JPH05205973A - Manufacture of surface-mounting plastic film capacitor - Google Patents
Manufacture of surface-mounting plastic film capacitorInfo
- Publication number
- JPH05205973A JPH05205973A JP3730392A JP3730392A JPH05205973A JP H05205973 A JPH05205973 A JP H05205973A JP 3730392 A JP3730392 A JP 3730392A JP 3730392 A JP3730392 A JP 3730392A JP H05205973 A JPH05205973 A JP H05205973A
- Authority
- JP
- Japan
- Prior art keywords
- plastic film
- film capacitor
- case
- capacitor element
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、プリント基板への面実
装に適した構造の面実装用プラスチックフイルムコンデ
ンサの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a surface mounting plastic film capacitor having a structure suitable for surface mounting on a printed circuit board.
【0002】[0002]
【従来技術】従来、金属化プラスチックフイルムを巻き
回すか或いは積層したプラスチックフイルムコンデンサ
を面実装用にするためには、図3(a)に示すように金
属化プラスチックフイルムを巻き回すか或いは積層した
ものの両端に金属溶射を行ったコンデンサ素子70をリ
ードフレーム71の端子72,73間に挿入し、その金
属溶射部(メタリコン)70a,70bと端子72,7
3を溶接した後、図3(b)に示すように熱硬化性樹脂
でモールド成形して外装74を施した後、図3(c)に
示すように端子72,73をリードフレーム21より切
り離し、該端子72,73を外装74の表面に沿って折
り曲げて形成している。なお図4はこのようにして造ら
れた面実装用プラスチックフイルムコンデンサの構造を
示す側断面図である。2. Description of the Related Art Conventionally, in order to surface mount a plastic film capacitor in which a metallized plastic film is wound or laminated, as shown in FIG. 3A, a metallized plastic film is wound or laminated. The capacitor element 70 having metal sprayed on both ends of the object is inserted between the terminals 72 and 73 of the lead frame 71, and the metal sprayed portions (metallikon) 70a and 70b and the terminals 72 and 7 are inserted.
3 is welded, then molded with a thermosetting resin as shown in FIG. 3 (b) to form an exterior 74, and then the terminals 72, 73 are separated from the lead frame 21 as shown in FIG. 3 (c). The terminals 72 and 73 are formed by bending along the surface of the exterior 74. FIG. 4 is a side sectional view showing the structure of the surface mount plastic film capacitor thus manufactured.
【0003】[0003]
【発明が解決しようとする課題】しかしながら上記従来
のプラスチックフイルムコンデンサの面実装化する方法
には以下のような欠点があった。However, the above-mentioned conventional method of surface mounting the plastic film capacitor has the following drawbacks.
【0004】リードフレーム71の端子72,73間
へのコンデンサ素子70の挿入作業及び端子72,73
とコンデンサ素子70の両端の金属溶射部70a,70
bとの溶接作業が困難で且つ製品の歩留まりが悪い。Inserting the capacitor element 70 between the terminals 72 and 73 of the lead frame 71 and the terminals 72 and 73.
And metal sprayed parts 70a, 70 on both ends of the capacitor element 70
The welding work with b is difficult and the product yield is poor.
【0005】外装74が樹脂成形加工(モールド)に
よるため、量産性、経済性に不利でコスト高となる。Since the exterior 74 is formed by resin molding, it is disadvantageous in mass productivity and economical efficiency, and the cost is high.
【0006】そこで本願出願人は上記欠点を解決するた
め、特願平3−237305号の特許出願において、新
規な面実装用プラスチックフイルムコンデンサの製造方
法を提案した。Therefore, in order to solve the above-mentioned drawbacks, the applicant of the present invention has proposed a novel method for manufacturing a plastic film capacitor for surface mounting in the patent application of Japanese Patent Application No. 3-237305.
