JPS6297314A - Manufacture of electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] <Industrial Technical Field> The present invention provides a manufacturing method tζ that is effective for electronic components such as chip-shaped metallized film capacitors in which electrodes are formed by a metal spraying method (hereinafter referred to as the metallized film capacitor). It is related to

<Problems with the prior art> As is well known, in recent years, various electronic devices, both consumer and industrial, have become smaller, lighter, and more densely packed. Electronic components are required to be miniaturized and made into chips.

For example, compared to ceramic capacitors, tantalum capacitors, etc., it is said that film capacitors are less likely to be miniaturized and made into chips, especially in terms of heat resistance. There is also a trend toward miniaturization and chipping to accommodate high-density packaging, and for this reason, various manufacturing measures have been taken.

By the way, in metal manufacturing methods for forming chip-type capacitors using metallized films, the metallization method is adopted in most cases for forming the electrode end faces.

When performing this metallization, various methods are employed to prevent the sprayed metal from adhering to areas other than the end surfaces of the capacitor element, and a masking device is generally used. Figures 10 and 11 The figure shows an example of a masking method in the conventional metallicon method.In this case, first, two pieces of masking tape C are used, each having the same or slightly wider width than the capacitor element whose electrode end surface a is flattened into an oval shape.
9d, the body part e of the capacitor element is successively covered at regular intervals, and after being arranged in a string, it is wound up on a reel (not shown) to form a disk shape, and both end surfaces of the electrode are formed. After spraying metallcon metal all at once, by peeling off the masking tapes c and d, a capacitor element coated with metallicon (metal spraying) as shown in Fig. 11(a) is formed. Ru.

However, with the conventional method as described above, when the capacitor element becomes a small element with a thickness of 1 mm or less, it becomes difficult to convey and position the capacitor element to the masking tapes c and d.

It becomes difficult to achieve a proper state, that is, a regular arrangement of the elements, and as a result, as shown in FIG. 11(b), the metal layer f of metallicon cannot be uniformly adhered.

Since the end face of the capacitor element is oval, it is impossible to directly obtain a shape such as the rectangular chip-shaped capacitor g shown in FIG. 12 after the metallization process.

OBJECTS OF THE INVENTION The present invention solves the various conventional problems as described above, namely, it is possible to obtain an appropriate metal layer even for a small element with a thickness of 1 mm or less, and to solve this problem. The purpose of the present invention is to provide a method for manufacturing electronic components that can perform metallization work and simultaneously apply an exterior suitable for square chip components.

Basic Structure of the Present Invention> To achieve the above object, the present invention consists of two sheets having a width approximately equal to the dimension between the electrode portions at both ends of an electronic component element, as shown in the block diagram of FIG. Each side of the long protector sheet member is uniformly coated with epoxy resin or epoxy adhesive.

A plurality of electronic component elements are adhered to one coating surface in a preset spacing arrangement, and an appropriate amount of high-quality epoxy or the like is applied to the gaps between the electronic component elements so that they do not protrude from the protector sheet member. A viscous resin is filled, and the adhesive coated side of the other protector sheet member is placed on the element side and bonded onto the plurality of electronic component elements to form an integrated electronic component element chain, and then heated to form a high viscosity resin. After the resin and adhesive reach a hardened or semi-hardened state, zeta metallization is performed on both sides of the electronic component element series, and then there is a step of cutting between the electronic component elements of the element series.

Note that if impregnation is required, it can be performed before the cutting step.

Embodiments of the present invention> An embodiment of the present invention will be described below with reference to FIGS. 2 to 9.

Example 1 In the figure, 1 is a metallized film capacitor element, 2
is the first bonding layer for bonding this metallized film capacitor element 1.
protector sheet member, 3 is a high viscosity resin, 4 is a second
protector sheet parts.

5 is a metallic electrode layer.

