capacitor.
従来の技術
近年、電子機器は多機能化、小形化に対する取組が盛ん
で、これに用いられる電子部品は軽薄短小化になってき
た。その代表的なのが電子部品のチップ化である。2. Description of the Related Art In recent years, efforts have been made to make electronic devices more multifunctional and smaller, and the electronic components used in these devices have become lighter, thinner, shorter and smaller. A typical example of this is the conversion of electronic components into chips.
チップ形コンデンサの中でもチップ形フイルムコンデン
サは、チップ形タンタル電解コンデンサやチップ形セラ
ミックコンデンサに比べて体積、投影面積的にも大きい
のが現状である。すなわち、チップ形フィルムコンデン
サは厚さ１．５〜３μｍの金属化プラスチックフィルム
一対を直径６０（ｂｎφの円ドラムに数１００回程度巻
回しスペーサを介してさらにその上に数１００回程度巻
回し、これを繰返して複数層形成して両端面にメタリコ
ンを施した後に熱処理して半円状に予備切断し、その後
所定の寸法に切断し、面実装工法に適合させるためメタ
リコン部にリードフレームを溶接し、形状、寸法精度を
高めるために外装方式として、トランスファー成型（射
出成型）などのモールド成型を行ってチップ形フィルム
コンデンサを製造している。Among chip-type capacitors, chip-type film capacitors currently have a larger volume and projected area than chip-type tantalum electrolytic capacitors and chip-type ceramic capacitors. In other words, a chip-type film capacitor is made by winding a pair of metallized plastic films with a thickness of 1.5 to 3 μm around a circular drum with a diameter of 60 mm (bnφ) several hundred times, and then winding the film several hundred times on top of the drum through a spacer. This process is repeated to form multiple layers, metallized on both end faces, heat treated and pre-cut into semicircular shapes, then cut to predetermined dimensions, and a lead frame is welded to the metallized part to make it suitable for surface mount construction. However, in order to improve shape and dimensional accuracy, chip-type film capacitors are manufactured using molding such as transfer molding (injection molding) as an exterior packaging method.
発明が解決しようとする問題点
しかしながら、トランスファー成型などのモールド成゛
型は外装厚みが０．５Ｒ以上を必要とし、誘電体フィル
ム厚を薄くしても外装厚み比率が大きくなり、他のチッ
プ形コンデンサに比べて太き（小形化の弊害となり、ま
たリードフレームなどの外部引出し電極を溶接するため
の溶接機や成型機などの設備投資金額も高（、外装厚を
薄（する程成型時の圧力により内部素子の流出などによ
り歩留が著しく低下し、コスト高になるなどの欠点があ
った。Problems to be Solved by the Invention However, mold forming methods such as transfer molding require an exterior thickness of 0.5R or more, and even if the dielectric film thickness is thinned, the exterior thickness ratio increases, making it difficult to use other chip shapes. Compared to capacitors, they are thicker than capacitors (which is a drawback to miniaturization, and require a high investment in equipment such as welding machines and molding machines for welding external lead electrodes such as lead frames). There were drawbacks such as a significant decrease in yield due to internal elements flowing out due to pressure, and increased costs.
問題点を解決するための手段
本発明は前記の欠点を除去したチップ形フィルムコンデ
ンサの製造方法を提供しようとするもので・、以下に示
す工程順序により製造する。Means for Solving the Problems The present invention aims to provide a method for manufacturing a chip-type film capacitor that eliminates the above-mentioned drawbacks, and is manufactured by the following process sequence.