【0007】この発明は、両端に金属溶射部を有する複
数個のプラスチックフイルムコンデンサ素子を樹脂製の
ケース内に整列して収納し、該ケース内に溶融樹脂を注
入して硬化し、前記プラスチックフイルムコンデンサ素
子の金属溶射面が露出するまで該ケースを研磨し、該研
磨面に金属溶射或いは導電ペーストにより外部電極を形
成し、該外部電極面に半田メッキ或いは半田上げを施
し、さらに前記プラスチックフイルムコンデンサ素子を
個々に切り分けて面実装用プラスチックフイルムコンデ
ンサを製造するものであった。これによって自動化及び
量産性に優れた面実装用プラスチックフイルムコンデン
サの製造方法が提供できた。According to the present invention, a plurality of plastic film capacitor elements having metal sprayed portions at both ends are arranged and housed in a case made of resin, and a molten resin is injected into the case to cure the plastic film. The case is polished until the metal sprayed surface of the capacitor element is exposed, external electrodes are formed on the polished surface by metal spraying or conductive paste, and solder plating or soldering is applied to the external electrode surface, and the plastic film capacitor The element was cut into individual pieces to manufacture a surface mount plastic film capacitor. As a result, a method of manufacturing a plastic film capacitor for surface mounting which is excellent in automation and mass productivity can be provided.
【0008】しかしながらこの発明においても以下のよ
うな欠点があった。 樹脂製のケースの研磨は時間のかかる工程であり、そ
の生産性を低下させる。However, this invention also has the following drawbacks. Polishing a resin case is a time-consuming process and reduces its productivity.
【0009】樹脂の研磨は多量の粉塵を発生させ、作
業環境を悪化させてしまう。Polishing the resin produces a large amount of dust and deteriorates the working environment.
【0010】本発明は上述の点に鑑みてなされたもので
あり、その目的は、自動化及び量産性に優れ、しかも研
磨をすることなくその生産が行える面実装用プラスチッ
クフイルムコンデンサの製造方法を提供することにあ
る。The present invention has been made in view of the above points, and an object thereof is to provide a method of manufacturing a plastic film capacitor for surface mounting, which is excellent in automation and mass productivity and can be manufactured without polishing. To do.
【0011】[0011]
【課題を解決するための手段】上記問題点を解決するた
め本発明は面実装用プラスチックフイルムコンデンサを
下記の工程により製造した。金属化プラスチックフイル
ムを巻き回すか或いは積層し、対向端面に金属溶射を施
してなるプラスチックフイルムコンデンサ素子を、幅方
向の内寸法が該プラスチックフイルムコンデンサ素子の
金属溶射を施した端面間の寸法よりも所定寸法大きく且
つ該幅方向の両側面に一定間隔で貫通孔を設けた長尺の
ケース内に、該貫通孔の中心が前記プラスチックフイル
ムコンデンサ素子の金属溶射面の中心にほぼ位置するよ
うに複数個整列配置する工程、ケースの両側面に、貫通
孔を介して前記プラスチックフイルムコンデンサ素子の
金属溶射部と電気的に接続するように金属溶射を行って
外部電極を形成する工程、ケース内に溶融樹脂を注入し
硬化する工程、外部電極に半田上げ或いは半田メッキを
行った後に前記プラスチックフイルムコンデンサ素子を
個々に切り割ける工程。In order to solve the above problems, according to the present invention, a surface mount plastic film capacitor is manufactured by the following steps. A plastic film capacitor element obtained by winding or laminating a metallized plastic film and subjecting the opposite end surfaces to metal spraying, has an inner dimension in the width direction larger than a dimension between the metal sprayed end surfaces of the plastic film capacitor element. In a long case having a large predetermined size and having through holes formed on both side surfaces in the width direction at regular intervals, a plurality of holes are formed so that the centers of the through holes are substantially located at the center of the metal sprayed surface of the plastic film capacitor element. The step of arranging the individual pieces, the step of forming external electrodes by performing metal spraying on both sides of the case so as to electrically connect to the metal sprayed part of the plastic film capacitor element through the through holes, and melting in the case The step of injecting and hardening the resin, the soldering or solder plating on the external electrodes, and then the plastic film condensation Process to avoid cutting the element individually.