The metallized film capacitor element (hereinafter simply referred to as element) 1 is made of two single-sided vapor-deposited polyethylene terephthalate films each having a thickness of 2.0 μm and a width of 4.5 mm.
It is wound so that the electrode portions 6 are formed at both end portions, and after being wound, it is flattened by predetermined heating and suppression.

The first protector sheet member 2 has a width of 5 mm,
It is made of a long polyester resin film with a thickness of about 0.1 mm, and an adhesive mainly composed of epoxy resin is uniformly applied to one side (the upper side in the figure). Further, the length dimension of this sheet member 2 may be appropriately selected according to the specifications.

The high viscosity resin 3 is made of thermosetting resin such as epoxy resin and is shown in FIG. The resin is always stored in the resin injector 7.

The second protector sheet member 4 is formed to match the material, shape, and size of the first protector sheet member 2, and has one surface (lower surface side) uniformly coated with an adhesive in advance. Therefore.

As shown in FIG. 4, the second protector sheet member 4 can be fixed when placed over each element 1 and the high-viscosity resin 3.

As a result, as shown in FIG.
Arrange and adhere at equal intervals of ~2 mm. Next, as shown in FIG. 3, in each gap 8 between the elements 1,
The high viscosity resin 3 from the resin injector 7 is supplied dropwise in an amount of approximately 0.0 sg to fill the 9 gap portions 8. At this time, the amount of high viscosity resin 3 supplied is as follows.

Controlled by an injection controller (not shown).

The gaps between the elements 1 and the first protector sheet member 2 are filled with the resin 3.

After the high viscosity resin 3 has been dropped into a predetermined number of gaps 8, the second protector sheet member 4 is placed with the adhesive applied side down (element side) and the high viscosity resin 3 Lay it on top of resin 3. At this time, the high viscosity resin 3 is the first. Although it seems that there is a risk of it flowing out of the second protector sheet members 2 and 4, the surface tension of the high viscosity resin 3 is at work.

The high viscosity resin 3 is applied to the electrode portion 6 of the element 1 as shown in FIG.
An integrated element series C on which a resin layer is formed on almost the same surface as
is configured. Next, when the element series C is heat-treated and the high viscosity resin 3 is slightly hardened.

As shown in Figure 7, there is a metal plate (partition plate) with a width of about 7 mm.
A plurality of pieces are fixed at a time via 9. and.

Metallicon metal is sprayed from the direction of arrow B.

After that, the element chain C is taken apart one by one, and the metallicon metal electrode layer 5 is cleaned of dust and metal dust. As shown in FIG.
A metallicon metal electrode layer 5 is formed which is fixed at the point (see section Y in the figure). Furthermore, after completely curing the resin layer, the fifth
As shown in the figure.

If the resin layer between elements 1 and 1 is cut with a 10 km rotating saw blade with a thickness of about 0.3 mm, the thickness will be 1.5 mm.
.

A chip-shaped metallized film capacitor element 11 having a width of 3.5 mm and a length of 6 mm is completed.

Example 2 FIG. 9 shows a second embodiment, in this case.

The first and second protector sheet members each have a width of 5 mm and a thickness of 0.1 mm, and on the side facing the husband, a protector sheet member with a width of 4.5 mm and a thickness of 0.2 mm is used. After uniformly applying the epoxy resin layer 12 and curing it until it remains sticky, elements 1 with a thickness of 1 mm, a width of 2.7 mm, and a length of 5 mm are placed on the epoxy resin layer 12. The arrangement was fixed at intervals of 2 mm, and the above Example 1
Based on the same process as shown in FIG. 8, an element chain C' filled with resin can be formed between the element 1 and the first and second protector sheet members 2 and 4. In this case, as shown in Fig. 13, one width is 4 mm and the thickness is 0.
．． 05 mmQ long polyester sheet 2' with elements adhesively fixed in advance at intervals of 1 mm, which may be superimposed on the epoxy resin layer 12 and bonded. Moreover, in this case, the first and second protector sheet members 2.
There is also a method of using a metal plate 4 with a width of 7 mm. In this case, it is possible to omit the metal plate 9 used when performing metallikoning by overlapping the element series c and c'. It is necessary to peel off the first and second protector sheets 2, 4. In each of the above embodiments, the case where the high viscosity resin 3 at the time of metallization is semi-cured has been described, but even when it is almost fully cured, the same effect can be obtained.