（イ）ドラムに一対の金属化プラスチックフィルムを所
定の回数巻回し、スペーサを介して複数層の巻回物を形
成する巻回工程と、
（＋１）前記複数層巻回動の両端に金属材料を溶射し、
電極引出しメタリコン部を形成するメタリコン工程と、
（ハ）所定温度で熱処理する工程と、
（ニ）複数個に予備切断する工程と、
（ネ）所定の静電容量のコンデンサ素子を形成するため
の切断工程と、
（へ）前記コンデンサ素子複数個を該コンデンサ素子の
メタリコン側の幅と同一幅の片面離型処理した帯状の基
材入熱硬化性樹脂プリプレグシートからなる外装用シー
ト上に、等間隔に間隙部を設けて連続して配置し、該間
隙部に粘性比２〜７の粘液状熱硬化性樹脂を定量供給し
、その上に前記外装用シートと同一の外装用シートを載
置し、所定寸法に加圧・加熱硬化処理して帯状の硬化物
を形成する工程と、
（））前記帯状の硬化物を該硬化物より広幅のスペーサ
を介して複数段積重ねた後、両端面に半田を溶射して外
部電極引出しメタリコン部を形成するメタリコン工程と
、
（チ）前記外部電極引出しメタリコン部を低粘度液状熱
硬化性樹脂で含浸・熱硬化処理する工程と、（す）前記
外部電極引出しメタリコン部を研磨する工程と、
（ヌ）前記研磨した外部電極引出しメタリコン部をメツ
キする工程と、
（ル）前記コンデンサ素子相互の間隙部に介在した樹脂
部を切断分割する工程、
とを備えたチップ形フィルムコンデンサの製造方法で、
外装厚さを薄くするためにコンデンサ素子は一対の基材
入熱硬化性樹脂プリプレグシートよりなる外装用シート
に介在して、シート外装し接着性と耐湿性を向上せしめ
、かつコンデンサ素子は耐湿性を一層向上せしめるため
に粘度２００〜４００ＣＰＳ、低表面張力２０〜３０ダ
インの低粘度液状熱硬化性樹脂で処理を行う。そしてコ
ンデンサ素子相互間には粘性比２〜７の粘液状の熱硬化
性樹脂を用いて前記外装用シートに接着せしめる。粘性
比を２〜７にすることにより、硬化時の温度上昇に伴う
樹脂粘度の低下による流出が防止できる。(b) A winding step of winding a pair of metallized plastic films around a drum a predetermined number of times to form a multi-layer wound product through a spacer; (+1) A metal material is attached to both ends of the multi-layer winding motion. sprayed,
(c) a process of heat treatment at a predetermined temperature; (d) a process of preliminary cutting into multiple pieces; and (v) a process of forming a capacitor element with a predetermined capacitance. cutting step, (f) placing a plurality of the capacitor elements on an exterior sheet made of a heat-curing resin prepreg sheet as a base material in the form of a strip that has been subjected to mold release treatment on one side and having the same width as the width of the metallicon side of the capacitor element; Arranged continuously with gaps provided at intervals, a fixed amount of viscous thermosetting resin having a viscosity ratio of 2 to 7 is supplied to the gaps, and the same exterior sheet as the above exterior sheet is placed on top of it. ()) After stacking the strip-shaped cured product in multiple stages via spacers wider than the cured product, both end faces are formed. (h) a step of impregnating and thermosetting the external electrode lead-out metal contact portion with a low-viscosity liquid thermosetting resin; a step of polishing the electrode lead-out metal contact portion; (v) a step of plating the polished external electrode lead-out metal contact portion; and (l) a step of cutting and dividing the resin portion interposed in the gap between the capacitor elements. A method for manufacturing chip-type film capacitors with
In order to reduce the thickness of the exterior, the capacitor element is placed between a pair of exterior sheets made of heat-curing resin prepreg sheets as a base material, and the sheet exterior is used to improve adhesion and moisture resistance, and the capacitor element is moisture resistant. In order to further improve this, treatment is performed with a low viscosity liquid thermosetting resin having a viscosity of 200 to 400 CPS and a low surface tension of 20 to 30 dynes. A sticky thermosetting resin having a viscosity ratio of 2 to 7 is used between the capacitor elements to adhere them to the exterior sheet. By setting the viscosity ratio to 2 to 7, it is possible to prevent outflow due to a decrease in resin viscosity due to a rise in temperature during curing.
また設備としては、熱硬化性樹脂注入機、該樹脂硬化ラ
インおよび切断機のみ必要とし、外装工程は連続化が可
能である。Further, as equipment, only a thermosetting resin injection machine, the resin curing line, and a cutting machine are required, and the exterior process can be made continuous.
実施例
以下、本発明のチップ形フィルムコンデンサの製造方法
を一実施例について説明する。EXAMPLE Hereinafter, one example of the method for manufacturing a chip-type film capacitor of the present invention will be described.
