JPH0555082A - Manufacture of surface mounting plastic film capacitor - Google Patents

Manufacture of surface mounting plastic film capacitor

Info

Publication number
JPH0555082A
JPH0555082A JP23730591A JP23730591A JPH0555082A JP H0555082 A JPH0555082 A JP H0555082A JP 23730591 A JP23730591 A JP 23730591A JP 23730591 A JP23730591 A JP 23730591A JP H0555082 A JPH0555082 A JP H0555082A
Authority
JP
Japan
Prior art keywords
plastic film
resin
case
film capacitor
sprayed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23730591A
Other languages
Japanese (ja)
Inventor
Naoto Nakano
尚登 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Platforms Ltd
Original Assignee
Nitsuko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitsuko Corp filed Critical Nitsuko Corp
Priority to JP23730591A priority Critical patent/JPH0555082A/en
Publication of JPH0555082A publication Critical patent/JPH0555082A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To manufacture a surface mounting plastic film capacitor adapted for mass production and economy by winding or a metallized plastic film, pouring liquidlike resin in a case to form an outer electrode, and individually cutting and dividing capacitor elements. CONSTITUTION:A plurality of capacitor elements 1 in which metallized plastic films are wound or laminated and metal flame-sprayed parts 1a, 1b are provided on opposed end faces, are aligned to be disposed in a long resin case 2 having a lateral inner size L2 larger by a predetermined size than a size L1 between the frame-sprayed end faces, and liquidlike resin 3 is poured in the case. After the resin is cured, the lateral end faces of the case 2 are polished until the flame-sprayed end faces 1a, 1b of the capacitors 1 are exposed, and outer electrodes are formed of metal flame-sprayed surface of conductive paste on the exposed end faces 1a, 1b and the resin surface. The outer electrodes are solder-plated or soldered, and the capacitors 1 are individually cut and divided.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はプリント基板への面実装
に適した構造の面実装用プラスチックフィルムコンデン
サに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting plastic film capacitor having a structure suitable for surface mounting on a printed circuit board.

【0002】[0002]

【従来技術】従来、金属化プラスチックフィルムを巻回
或いは積層したプラスチックフィルムコンデンサを面実
装用にするためには、図3(a)に示すように金属化プ
ラスチックフィルムを巻回或いは積層したものの両端に
金属溶射を行ったコンデンサ素子20をリードフレーム
21の端子22,23間に挿入し、この金属溶射部(メ
タリコン)20a,20bと端子22,23を溶接した
後、図3(b)に示すように熱硬化性樹脂でモールド成
形して外装24を施した後、図3(c)に示すように端
子22,23をリードフレーム21より切り離し、該端
子22,23を外装24の表面に沿って折り曲げて形成
している。なお、図4はこのようにして造られた面実装
用プラスチックフィルムコンデンサの構造を示す一部断
面側面図である。
2. Description of the Related Art Conventionally, in order to mount a plastic film capacitor in which a metallized plastic film is wound or laminated, for surface mounting, as shown in FIG. 3A, both ends of the metalized plastic film are wound or laminated. After inserting the metal sprayed capacitor element 20 between the terminals 22 and 23 of the lead frame 21 and welding the metal sprayed parts (metallikon) 20a and 20b to the terminals 22 and 23, as shown in FIG. 3 (b). As shown in FIG. 3C, the terminals 22 and 23 are separated from the lead frame 21, and the terminals 22 and 23 are formed along the surface of the outer casing 24 after being molded with a thermosetting resin as shown in FIG. It is bent and formed. Note that FIG. 4 is a partial cross-sectional side view showing the structure of the surface mount plastic film capacitor thus manufactured.

【0003】[0003]

【発明が解決しようとする課題】しかしながら上記従来
のプラスチックフィルムコンデンサの面実装化する方法
には下記のような欠点があった。 (1)リードフレーム21の端子22,23間へのコン
デンサ素子20の挿入作業及び端子22,23とコンデ
ンサ素子20の両端の金属溶射部20a,20bとの溶
接作業が困難で且つ製品の歩留まりが悪い。 (2)外装が樹脂成形加工(モールド)によるため、量
産性、経済性に不利でコスト高となる。
However, the above-described conventional method of surface-mounting the plastic film capacitor has the following drawbacks. (1) It is difficult to insert the capacitor element 20 between the terminals 22 and 23 of the lead frame 21 and to weld the metal sprayed portions 20a and 20b at both ends of the terminals 22 and 23 to the product yield. bad. (2) Since the exterior is formed by resin molding (molding), it is disadvantageous in mass productivity and economical efficiency, resulting in high cost.

