JPH06334465A - Chip electronic component and its manufacture - Google Patents

Abstract

PURPOSE:To enhance the reliability of electric continuity of an external terminal to a lead electrode in the chip electronic component provided with an element main body covered with a resin package material and with the lead electrode formed to the surface thereof. CONSTITUTION:Conductive terminal members 36-38 are soldered to an element main body 22 so as to be electrically connected respectively to lead electrodes 26-28 and resin outer packages 40,41 are provided to the surface of the element main body 22. Then terminal members 36-38 are exposed by shaping the resin outer package members 40, 41 from the surface to use the terminal members 36-38 as external terminals.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component and a method for manufacturing the same, and more particularly to an improvement in an electrical connection element to an external terminal in the chip-shaped electronic component and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view showing a chip-shaped electronic component 1 which is of interest to the present invention. More specifically, this chip-shaped electronic component 1 is intended as a piezoelectric resonator used as a filter, an oscillator, a discriminator, or the like.

The chip-shaped electronic component 1 has an element body 2. The element body 2 includes a piezoelectric substrate 3 made of a piezoelectric ceramic material, on one main surface of which lead electrodes 4 and 5 are formed at different positions, and on the other main surface thereof, a lead electrode 6 is formed. Has been formed. Element body 1
Both main surfaces of No. 2 are covered with resin exterior materials 7 and 8.

As described above, on the outer surface of the chip 9 constituted by the element body 2 and the resin sheathing materials 7 and 8, a broken line is formed so as to be electrically connected to the extraction electrodes 4, 5 and 6, respectively. External electrodes 10, 11 and 1 shown
2 are formed respectively.

[0005]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
6 to the external electrodes 10 to 12 are electrically connected to the chip 9
This is achieved by the external electrodes 10 to 12 coming into contact with the linearly exposed extraction electrodes 4 to 6 on the end face of. However, such conduction by line contact is not so excellent in terms of reliability.

Further, the external electrodes 10 to 12 are not so high in adhesion strength to the surface of the chip 9 that the external electrode 1
The problem of debonding from chips 0-12 may be encountered.

Therefore, an object of the present invention is to provide a chip-shaped electronic component and a method for manufacturing the same, which can improve the reliability of conduction to an external terminal and the mechanical strength.

[0008]

In order to solve the above-mentioned technical problems, a chip-shaped electronic component according to the present invention is provided with element main bodies each having lead electrodes formed at different positions on the surface thereof, and the lead electrodes. A plurality of electrically conductive terminal members each having a predetermined thickness and electrically connected to each other and mounted on the surface of the element body at a distance from each other, and a thickness of the element body that does not exceed the thickness of these terminal members. It is characterized by including a resin exterior material provided on the surface.

A method for manufacturing a chip-shaped electronic component according to the present invention is intended to manufacture a chip-shaped electronic component having the above-described structure, and prepares element bodies each having lead electrodes formed at different positions on the surface thereof. , A plurality of electrically conductive terminal members each having a predetermined thickness electrically connected to the extraction electrode are prepared, and these terminal members are respectively separated from each other on the surface of the element body. Each of the extraction electrodes is attached so as to be electrically connected, a resin exterior material is provided on the surface of the element body, and the terminal member is exposed by scraping the resin exterior material from the surface. It is characterized by having.

[0010]

According to the present invention, the external terminal of the chip-shaped electronic component is provided by the terminal member. That is, the terminal member can be reliably connected to the extraction electrode of the element body by, for example, soldering, while being exposed from the resin exterior material provided on the surface of the element body.

[0011]

Therefore, according to the chip-shaped electronic component of the present invention, the conduction from the lead electrode of the element body to the external terminal can be reliably and easily achieved by the terminal member, and the reliability is high. A chip-shaped electronic component can be obtained.

Further, according to the method for manufacturing a chip-shaped electronic component of the present invention, in the step of attaching the terminal member so as to be electrically connected to the extraction electrode of the element body, for example, by soldering or the like, it is possible to easily and surely. An electrical connection can be achieved. Next, after the resin exterior material is applied on the surface of the element body, the resin exterior material is ground from the surface so as to expose the terminal member, so that the resin exterior material can be applied relatively roughly. Therefore, the step of applying the resin exterior material can be efficiently advanced.