第２図に示すように直径６００ ｔｍφの円ドラム１を
巻芯としてこれに２５μｍ厚のポリエチレンテレフタレ
ートフィルムを所定数巻回してスペーサ２ａを形成し、
このスペーサ２ａの外周にアルミニウムを蒸着電極とす
る厚さ１．５〜３μｍの金属化ポリエチレンテレフタレ
ートフィルム（以下ＭＰＥＴフィルムという）または金
属化ポリフェニレンスルフィドフィルム（以下ＭＰＰＳ
フィルムという）を一対重合せて５００回巻回して第１
Ｎ ３ ａを形成し、この第１層３ａの外周に前記と
同様にスペーサ２ｂの外周に前記と同様にＭＰＥＴフィ
ルムまたはＭＰＰＳフィルムを一対重合せて前記第１層
３ａと同一の静電容量が得られるように例えば４９６回
巻回して第２層３ｂを形成し、この第２層３ｂの外周に
前記と同様にスペーサ２ｃを形成し、このスペーサ２ｃ
の外周に前記と同様にＭＰＥＴフィルムまたはＭＰＰＳ
フィルムを一対重合せて前記第１層３ａと同一の静電容
量が得られるように例えば４９２回巻回して第３層３ｃ
を形成し、この第３層３ｃの外周に前記と同様にスペー
サ２ｄを形成して３層巻回物３を形成する。そしてこの
３層巻回物３の両端に亜鉛または亜鉛と半田を溶射して
０．２ｉｎ厚程度の電極引出しメタリコン部４を形成す
る。その後１７０℃程度（１６０〜１８０℃の範囲が好
ましい）温度で約２時間（１〜３時間でもよい）熱処理
を行い、熱処理終了後、前記３層巻回物３を円ドラム１
より取外して第３図に示すように先ず半円状に２分割切
断し、その後、例えば３ａ幅に細分割して所定の静電容
量のコンデンサ素子５を多数個製作する。そして第４図
に示すように前記コンデンサ素子５のメタリコン側の幅
と同一幅の片面離型処理を施した０、２ｍｍ厚（０，１
〜０．３ ｔ＊厚が好ましい）のガラス基材エポキシプ
リプレグシートまたはポリイミドフィルム、ポリフェニ
レンスルフィドフィルムなどの耐熱性フィルム基材エポ
キシプリプレグシートなどの帯状の外装用シート６ａ上
に前記コンデンサ素子５を等間隔に間隙部７を設けて連
続して配置し、第５図に示すように前記間隙部７に粘性
比４．５（粘性比２〜７の範囲が好ましい）の液状エポ
キシ樹脂８を定量供給し、第６図に示すようにその上に
前記外装用シー）６ａと同一材質の帯状の外装用シー）
６ｂを載置し、約８０℃の温度で約１時間加熱・加圧し
て所定寸法に硬化せしめて、シート外装した帯状の硬化
物９を形成する。このようにして形成された帯状の硬化
物９は第７図に示すように該硬化物９より広幅の約５０
μｍ厚のポリエチレンテレフタレートフィルムなどのス
ペーサ１０を介して複数段積重ね（第７図では３段積）
、第８図に示すように両端面に融点３００℃以上の高融
点半田（錫５％人）を溶射して肉厚０．４〜０．６ｍ
（肉厚０．１〜１ｆｉの範囲であればよい）の外部電極
引出しメタリコン部１１を形成する。そしてこの外部電
極引出しメタリコン部１１を粘度２００〜５００ｃｐｓ
、低表面張力２０〜３０ダインの粘性比１の液状エポキ
シ樹脂を１０〜３０ｍＨｇで３分間含浸した後、約１２
０°Ｃの温度で約２時間加熱して硬化させる。その後前
記外部電極引出しメタリコン部１１を前記スペーサ１０
の端部まて研摩する。前記外部電極引出しメタリコン部
１１の面は微細多孔性で前記含浸・熱硬化処理した樹脂
で半田付性が悪いために錫、ニッケルなどによる無電解
メツキまたは融点１８０℃の半田（錫４０％人）に浸漬
メツキを施してメツキ層１２を設け、その後第９図に示
すように前記コンデンサ素子５相互の間隙部７に介在し
、熱硬化された樹脂８の部分（−点鎖線で示す部分）を
例えば３．５ａ幅に切断分割１３シて第１図に示すチッ
プ形フィルムコンデンサ１４を多数個製作する。As shown in FIG. 2, a circular drum 1 with a diameter of 600 tmφ is used as a winding core, and a predetermined number of 25 μm thick polyethylene terephthalate films are wound around it to form a spacer 2a.