【0004】本発明は上述の点に鑑みてなされたもの
で、量産性、経済性に適した面実装用プラスチックフィ
ルムコンデンサの製造方法を提供することを目的とす
る。
The present invention has been made in view of the above points, and an object thereof is to provide a method of manufacturing a plastic film capacitor for surface mounting, which is suitable for mass productivity and economy.

【0005】[0005]

【課題を解決するための手段】上記課題を解決する本発
明は面実装用プラスチックフィルムコンデンサを下記の
工程により製造するようにした。金属化プラスチックフ
ィルムを巻回或いは積層し、対向端面に金属溶射を施し
てなるプラスチックフィルムコンデンサ素子を、幅方向
の内寸法が該金属溶射を施した端面間の寸法より所定寸
法大きい長尺のケース内に整列して複数個配置し、該ケ
ース内に液状樹脂を注入する工程、液状樹脂の硬化後、
ケースの前記幅方向の端面を前記プラスチックフィルム
コンデンサ素子の金属溶射面が露出するまで研磨し、該
露出した金属溶射面、ケース端面及び注入樹脂端面に金
属溶射面又は導電ペーストにより外部電極を形成する工
程、外部電極面に半田鍍金或いは半田上げを施し、しか
る後前記プラスチックフィルムコンデンサ素子を個々に
切り割ける工程。
According to the present invention for solving the above problems, a surface mount plastic film capacitor is manufactured by the following steps. A long case in which a plastic film capacitor element obtained by winding or laminating metallized plastic films and subjecting opposite end faces to metal spraying has a predetermined inner dimension in the width direction larger than a dimension between the end faces subjected to metal spraying. A step of arranging a plurality of pieces in alignment with each other and injecting the liquid resin into the case,
The widthwise end face of the case is ground until the metal sprayed surface of the plastic film capacitor element is exposed, and external electrodes are formed on the exposed metal sprayed surface, the case end surface and the injection resin end surface by the metal sprayed surface or conductive paste. Step, a step of subjecting the external electrode surface to solder plating or soldering, and thereafter cutting the plastic film capacitor element into individual pieces.

【0006】[0006]

【作用】上記の工程により面実装用プラスチックフィル
ムコンデンサを製造するので、外部引出電極を金属溶射
面又は導電ペーストという比較的容易で且つ安価に方法
で成形できる。更に、外装がケース内に樹脂を注入させ
硬化で終了するので、自動化及び量産性に適する。
Since the plastic film capacitor for surface mounting is manufactured by the above steps, the external extraction electrode can be formed by a relatively easy and inexpensive method using a metal sprayed surface or a conductive paste. Further, the exterior is filled with resin in the case and completed by curing, which is suitable for automation and mass productivity.

【0007】[0007]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。図1(a)乃至(h)は本発明に係る面実装用プ
ラスチックフィルムコンデンサの製造工程を説明するた
めの図である。
Embodiments of the present invention will be described below with reference to the drawings. 1A to 1H are views for explaining a manufacturing process of the surface mount plastic film capacitor according to the present invention.

【0008】先ず、図1(a)に示すように、金属化プ
ラスチックフィルムを巻回或いは積層し、エポキシ樹脂
を含浸させ、更に対向する端面に金属溶射を施して金属
溶射部1a,1bを形成してなるプラスチックフィルム
コンデンサ素子1を用意する。
First, as shown in FIG. 1 (a), a metallized plastic film is wound or laminated, impregnated with epoxy resin, and the opposite end faces are sprayed with metal to form metal sprayed portions 1a and 1b. A plastic film capacitor element 1 to be prepared is prepared.

【0009】次に、図1(b)に示すように、幅方向の
内寸法L2が前記プラスチックフィルムコンデンサ素子
1の金属溶射部1a,1bの端面間の寸法L1より所定
寸法(0.1mm〜0.2mm程度)大きい長尺の樹脂ケース
2を用意し、該樹脂ケース2内に前記プラスチックフィ
ルムコンデンサ素子1を複数個整列させ配置する。該ケ
ース2の樹脂材料は熱変形温度が180℃以上のものが
望ましく、例えば、エポキシ系樹脂、フェノール系樹
脂、PPS系樹脂等を用いる。
Next, as shown in FIG. 1B, the inner dimension L2 in the width direction is a predetermined dimension (0.1 mm to A large long resin case 2 is prepared, and a plurality of the plastic film capacitor elements 1 are arranged and arranged in the resin case 2. It is desirable that the resin material of the case 2 has a heat distortion temperature of 180 ° C. or higher. For example, an epoxy resin, a phenol resin, a PPS resin, or the like is used.