[0013]

1 is a sectional view showing a chip-shaped electronic component 21 according to an embodiment of the present invention. The chip-shaped electronic component 21 is intended to be a chip-shaped piezoelectric filter, for example. This chip-shaped electronic component 21 is manufactured through the steps shown in FIGS.

FIG. 2 shows a mother board 23 that provides a plurality of element bodies 22 for obtaining the chip-shaped electronic component 21. In FIG. 2A, one main surface of the mother substrate 23 is shown, and in FIG. 2B, the other main surface of the mother substrate 23 is shown. The mother substrate 23 is cut in a later step, thereby giving a plurality of element bodies 22. In FIG. 2, such a planned cutting line 24 is shown by a chain line.

Each element body 22 has a piezoelectric substrate 25. As shown in FIG. 2 (a), input / output side extraction electrodes 26 and 27 are formed on the first main surface of the piezoelectric substrate 25, and FIG. 2 (b) is formed on the second main surface. As shown, the ground-side extraction electrode 28 is formed. Two resonance elements are connected between the two input / output side extraction electrodes 26 and 27. One of the resonance elements is a divided vibrating electrode 2
9 and 30, and a vibrating electrode 31 facing them. The vibrating electrodes 29 and 30 are formed on the first main surface side of the piezoelectric substrate 25, and the vibrating electrode 31 is the piezoelectric substrate 25.
Is formed on the second main surface side of. Similarly, the other resonant element also includes the divided vibrating electrodes 32 and 33 and the vibrating electrode 34 facing them.

The vibrating electrode 29 described above is connected to one input / output side extraction electrode 26, and the vibrating electrode 32 is connected to the other input / output side extraction electrode 27. Also, the vibrating electrode 3
Both 1 and 34 are connected to the ground-side extraction electrode 28.

The vibrating electrode 30 and the vibrating electrode 33 are connected to each other, and the capacitor electrode 35 is connected to this connection point. The capacitor electrode 35 is the ground side extraction electrode 28.
And the relay capacity is given.

On the other hand, as shown in FIG. 3, conductive terminal members 36, 37 and 38 to be external terminals are prepared.
FIG. 3A is a perspective view showing the mother board 23 from the first main surface side, and FIG. 3B is a perspective view showing the mother board 23 from the second main surface side. Terminal members 36 and 37
Respectively have a cross-sectional shape for receiving the side edge portion of the mother substrate 23, and the input / output side extraction electrodes 26 and 27 are provided.
To be electrically connected by soldering using, for example, high-temperature solder. The terminal electrode 38 is the ground-side lead electrode 28.
To be electrically connected by soldering using, for example, high-temperature solder. In this way, the terminal electrodes 36 to 38 are
The element substrate 22 is mounted on the surface of each element body 22 provided by the mother substrate 23 at a distance from each other, and
Has a predetermined thickness protruding from the surface of the.

As shown in FIG. 3B, the terminal members 36 to 38 may be provided with notches 39 having a V-shaped cross section corresponding to the positions of the planned cutting lines 24. These notches 39 are for facilitating the cutting performed in a later step. The notch 39 may be formed before the terminal members 36 to 38 are attached to the mother board 23 or after the terminal members 36 to 38 are attached to the mother board 23. Further, the notch 39 does not need to be specifically provided if the above-mentioned advantages are not desired.

As the terminal members 36 to 38, those having a relatively large thickness are used as in the illustrated embodiment, and
If these are made of, for example, a metal, these terminal members 36 to 38 can function as a damping material that suppresses vibration at unnecessary portions of the element body 22.

Next, as shown in FIG. 4, the mother substrate 23
The resin exterior materials 40 and 41 are provided on the surface of each element body 22 provided by. These resin exterior materials 4
0 and 41 are composed of, for example, a thermosetting resin,
With the mother substrate 23 placed in an appropriate frame or mold, such a thermosetting resin is poured in an uncured state, and then cured by heating. In FIG. 4, the resin sheathing materials 40 and 41 are provided so as to cover respective parts of the terminal members 36 and 37, but the resin sheathing materials 40 and 41 cover the terminal members 36 and 37 entirely. May be given to. Therefore, the resin exterior materials 40 and 41 may be applied by a dip method.