A metalized polyethylene terephthalate film (hereinafter referred to as MPET film) or a metalized polyphenylene sulfide film (hereinafter referred to as MPPS) with a thickness of 1.5 to 3 μm with aluminum as a vapor-deposited electrode is placed on the outer periphery of the spacer 2a.
A pair of films) are superimposed and wound 500 times to form the
N 3 a is formed on the outer periphery of the first layer 3a, and a pair of MPET films or MPPS films are superimposed on the outer periphery of the spacer 2b in the same manner as described above, so that the same capacitance as that of the first layer 3a is obtained. The second layer 3b is formed by winding the second layer 3b, for example, 496 times, and the spacer 2c is formed on the outer periphery of the second layer 3b in the same manner as described above.
MPET film or MPPS is placed on the outer periphery of the
A pair of films are superimposed and wound, for example, 492 times to obtain the same capacitance as the first layer 3a, thereby forming the third layer 3c.
A spacer 2d is formed on the outer periphery of the third layer 3c in the same manner as described above, thereby forming a three-layer wound product 3. Then, zinc or zinc and solder is thermally sprayed onto both ends of the three-layer winding 3 to form an electrode lead-out metallic contact portion 4 having a thickness of about 0.2 inches. Thereafter, heat treatment is performed at a temperature of about 170°C (preferably in the range of 160 to 180°C) for about 2 hours (1 to 3 hours is also acceptable).
As shown in FIG. 3, it is first removed and cut into two semicircular parts, and then finely divided into, for example, 3a width to produce a large number of capacitor elements 5 having a predetermined capacitance. As shown in FIG. 4, the capacitor element 5 has a thickness of 0.2 mm (0.1
The capacitor element 5 is placed on a band-shaped exterior sheet 6a such as a glass base epoxy prepreg sheet or a heat resistant film base epoxy prepreg sheet such as a polyimide film or polyphenylene sulfide film (preferably 0.3 t* thickness). A liquid epoxy resin 8 having a viscosity ratio of 4.5 (preferably a viscosity ratio of 2 to 7) is supplied in a fixed amount to the gap 7, as shown in FIG. 5. Then, as shown in FIG. 6, a band-shaped exterior sheath made of the same material as the exterior sheath 6a) is placed thereon.
6b is placed and heated and pressurized at a temperature of about 80° C. for about 1 hour to harden it to a predetermined size, thereby forming a band-shaped cured product 9 covered with a sheet. The band-shaped cured product 9 thus formed is about 50 mm wider than the cured product 9, as shown in FIG.
Stacked in multiple stages (three stages in Figure 7) via spacers 10 such as μm-thick polyethylene terephthalate film.
, as shown in Figure 8, high melting point solder (5% tin) with a melting point of 300°C or higher is sprayed on both end faces to a thickness of 0.4 to 0.6 m.
An external electrode lead-out metallic contact portion 11 (the thickness may be in the range of 0.1 to 1 fi) is formed. The external electrode lead metallic contact portion 11 has a viscosity of 200 to 500 cps.
, after impregnating a liquid epoxy resin with a viscosity ratio of 1 with a low surface tension of 20 to 30 dynes at 10 to 30 mHg for 3 minutes, about 12
Heat and cure at a temperature of 0°C for about 2 hours. After that, the external electrode lead metal contact portion 11 is attached to the spacer 10.
Polish the edges. The surface of the external electrode lead-out metallic contact portion 11 is microporous and has poor solderability due to the impregnated and thermoset resin, so it is electroless plated with tin, nickel, etc. or soldered with a melting point of 180° C. (40% tin). A plating layer 12 is provided by dip plating, and then, as shown in FIG. 9, a portion of the thermoset resin 8 (indicated by a dashed line) that is interposed in the gap 7 between the capacitor elements 5 is removed. For example, a large number of chip-type film capacitors 14 shown in FIG. 1 are manufactured by cutting 13 pieces into a width of 3.5 mm.
前述の実施例においては、ＭＰＥＴフィルムまたはＭＰ
ＰＳフィルムを用いたが、他の金属化プラスチックフィ
ルムを用いてもよく、また３層巻回物で示したが、４層
以上の巻回物であってもよい。In the above embodiments, MPET film or MP
Although PS film was used, other metallized plastic films may be used, and although a three-layer winding is shown, a winding of four or more layers may be used.