【0012】[0012]
【作用】上記の工程により面実装用プラスチックフイル
ムコンデンサを製造するので、自動化及び量産性に適す
る。また上記の工程には研磨工程がないので、生産性が
向上し多量の粉塵による作業環境の悪化という事態を生
じない。The plastic film capacitor for surface mounting is manufactured by the above process, which is suitable for automation and mass productivity. Further, since there is no polishing step in the above steps, the productivity is improved and the situation that the working environment is not deteriorated by a large amount of dust does not occur.
【0013】[0013]
【実施例】以下、本発明の1実施例を図面に基づいて詳
細に説明する。図1(a)乃至(e)は本発明にかかる
面実装用プラスチックフイルムコンデンサの製造工程を
説明するための図である。なお図1(a),(b),
(e)は斜視図、図1(c),(d)は幅方向の断面図
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. 1 (a) to 1 (e) are views for explaining a manufacturing process of a surface mount plastic film capacitor according to the present invention. 1 (a), (b),
1E is a perspective view, and FIGS. 1C and 1D are cross-sectional views in the width direction.
【0014】即ちまず同図(a)に示すように、金属化
プラスチックフイルムを巻き回すか或いは積層し、これ
にエポキシ樹脂を含浸させ、更に対向する端面に金属溶
射を施して金属溶射部11,12を形成してなるプラス
チックフイルムコンデンサ素子1を用意する。That is, first, as shown in FIG. 1A, a metallized plastic film is wound or laminated, and an epoxy resin is impregnated into the metallized plastic film, and the opposite end surfaces are metal-sprayed to form a metal sprayed portion 11. A plastic film capacitor element 1 formed by forming 12 is prepared.
【0015】次に、同図(b)に示すように、幅方向の
内寸法L2が前記プラスチックフイルムコンデンサ素子
1の金属溶射部11,12の端面間の寸法L1よりも所
定寸法(0.1mm〜0.2mm程度)大きく、且つその幅方向の
両側面21,22にそれぞれ一定間隔毎に貫通孔23,
24を設けた長尺の樹脂製のケース2を用意する。なお
このケース2を構成する樹脂材料としては熱変形温度が
180℃以上のものが望ましく、例えば、エポキシ樹
脂、フェノール樹脂、PPS系樹脂等を用いる。Next, as shown in FIG. 1B, the inner dimension L2 in the width direction is a predetermined dimension (0.1 mm to 0.1 mm) from the dimension L1 between the end faces of the metal sprayed parts 11, 12 of the plastic film capacitor element 1. About 0.2 mm) and through holes 23 are formed on both side surfaces 21 and 22 in the width direction at regular intervals.
A long resin case 2 provided with 24 is prepared. The case 2 is preferably made of a resin material having a heat distortion temperature of 180 ° C. or higher. For example, epoxy resin, phenol resin, PPS resin, or the like is used.
【0016】そして同図(b)に示すように、前記プラ
スチックフイルムコンデンサ素子1を複数個ケース2内
に整列して収納する。このとき各プラスチックフイルム
コンデンサ素子1の金属溶射部11,12の端面の中心
がケース2の各貫通孔23,24の中心にほぼ位置する
ようにする。Then, as shown in FIG. 1B, a plurality of the plastic film capacitor elements 1 are arranged and housed in the case 2. At this time, the centers of the end faces of the metal sprayed parts 11, 12 of each plastic film capacitor element 1 are made to be substantially located at the centers of the through holes 23, 24 of the case 2.