【0010】次に、図1(c)に示すように、樹脂ケー
ス2内に溶融樹脂材3を注入し、該樹脂3を硬化させ
る。この注入樹脂材3としては熱硬化性のエポキシ樹脂
等を用いる。注入樹脂の硬化後、該樹脂及び樹脂ケース
2の上面を図1(d)に示すように、プラスチックフィ
ルムコンデンサ素子1より所定寸法L3(0.2mm〜0.
3mm)残して研磨する。次に、図1(e)に示すよう
に、樹脂ケース2の幅方向の端面及び樹脂材3をプラス
チックフィルムコンデンサ素子1両端の金属溶射部1
a,1bが露出するまで研磨する。
Next, as shown in FIG. 1C, a molten resin material 3 is poured into the resin case 2 and the resin 3 is cured. As the injection resin material 3, a thermosetting epoxy resin or the like is used. After the injected resin is cured, the resin and the upper surface of the resin case 2 are provided with a predetermined dimension L3 (0.2 mm to 0.2 mm) from the plastic film capacitor element 1 as shown in FIG.
3 mm) and leave it for polishing. Next, as shown in FIG. 1E, the width direction end surface of the resin case 2 and the resin material 3 are connected to the metal sprayed parts 1 at both ends of the plastic film capacitor element 1.
Polish until a and 1b are exposed.

【0011】上記のように研磨して、プラスチックフィ
ルムコンデンサ素子1両端の金属溶射部1a,1bが露
出させた状態の樹脂材3の面にはそのままでは、溶射金
属が密着しないので、図1(f)に示すようにその端面
を粗面化4した後、金属溶射を行い外部電極部5a,5
bを形成する。この粗面化は、例えば図2にその断面形
状を示すように、幅0.05mm〜0.1mm、深さ0.15m
m〜0.2mm程度の楔状の微小溝をニードル打ちやカッタ
ー刃などにより、密度500〜700/cm2で形成して
行う。なお、この外部電極部5a,5bの形成は金属溶
射に限定されるものではなく、銀等の導電ペーストを塗
布して形成してもよい。
Since the sprayed metal does not adhere to the surface of the resin material 3 in the state where the metal sprayed portions 1a and 1b on both ends of the plastic film capacitor element 1 are exposed by the above-mentioned polishing, the sprayed metal does not adhere to the surface as shown in FIG. After the end surface is roughened 4 as shown in f), metal spraying is performed to external electrode portions 5a, 5
b is formed. This roughening is, for example, as shown in the sectional shape of FIG. 2, a width of 0.05 mm to 0.1 mm and a depth of 0.15 m.
Wedge-shaped fine grooves of about m to 0.2 mm are formed with a density of 500 to 700 / cm 2 by needle punching or a cutter blade. The formation of the external electrode portions 5a and 5b is not limited to metal spraying, and may be formed by applying a conductive paste such as silver.

【0012】外部電極部5a,5bの面に半田鍍金或い
は半田上げを施し、しかる後図1(h)に示すように、
個々のプラスチックフィルムコンデンサ素子1個毎にそ
れを覆う樹脂ケース2及び樹脂材3と共に切り離して、
面実装用プラスチックフィルムコンデンサ6とする。
Solder plating or soldering is applied to the surfaces of the external electrode portions 5a and 5b, and then, as shown in FIG. 1 (h),
For each individual plastic film capacitor element, separate it with resin case 2 and resin material 3 covering it,
The surface mount plastic film capacitor 6 is used.