Effects of the present invention> As described above, according to the method for manufacturing an electronic component according to the present invention, element supply,
This makes it easier to set the position of the element, making it possible to form an appropriate metallization metal electrode layer even for small elements with a thickness of 1 mm or less, and at the same time providing an exterior suitable for chip components during metallization work. Therefore, it has various advantages such as ease of manufacturing chip-shaped parts and continuous automatic production, which can significantly reduce manufacturing costs.

Note that the present invention is not limited to the single-sided vapor-deposited wound metal film capacitor element of the above embodiment, but also applies to single-sided vapor-deposited elements, laminated type devices, and methods for manufacturing electronic components other than capacitors. The present invention can also be applied to attached electronic components, and various design changes can be made within the technical scope of the claims.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing the basic configuration of the present invention. 2 to 5 are perspective views showing Embodiment 1 of the present invention. FIG. 6 is a cross-sectional view showing the state in which the metallicon metal electrode layer is formed, FIGS. 7 and 8 are side views showing the state in which the same element series are stacked, and FIGS. 9 and 13. 10 is a perspective view showing the second embodiment, FIGS. 10 and 11 are perspective views showing masking and element shape in the conventional method, and FIG. 12 is a perspective view showing a chip-shaped component. In the figure, 1 is a metallized film capacitor element, 2 is a first protector sheet member, 3 is a high viscosity resin, and 4 is a second protector sheet member. 5 is a metallicon metal layer, 6 is an element end surface electrode portion, 7 is a resin injector, 8 is a gap portion, 9 is a metal plate, 10 is a rotating sawtooth, 1
1 is a capacitor element, and 12 is a resin layer. Patent Applicant Nichii Denki Co., Ltd. Kayabu t" Meg1Ba Kaya/θa Procedural Amendment t1-18 May 1'6, 1985 Manabu Shiga, Commissioner of the Patent Office 1, Indication of Case Patent Application 1988 -79350 No. 2, Title of the invention: Method for manufacturing electronic components 3, Relationship with the person making the amendment Patent applicant address: 1-3-18 Hiroo, Shibuya-ku, Tokyo Name: Nissei Denki Co., Ltd. 4: Agent explanation S and drawing 6 attached to the specification, contents of amendment (1) There is a typo error in the middle-character type in claim (1) of the specification, so the statement in claim (1) has been amended as shown in the attached sheet. To do. (2) Correct the "Method of affiliation" on the 9th line of page 3 of the specification to "Method of loading." 711, (3) Figures 2, 3, and 4 in the drawings attached to the specification. In Figures 8, 9, and 13, the arrows were missing from the leader lines of the symbols, so I will attach each figure with an arrow as attached. 7. List of attached documents (1) Amended claims (1 animal, 1 copy (2) Amended drawings (Figures 2, 3, 4, 8, 9, 13) 1 Claims (1) In a method of manufacturing an electronic component having electrode portions at both ends, each side of two long protector sheet members having a width approximately equal to the dimension between the electrode portions is coated with epoxy resin or epoxy resin. A system adhesive or the like is uniformly applied, and a plurality of electronic component elements are adhered to one coated surface at a preset spacing arrangement. The protector sheet member is filled with an appropriate amount of high viscosity resin such as epoxy that does not protrude, and the adhesive-coated side of the other protector sheet member is placed on the element side and adhered to the multiple electronic component elements to form an integrated electronic component. After forming a series of component elements, heating is performed, and the high viscosity resin and adhesive are in a hardened or semi-hardened state ν