【0017】次に同図(c)に示すように、ケース2の
両側面21,22全体に金属溶射を行い、外部電極3,
4を形成する。これによって該外部電極3,4とプラス
チックフイルムコンデンサ素子1の金属溶射部11,1
2は貫通孔23,24を通して電気的に接続される。な
おケース2の両側面21,22はそのままでは溶射金属
が密着しにくいので、金属溶射前に予め粗面化しておく
必要がある。この粗面化は、例えば図2にその断面形状
を示すように、幅0.05mm〜0.1mm、深さ0.15mm〜0.2mm程
度のくさび状の微小溝をニードル打ちやブラスター処理
により、密度500〜700個/cm2で形成して行う。Next, as shown in FIG. 2C, the outer surfaces of both side surfaces 21 and 22 of the case 2 are sprayed by metal spraying to form the external electrodes 3, 3.
4 is formed. As a result, the external electrodes 3, 4 and the metal sprayed parts 11, 1 of the plastic film capacitor element 1 are
2 is electrically connected through the through holes 23 and 24. Since the sprayed metal does not easily adhere to both side surfaces 21 and 22 of the case 2 as it is, it is necessary to roughen the surface in advance before spraying the metal. For example, as shown in the cross-sectional shape in FIG. 2, this roughening is performed by needle-punching or blasting a wedge-shaped fine groove with a width of 0.05 mm to 0.1 mm and a depth of 0.15 mm to 0.2 mm to obtain a density of 500 to It performed to form at 700 / cm 2.
【0018】なお貫通孔23,24はプラスチックフイ
ルムコンデンサ素子1の金属溶射部11,12の端面の
面積よりも小さく形成しておく必要がある。何故ならケ
ース2の側面21,22に金属溶射を行った際に該貫通
孔23,24からケース2内部に金属が導入(スプレー
導通)されないようにするためである。但し該貫通孔2
3,24が円形の場合、外部電極3,4と金属溶射部1
1,12間の電気的接続を確実にするためその径は1φ
以上であることが好ましい。The through holes 23, 24 must be formed smaller than the area of the end faces of the metal sprayed parts 11, 12 of the plastic film capacitor element 1. This is because metal is not introduced (sprayed) into the case 2 through the through holes 23 and 24 when the side surfaces 21 and 22 of the case 2 are sprayed with metal. However, the through hole 2
When the electrodes 3 and 24 are circular, the external electrodes 3 and 4 and the metal sprayed portion 1
The diameter is 1φ to ensure the electrical connection between 1 and 12.
The above is preferable.
【0019】次に同図(d)に示すように、ケース2内
に液状の樹脂5を注入してプラスチックフイルムコンデ
ンサ素子1を封止した後、該樹脂5を硬化させる。この
樹脂5としては熱硬化性のエポキシ樹脂等を用いる。Next, as shown in FIG. 3D, a liquid resin 5 is injected into the case 2 to seal the plastic film capacitor element 1 and then the resin 5 is cured. A thermosetting epoxy resin or the like is used as the resin 5.
【0020】そして外部電極3,4の面に半田メッキ或
いは半田上げを行った後に、図1(e)に示すように、
個々のプラスチックフイルムコンデンサ素子1をそれを
覆うケース2等と共に切り割けて、面実装用プラスチッ
クフイルムコンデンサ6を製造する。After solder plating or soldering is performed on the surfaces of the external electrodes 3 and 4, as shown in FIG.
The individual plastic film capacitor element 1 is cut together with the case 2 and the like covering it to manufacture the surface mounting plastic film capacitor 6.
【0021】[0021]
【発明の効果】以上詳細に説明したように、本発明にか
かる面実装用プラスチックフイルムコンデンサの製造方
法によれば、以下のような優れた効果を有する。 ケース内に複数のプラスチックフイルムコンデンサ素
子を整列・収納し、その両側面に外部電極を形成し、ケ
ース内に樹脂を注入・硬化し個々切り割けるという工程
で生産されるので、自動化及び量産性に優れている。As described in detail above, according to the method of manufacturing the surface mount plastic film capacitor of the present invention, the following excellent effects are obtained. Multiple plastic film capacitor elements are arranged and housed in the case, external electrodes are formed on both sides of the case, and the resin is injected into the case, cured, and individually cut into pieces. Is excellent in
【0022】研磨を用いないでその生産が行えるの
で、生産性が向上し多量の粉塵による作業環境の悪化と
いう事態も生じない。Since the production can be performed without using polishing, the productivity is improved and the situation that the working environment is not deteriorated by a large amount of dust does not occur.