【0013】[0013]

【発明の効果】以上説明したように本発明によれば、外
部引出電極を金属溶射面又は導電ペーストという比較的
容易に成形できると共に外装がケース内に樹脂を注入さ
せ硬化で終了しするので、自動化及び量産性に優れた面
実装用プラスチックフィルムコンデンサの製造方法を提
供できる。
As described above, according to the present invention, the external extraction electrode can be formed relatively easily as a metal sprayed surface or a conductive paste, and the exterior is filled with resin in the case and completed by curing. It is possible to provide a method for manufacturing a plastic film capacitor for surface mounting, which is excellent in automation and mass productivity.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1の(a)乃至(h)は本発明に係る面実装
用プラスチックフィルムコンデンサの製造工程を説明す
るための図である。
1A to 1H are views for explaining a manufacturing process of a surface mount plastic film capacitor according to the present invention.

【図2】粗面化した面の断面形状を示す図である。FIG. 2 is a diagram showing a cross-sectional shape of a roughened surface.

【図3】図3の(a)乃至(c)は従来の面実装用プラ
スチックフィルムコンデンサの製造工程を説明するため
の図である。
FIG. 3A to FIG. 3C are views for explaining a manufacturing process of a conventional surface mount plastic film capacitor.

【図4】従来の面実装用プラスチックフィルムコンデン
サの構造を示す一部断面側面図である。
FIG. 4 is a partial cross-sectional side view showing the structure of a conventional surface mount plastic film capacitor.

【符号の説明】[Explanation of symbols]

1 プラスチックフィルムコンデンサ素子 2 樹脂ケース 3 樹脂材 4 粗面化 5a,5b 外部電極部 6 面実装用プラスチックフィルムコンデンサ 1 plastic film capacitor element 2 resin case 3 resin material 4 roughening 5a, 5b external electrode section 6 plastic film capacitor for surface mounting

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 金属化プラスチックフィルムを巻回或い
は積層し、対向端面に金属溶射を施してなるプラスチッ
クフィルムコンデンサ素子を、幅方向の内寸法が該金属
溶射を施した端面間の寸法より所定寸法大きい長尺のケ
ース内に整列して複数個配置し、該ケース内に溶融樹脂
を注入する工程と、 前記溶融樹脂の硬化後、ケースの前記幅方向の端面を前
記プラスチックフィルムコンデンサ素子の金属溶射面が
露出するまで研磨し、該露出した金属溶射面、ケース端
面及び注入樹脂端面に金属溶射面又は導電ペーストによ
り外部電極を形成する工程と、 前記外部電極面に半田鍍金或いは半田上げを施し、しか
る後前記プラスチックフィルムコンデンサ素子を個々に
切り割ける工程からなることを特徴とする面実装用プラ
スチックフィルムコンデンサの製造方法。
1. A plastic film capacitor element obtained by winding or laminating a metallized plastic film and subjecting opposite end faces to metal spraying, wherein an inner dimension in a width direction is a predetermined dimension from a dimension between the end faces subjected to the metal spraying. A step of arranging a plurality of pieces in a large elongated case and injecting a molten resin into the case; and, after the molten resin is cured, the widthwise end face of the case is sprayed with metal of the plastic film capacitor element. Polishing until the surface is exposed, a step of forming an external electrode with a metal sprayed surface or a conductive paste on the exposed metal sprayed surface, the case end surface and the injection resin end surface, and subjecting the external electrode surface to solder plating or soldering, Thereafter, the plastic film capacitor for surface mounting is characterized by the step of individually cutting the plastic film capacitor element. Method of manufacturing a capacitor.
JP23730591A 1991-08-23 1991-08-23 Manufacture of surface mounting plastic film capacitor Pending JPH0555082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23730591A JPH0555082A (en) 1991-08-23 1991-08-23 Manufacture of surface mounting plastic film capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23730591A JPH0555082A (en) 1991-08-23 1991-08-23 Manufacture of surface mounting plastic film capacitor

Publications (1)

Publication Number Publication Date
JPH0555082A true JPH0555082A (en) 1993-03-05

Family

ID=17013400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23730591A Pending JPH0555082A (en) 1991-08-23 1991-08-23 Manufacture of surface mounting plastic film capacitor

Country Status (1)

Country Link
JP (1) JPH0555082A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160126011A1 (en) * 2014-10-31 2016-05-05 Deere & Company Capacitor with improved heat dissipation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160126011A1 (en) * 2014-10-31 2016-05-05 Deere & Company Capacitor with improved heat dissipation
US9831035B2 (en) * 2014-10-31 2017-11-28 Deere & Company Capacitor with improved heat dissipation
US10418177B2 (en) * 2014-10-31 2019-09-17 Deere & Company Capacitor with improved heat dissipation

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