After this is achieved, metallization is performed on both sides of the electronic component element chain. A method of manufacturing an electronic component, comprising the step of cutting between the electronic component elements of the series of elements. Procedural amendment (spontaneous) January 17, 1985 Michibe Uga, Commissioner of the Patent Office 1, Indication of case: Japanese Patent Application No. 1987-79350 f shi”7geshishi Seizoyahoku 7 to 2, Title of invention: Electronic Parts manufacturing method 3, relationship with the case of the person making the amendment Patent applicant's address: 1-3-18-4 Hiroo, Shibuya-ku, Tokyo Agent's address: 4-chome, Hongo, Bunkyo-ku, Tokyo No. 9, No. 32, No. 5, detailed description of the invention column 6 of the specification to be amended, content of the amendment (1) The detailed description of the invention column of the specification is amended as follows: ■Page 3 of the middle page of the specification Delete F same or] in the 1st S line U. ■ Insert ``resin hardens'' after ``, then'' in the 1st line of page 6 of the specification. ■Correct F in the fourth line of page 6 of the middle leaf of the specification to “J” to ``J.
Corrected to 02J. Procedural amendment written in 1986 // Ji Mu, Director General of the Patent Office, Black 1) Mr. Akihiro 1, Indication of the case 1985 patent application $79350 2
, Title of the invention Method for manufacturing electronic components 3, Relationship to the case of the person making the amendment Patent applicant address 1-3-18-4 Hiroo 1-chome, Shibuya-ku, Tokyo Address of agent 4-9 Hongo, Bunkyo-ku, Tokyo No. 32 No. 5, Date of amendment order November 11, 1985 (shipment g) 6. Target of amendment Column 7 of the scope of claims described in the appendix attached to the procedural amendment submitted on May 17, 1985 , Contents of the amendment as shown in the attached sheet (no changes to the contents) 8. List of attached documents (1) Document stating the scope of claims (1) Attachment A. Scope of claims (1) Electrodes on both ends In the method for manufacturing an electronic component having a section, epoxy resin or epoxy adhesive is uniformly applied to each side of two long protector sheet members each having a width approximately equal to the dimension between the electrode sections. A plurality of electronic component elements are adhered to one coated surface in a preset nu spacing arrangement, and an appropriate amount that does not protrude from the protector sheet member is applied to the gaps between these electronic component elements. Filled with high viscosity resin such as epoxy, and bonded the adhesive coated side of the protector sheet member to the element side on top of the multiple electronic component elements to form an integrated electronic component element chain. After the high viscosity L0I fat and adhesive reach a hardened or semi-hardened state by heating, metallicon is applied to both sides of the electronic component element chain, and then the top of the electronic component element of the element chain is cut. A method for manufacturing electronic components characterized by: (2) The method for manufacturing an electronic component according to claim 1, wherein the electronic component element is a rolled or laminated metallized film capacitor element. (3) The method for manufacturing an electronic component according to claim 1, wherein the protector sheet member is a plastic film or sheet such as polyester resin, paper, or the like.

Claims (3)

[Claims] (1) In a method for manufacturing an electronic component having electrode portions at both ends, an epoxy resin or an epoxy adhesive or the like is applied to each side of two long protector sheet members each having a width approximately equal to the dimension between the electrode portions. A plurality of electronic component elements are adhered to one of the coated surfaces at a predetermined spacing arrangement, and the parts protruding from the protector sheet member are placed in the gaps between these electronic component elements. Fill with an appropriate amount of high viscosity resin such as epoxy, and adhere the adhesive-coated side of the other protector sheet member to the element side on top of the multiple electronic component elements to form an integrated electronic component element chain. After that, the process is heated, and after the high clay resin and adhesive reach a hardened or semi-hardened state, metallization is performed on both sides of the electronic component element series, and then, the electronic component elements of the element series are cut. A method for manufacturing electronic components characterized by: (2) The method for manufacturing an electronic component according to claim 1, wherein the electronic component element is a rolled or laminated metallized film capacitor element. (3) The method for manufacturing an electronic component according to claim 1, wherein the protector sheet member is made of a plastic film or sheet such as polyester resin, paper, or the like.