また前述の実施例においては、エポキシ樹脂を用いたが
、ポリエステル樹脂、ウレタン樹脂などの熱硬化性樹脂
を用いてもよい。またドラムの形状も円形に限定するも
のではない。Further, in the above embodiments, epoxy resin was used, but thermosetting resins such as polyester resin and urethane resin may also be used. Furthermore, the shape of the drum is not limited to a circular shape.
次に粘性比について説明すると、粘性比は材料の流動性
を表し、液体に振動を加えると流動性の液体となり、振
動をとめるとゼリー状に固化する現象をチクソトロピー
（１ｚ変）という言葉で表し、この程度を粘性比率（粘
度測定する場合、粘度計の回転数を２ｒｐｍと２Ｏｒｐ
ｍで測定し、２ｒｐｍ／２０ｒｐｍの比率計算した値）
で示し、比率の高いもの程チクソトロピーツクであり、
塗料の場合（例えば外装用樹脂など）は前記比率が高い
程、垂れどめ効果があることを意味する。例えば、トマ
トケチャツプ、マヨネーズなどはチクソトロピーで、び
んを逆にしても出てこないが、振動を与えれば流動しだ
すことはよ（知られている。Next, to explain the viscosity ratio, the viscosity ratio represents the fluidity of a material, and the term thixotropy (1z change) describes the phenomenon in which when a liquid is vibrated, it becomes a fluid liquid, and when the vibration is stopped, it solidifies into a jelly-like state. , this degree is the viscosity ratio (when measuring viscosity, the rotation speed of the viscometer is 2 rpm and 2 Orp).
(measured at m and calculated at the ratio of 2rpm/20rpm)
The higher the ratio, the more thixotropic it is.
In the case of paints (for example, exterior resins), the higher the ratio, the more effective it is in preventing dripping. For example, tomato ketchup, mayonnaise, etc. are thixotropic and will not come out even if you turn the bottle upside down, but it is known that they will start to flow if you shake them.
粘性比は前述したような意味で、粘性比が１であれば水
のような非常に流動しやすく、塗装した場合には垂れが
発生するが、２〜７の範囲であれば、樹脂の硬化温度、
硬化時間に関係するが垂れが発生しなくなり、７を超え
れば塗装時の形態がそのまま残り、外観不良になりやす
い。例えば、塗料を板などに刷毛を用いて塗装する場合
、粘性比が高すぎると刷毛の痕跡がすし状に残り、工程
度であれば垂れが発生し、従って、垂れが発生せず刷毛
痕跡の残らない粘性比２〜７の塗料（樹脂）が必要であ
る。The viscosity ratio means the above-mentioned meaning.If the viscosity ratio is 1, it will flow very easily like water and will cause dripping when painted, but if it is in the range of 2 to 7, the resin will harden. temperature,
Although it is related to the curing time, no sagging occurs, and if it exceeds 7, the form as applied remains as it was, which tends to result in poor appearance. For example, when applying paint to a board or the like using a brush, if the viscosity ratio is too high, traces of the brush will remain in the form of slivers, and if it is in the process, dripping will occur; A paint (resin) with a viscosity ratio of 2 to 7 that leaves no residue is required.
発明の効果
前述したように、本発明のチップ形フィルムコンデンサ
の製造方法は、
（Ａ）シート外装方式を採用し、外装厚０．３ｕ以下の
外装用シートを用いるので、従来のこの種のモールド成
型によるチップ形フィルムコンデンサに比べて小形化で
きる。Effects of the Invention As mentioned above, the method for manufacturing a chip-type film capacitor of the present invention adopts the (A) sheet exterior method and uses an exterior sheet with an exterior thickness of 0.3 μ or less, so it is not necessary to use conventional molds of this type. It can be smaller than a molded chip-type film capacitor.
（Ｂ） リードフレームを用いないので、成型機およ
び溶接機が不要となり、設備投資金額が著しく低減でき
る。(B) Since a lead frame is not used, a molding machine and a welding machine are not required, and the amount of capital investment can be significantly reduced.
（Ｃ）外部電極引出しメタリコン部の面積が太き（、フ
ロー、リフローなどによる半田付性が改善できる。(C) The area of the external electrode lead-out metallic contact portion is large (solderability by flow, reflow, etc. can be improved).
（Ｄ）寸法精度は従来のモールド成型方式と同程度の精
度にすることができる。(D) Dimensional accuracy can be made comparable to that of conventional molding methods.