When applying the resin sheathing materials 40 and 41, the cavity 4 is provided on each vibration region of the element body 22.
Care is taken that 2 is left. For example, if a cavity forming material such as wax is applied in advance on the vibration area,
When the thermosetting resin to be the resin sheathing materials 40 and 41 is cured, the cavity forming material is used as the resin sheathing materials 40 and 41.
The cavity 42 may be formed by transitioning in.

Next, the resin exterior materials 40 and 41 described above are used.
However, the surface thereof is ground by lapping or the like, so that the terminal members 36 to 38 are exposed as shown in FIG. In this way, when the terminal members 36 to 38 are to be exposed by scraping the resin sheathing materials 40 and 41 from the surface thereof, as shown in the drawing, from the element body 22 of the terminal members 36 to 38 prepared in advance. It is preferable that the projecting heights of are equal to each other.

Next, as shown in FIG. 5, cutting is performed along the above-mentioned planned cutting line 24. As a result, FIG.
A plurality of chip-shaped electronic components 21 as shown in FIG.
In this cutting step, as described above, if the notches 39 are provided in the terminal members 36 to 38 in advance, the cutting can be made easier.

Although the chip-shaped electronic component and the method for manufacturing the same according to the present invention have been described above with reference to the illustrated embodiments, the following modifications are possible within the scope of the present invention.

For example, in the above-described embodiment, the mother board 23 constituting the plurality of element bodies 22 is prepared, and the plurality of chip-shaped electronic parts 21 are obtained by cutting the mother board 23 later. For each element body for the chip-shaped electronic component, the steps other than the cutting described above may be performed to obtain a desired chip-shaped electronic component.

The present invention can also be applied to chip-shaped electronic parts other than the above-mentioned piezoelectric filter. Further, in the chip-shaped electronic component 21 in the above-mentioned embodiment, the resin outer packaging materials 40 and 41 are provided on both surfaces of the element body 22, but in the present invention, the resin outer packaging material is provided only on one surface of the element body. The present invention can also be applied to chip-type electronic components of the type.

[Brief description of drawings]

FIG. 1 shows a chip-shaped electronic component 2 according to an embodiment of the present invention.
It is sectional drawing which shows 1.

2 shows a mother substrate 23 prepared for manufacturing the chip-shaped electronic component 21 shown in FIG. 1, (a)
Is a top view and (b) is a bottom view.

FIG. 3 shows terminal members 36 to the mother board 23 shown in FIG.
38 shows a state in which 38 is attached, (a) is a perspective view showing an upper main surface side of the mother substrate 23, and (b) is a perspective view showing a lower main surface side of the mother substrate 23.

FIG. 4 is a cross-sectional view showing a state in which resin sheathing materials 40 and 41 are provided on the surface of the mother substrate 23 shown in FIG.

FIG. 5 is a perspective view showing a state in which the surfaces of the resin sheathing materials 40 and 41 shown in FIG. 4 are shaved to expose the terminal members 36 to 38.

FIG. 6 is a perspective view showing a conventional chip-shaped electronic component 1 which is of interest to the present invention.

[Explanation of symbols]

 21 Chip-shaped electronic component 22 Element body 25 Piezoelectric substrate 26, 27 Input / output side extraction electrode 28 Ground side extraction electrode 36, 37, 38 Terminal member 40, 41 Resin exterior material

Claims (2)

[Claims] 1. An element body having lead-out electrodes formed at different positions on the surface thereof, and an element body electrically connected to each of the lead-out electrodes and mounted on the surface of the element body at a distance from each other. A chip-shaped electronic component, comprising: a plurality of electrically conductive terminal members having a predetermined thickness; and a resin exterior material provided on the surface of the element body with a thickness that does not exceed the thickness of the terminal members. 2. An element body having lead electrodes formed at different positions on its surface is prepared, and a plurality of conductive terminal members each having a predetermined thickness and electrically connected to the lead electrodes are prepared. Then, each of the terminal members is attached so as to be electrically connected to each of the extraction electrodes in a state in which they are spaced apart from each other on the surface of the element body, and a resin exterior material is provided on the surface of the element body. A method of manufacturing a chip-shaped electronic component, comprising: each step of applying and exposing the terminal member by shaving the resin exterior material from the surface thereof.