【図1】本発明にかかる面実装用プラスチックフイルム
コンデンサの製造工程を説明するための図である。FIG. 1 is a diagram for explaining a manufacturing process of a plastic film capacitor for surface mounting according to the present invention.
【図2】粗面化した面の断面形状を示す図である。FIG. 2 is a diagram showing a cross-sectional shape of a roughened surface.
【図3】従来の面実装用プラスチックフイルムコンデン
サの製造工程を説明するための図である。FIG. 3 is a view for explaining a manufacturing process of a conventional surface-mount plastic film capacitor.
【図4】従来の面実装用プラスチックフイルムコンデン
サの構造を示す側断面図である。FIG. 4 is a side sectional view showing a structure of a conventional surface mount plastic film capacitor.
1 プラスチックフイルムコンデンサ素子 11,12 金属溶射部 2 ケース 23,24 貫通孔 3,4 外部電極 5 樹脂 1 Plastic Film Capacitor Element 11, 12 Metal Sprayed Part 2 Case 23, 24 Through Hole 3,4 External Electrode 5 Resin
Claims (1)
か或いは積層し、対向端面に金属溶射を施してなるプラ
スチックフイルムコンデンサ素子を、幅方向の内寸法が
該プラスチックフイルムコンデンサ素子の金属溶射を施
した端面間の寸法よりも所定寸法大きく且つ両側面に一
定間隔で貫通孔を設けた長尺のケース内に、該貫通孔の
中心が前記プラスチックフイルムコンデンサ素子の金属
溶射面の中心にほぼ位置するように複数個整列配置する
工程と、 該ケースの両側面に、貫通孔を介して前記プラスチック
フイルムコンデンサ素子の金属溶射部と電気的に接続す
るように金属溶射を行って外部電極を形成する工程と、 該ケース内に溶融樹脂を注入し硬化する工程と、 外部電極に半田上げ或いは半田メッキを行った後に前記
プラスチックフイルムコンデンサ素子を個々に切り割け
る工程からなることを特徴とする面実装用プラスチック
フイルムコンデンサの製造方法。1. A plastic film capacitor element formed by winding or laminating a metallized plastic film and subjecting opposite end surfaces to metal spraying, wherein the inner dimension in the width direction is the metal sprayed end surface of the plastic film capacitor element. In a long case having a predetermined size larger than the space therebetween and having through holes formed on both side surfaces at regular intervals, the center of the through holes is located substantially at the center of the metal sprayed surface of the plastic film capacitor element. A step of arranging a plurality of pieces, and a step of performing metal spraying to form external electrodes on both side surfaces of the case so as to be electrically connected to the metal sprayed part of the plastic film capacitor element through a through hole, A step of injecting a molten resin into the case and hardening it, and a step of soldering or solder-plating the external electrodes, and then the plastic foil A method of manufacturing a plastic film capacitor for surface mounting, comprising a step of individually cutting the film capacitor element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3730392A JPH05205973A (en) | 1992-01-28 | 1992-01-28 | Manufacture of surface-mounting plastic film capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3730392A JPH05205973A (en) | 1992-01-28 | 1992-01-28 | Manufacture of surface-mounting plastic film capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05205973A true JPH05205973A (en) | 1993-08-13 |
Family
ID=12493938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3730392A Pending JPH05205973A (en) | 1992-01-28 | 1992-01-28 | Manufacture of surface-mounting plastic film capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05205973A (en) |
-
1992
- 1992-01-28 JP JP3730392A patent/JPH05205973A/en active Pending
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