（Ｈ）低粘度液状熱硬化性樹脂を用いるので、コンデン
サの耐湿性向上がはかれる。(H) Since a low viscosity liquid thermosetting resin is used, the moisture resistance of the capacitor can be improved.
（Ｆ）コンデンサの生産コストが安価になり経済的であ
る。(F) The capacitor production cost is low and economical.
などの効果があり、工業的ならびに実用的価値大なるも
のである。It has the following effects and has great industrial and practical value.
第１図〜第９図は本発明のチップ形フィルムコンデンサ
の製造工程を示し、第１図は完成品の斜視図、第２図は
円ドラムに巻回した３層巻回物の要部断面図、第３図は
半円状に２分割した３層巻回物の正面図、第４図は帯状
の外装用シート上に複数個のコンデンサ素子を載置した
斜視図、第５図は第４図において、コンデンサ素子相互
間に粘液状エポキシ樹脂を供給した斜視図、第６図は帯
状の硬化物の斜視図、第７図は第６図の帯状の硬化物を
３段積重ねた斜視図、第８図は側端面に外部電極引出し
メタリコン部を形成した３段積重ね硬化物の斜視図、第
９図はチップ形フィルムコンデンサ完成直前の帯状の硬
化物の斜視図である。
１：円ドラム
２ａ、２ｂ、２ｃ、２ｄ、１０ニスペーサ３：３層巻回
物 ３ａ：第１Ｎ巻回物
３ｂ：第２層巻回物 ３ｃ：第３層巻回物４：電極引出
しメタリコン部
５：コンデンサ素子
６ａ、６ｂ：帯状の外装用シート
７：間隙部 ８：粘液状エポキシ樹脂
９：帯状の硬化物
１１；外部電極引出しメタリコン部
１２：メフキ層 １３：切断個所
１４：チップ形フィルムコンデンサFigures 1 to 9 show the manufacturing process of the chip-type film capacitor of the present invention, Figure 1 is a perspective view of the finished product, and Figure 2 is a cross-section of the main part of the three-layered product wound around a circular drum. Figure 3 is a front view of a three-layer winding product divided into two semicircular parts, Figure 4 is a perspective view of a plurality of capacitor elements placed on a band-shaped exterior sheet, and Figure 5 is a Fig. 4 is a perspective view of supplying a sticky epoxy resin between capacitor elements, Fig. 6 is a perspective view of a strip-shaped cured product, and Fig. 7 is a perspective view of three stacked strip-shaped cured products shown in Fig. 6. , FIG. 8 is a perspective view of a three-tiered cured product having external electrode lead-out metallic contact portions formed on the side end faces, and FIG. 9 is a perspective view of a strip-shaped cured product immediately before completion of a chip-type film capacitor. 1: Circular drum 2a, 2b, 2c, 2d, 10 varnish spacer 3: 3-layer winding 3a: 1N winding 3b: 2nd-layer winding 3c: 3rd-layer winding 4: Electrode lead metallic contact part 5: Capacitor elements 6a, 6b: Strip-shaped exterior sheet 7: Gap portion 8: Mucus-like epoxy resin 9: Strip-shaped cured product 11; External electrode lead metallicon portion 12: Mekki layer 13: Cutting point 14: Chip-type film capacitor
Claims (1)
回数巻回し、スペーサを介して複数層の巻回物を形成す
る巻回工程と、該複層巻回物の両端面に電極引出しメタ
リコン部を形成するメタリコン工程と、前記複層巻回物
を所定の温度で熱処理する工程と、該熱処理後に前記複
層巻回物を複数個に予備切断する工程と、所定の静電容
量のコンデンサ素子を形成するための切断工程と、前記
コンデンサ素子複数個を該コンデンサ素子のメタリコン
側の幅と同一幅の片面離型処理した帯状の基材入熱硬化
性樹脂プリプレグシートからなる外装用シート上に等間
隔に間隙部を設けて連続して配置し、該間隙部に粘性比
２〜７の粘液状熱硬化性樹脂を定量供給し、その上に前
記外装用シートと同一の外装用シートを載置し、所定寸
法に加圧・加熱硬化処理して帯状の硬化物を形成する工
程と、前記帯状の硬化物を該硬化物より広幅のスペーサ
を介して複数段積重ね両端面に半田を溶射して外部電極
引出しメタリコン部を形成するメタリコン工程と、該外
部電極引出しメタリコン部を低粘度液状熱硬化性樹脂で
含浸・熱硬化処理する工程と、該外部電極引出しメタリ
コン部を研磨する工程と、該外部電極引出しメタリコン
部をメッキする工程と、前記コンデンサ素子相互の間隙
部に介在した樹脂部を切断分割する工程とを備えたこと
を特徴とするチップ形フィルムコンデンサの製造方法。A winding step of winding a pair of metallized plastic films around a drum a predetermined number of times to form a multi-layered wound product through a spacer, and forming electrode lead-out metallic contact portions on both end faces of the multi-layered wound product. a metallicon step, a step of heat-treating the multilayer winding at a predetermined temperature, a step of preliminarily cutting the multilayer winding into a plurality of pieces after the heat treatment, and forming a capacitor element with a predetermined capacitance. cutting process for cutting, and cutting a plurality of the capacitor elements at equal intervals on an exterior sheet made of a thermosetting resin prepreg sheet with a strip-shaped base material that has been subjected to mold release treatment on one side and has the same width as the width of the metallicon side of the capacitor element. A gap is provided and arranged continuously, a viscous thermosetting resin having a viscosity ratio of 2 to 7 is supplied in a fixed amount to the gap, and an exterior sheet identical to the exterior sheet is placed thereon, A process of forming a band-shaped cured product by applying pressure and heat curing to a predetermined size, and stacking the band-shaped cured product in multiple stages via a spacer wider than the cured product and spraying solder on both end faces to form an external electrode. a metallicon step for forming a lead-out metallicon portion; a step of impregnating and thermosetting the external electrode drawer metallicon portion with a low-viscosity liquid thermosetting resin; a step of polishing the external electrode drawer metallicon portion; and a step of polishing the external electrode drawer metallicon portion. A method for manufacturing a chip-type film capacitor, comprising the steps of plating a metallicon portion and cutting and dividing a resin portion interposed in a gap between the capacitor elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63049237A JPH0821514B2 (en) | 1988-03-02 | 1988-03-02 | Method of manufacturing chip type film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63049237A JPH0821514B2 (en) | 1988-03-02 | 1988-03-02 | Method of manufacturing chip type film capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01223713A true JPH01223713A (en) | 1989-09-06 |
| JPH0821514B2 JPH0821514B2 (en) | 1996-03-04 |
Family
ID=12825278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63049237A Expired - Fee Related JPH0821514B2 (en) | 1988-03-02 | 1988-03-02 | Method of manufacturing chip type film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821514B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03255605A (en) * | 1990-03-05 | 1991-11-14 | Marcon Electron Co Ltd | Manufacture of laminated film capacitor |
| JPH04256302A (en) * | 1991-02-08 | 1992-09-11 | Matsushita Electric Ind Co Ltd | Laminated film chip capacitor |
| EP0444214B1 (en) * | 1989-09-21 | 1995-08-30 | Toray Industries, Inc. | Film capacitor and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014178133A1 (en) * | 2013-05-01 | 2014-11-06 | 小島プレス工業株式会社 | Power storage device, method for producing same, and device for producing same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6297314A (en) * | 1985-04-16 | 1987-05-06 | ニツセイ電機株式会社 | Manufacture of electronic parts |
| JPS62281414A (en) * | 1986-05-30 | 1987-12-07 | ニツセイ電機株式会社 | Electronic parts and manufacture of the same |
| JPS6312823U (en) * | 1986-06-18 | 1988-01-27 |
-
1988
- 1988-03-02 JP JP63049237A patent/JPH0821514B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6297314A (en) * | 1985-04-16 | 1987-05-06 | ニツセイ電機株式会社 | Manufacture of electronic parts |
| JPS62281414A (en) * | 1986-05-30 | 1987-12-07 | ニツセイ電機株式会社 | Electronic parts and manufacture of the same |
| JPS6312823U (en) * | 1986-06-18 | 1988-01-27 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0444214B1 (en) * | 1989-09-21 | 1995-08-30 | Toray Industries, Inc. | Film capacitor and its manufacturing method |
| JPH03255605A (en) * | 1990-03-05 | 1991-11-14 | Marcon Electron Co Ltd | Manufacture of laminated film capacitor |
| JPH04256302A (en) * | 1991-02-08 | 1992-09-11 | Matsushita Electric Ind Co Ltd | Laminated film chip capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0821514B2 (en) | 1996-03-04 |
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