JP3107388B2 - Terminal structure of solid electrolytic capacitor - Google Patents
Terminal structure of solid electrolytic capacitorInfo
- Publication number
- JP3107388B2 JP3107388B2 JP02234470A JP23447090A JP3107388B2 JP 3107388 B2 JP3107388 B2 JP 3107388B2 JP 02234470 A JP02234470 A JP 02234470A JP 23447090 A JP23447090 A JP 23447090A JP 3107388 B2 JP3107388 B2 JP 3107388B2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- solid electrolytic
- terminal
- resin
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、小形電子機器で使用されるプリント基板
等への表面実装用に適した固体電解コンデンサの端子構
造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure of a solid electrolytic capacitor suitable for surface mounting on a printed circuit board or the like used in a small electronic device.
近年、電子機器の小形化、携帯化が進むに伴い電子部
品の高密度実装技術が必要不可欠となってきている。こ
の高密度実装のため、抵抗器や積層セラミックコンデン
サ等は、チップ部品と呼ばれる大きさ1.6×0.8mm2（160
8部品）や1.0×0.5mm2の超小形品（1005部品）までが開
発されている。このような状況のもとで、比較的大容量
の特性を有する電解コンデンサも従来のような円筒形で
リード端子付きのものから、より一層の小形化を図った
表面実装用に適したリードレスの角型固体電解コンデン
サが開発されている。In recent years, as electronic devices have become smaller and more portable, high-density mounting technology of electronic components has become indispensable. For this high-density mounting, resistors and multilayer ceramic capacitors, etc., the size called chip components 1.6 × 0.8mm 2 (160
8 parts) and 1.0 × 0.5mm 2 of the ultra-small products up to (1005 parts) have been developed. Under these circumstances, electrolytic capacitors with relatively large capacity characteristics have been replaced with cylindrical leaded terminals as in the past, and leadless suitable for surface mounting with a more compact design. Has been developed.
この種の角型固体電解コンデンサとして、第３図に示
すようなものが知られている。第３図（Ａ）乃至（Ｄ）
は、従来の表面実装用固体アルミ電解コンデンサの製造
における主要工程を工程順に概略的に示した外観斜視図
である。As this type of rectangular solid electrolytic capacitor, the one shown in FIG. 3 is known. FIG. 3 (A) to (D)
FIG. 2 is an external perspective view schematically showing main steps in manufacturing a conventional solid aluminum electrolytic capacitor for surface mounting in the order of steps.
第３図（Ａ）において参照符号10はコンデンサ素子で
あり、このコンデンサ素子10はプラス電極およびマイナ
ス電極用の各アルミ箔をセパレータを介して巻回したも
のである。尚、各アルミ箔を巻回する際には予めコンデ
ンサ素子10の端子取出し口となる金属端子（例えば、ア
ルミ丸棒）12,14が各アルミ箔に取り付けられている。
第３図（Ｂ）は、上記コンデンサ素子10を硝酸マンガン
に含浸して焼成し二酸化マンガン（MnO2）層を形成した
後、新たにリード線16,18を金属端子12,14に溶接したと
ころを示したものである。次に、第３図（Ｃ）に示すよ
うにこのリード線16,18をフォーミングする。更に、第
３図（Ｄ）において角型の樹脂ケース20内にコンデンサ
素子10を挿入した後、樹脂ケース内にエポキシ樹脂22に
より封口し、次いでリード線16,18の余分な長さをカッ
トした後、図示のように角型ケースの側面に沿って再度
フォーミングして完成する。In FIG. 3 (A), reference numeral 10 denotes a capacitor element, and the capacitor element 10 is formed by winding aluminum foils for a positive electrode and a negative electrode via a separator. When winding each aluminum foil, metal terminals (for example, aluminum round bars) 12 and 14 serving as terminal outlets of the capacitor element 10 are attached to each aluminum foil in advance.
FIG. 3 (B) shows that the capacitor element 10 is impregnated with manganese nitrate and fired to form a manganese dioxide (MnO 2 ) layer, and then the lead wires 16 and 18 are newly welded to the metal terminals 12 and 14. It is shown. Next, as shown in FIG. 3 (C), the leads 16, 18 are formed. Further, after the capacitor element 10 was inserted into the square resin case 20 in FIG. 3 (D), the resin case was sealed with the epoxy resin 22, and then the extra length of the lead wires 16, 18 was cut. Thereafter, forming is performed again along the side surface of the rectangular case as shown in the drawing to complete the case.
このようにして、電子部品のリード線を挿通する透孔
のない、いわゆるフェイスボンディング基板に載置して
使用される表面実装用に適したリードレス型固体電解コ
ンデンサを得ることができる。In this way, it is possible to obtain a leadless type solid electrolytic capacitor suitable for surface mounting, which is used by being mounted on a so-called face bonding substrate and having no through hole through which the lead wire of the electronic component is inserted.
しかしながら、前述した固体電解コンデンサの構造で
は、コンデンサ素子10のリード線16,18を樹脂ケース20
に封口する前に溶接したり、フォーミングしたりする加
工が行われるため、コンデンサ素子10に対するストレス
が大きく歩留まりや信頼性の点で難点があった。However, in the structure of the solid electrolytic capacitor described above, the leads 16, 18 of the capacitor element 10 are connected to the resin case 20.
Since a process of welding or forming is performed prior to sealing, the stress on the capacitor element 10 is large and there is a problem in terms of yield and reliability.
また、コンデンサ素子10を樹脂ケース20内にエポキシ
樹脂22等で封口する際、樹脂の量が多すぎて樹脂ダレが
生じることのないように、樹脂22のポッティング量の適
正な管理および調整作業が必要であるといった煩わしさ
があった。In addition, when the capacitor element 10 is sealed in the resin case 20 with the epoxy resin 22 or the like, proper management and adjustment work of the potting amount of the resin 22 is performed so that the amount of the resin is not excessive and the resin does not sag. There was trouble that it was necessary.
さらに、樹脂ケース20内に注入したエポキシ樹脂22等
は、その溶融状態において表面張力による凹凸を形成す
る。そのため、凹部におけるコンデンサ素子10までの厚
さを充分確保するためには、コンデンサ素子10の長さに
比べて、樹脂ケース20をかなり長くせざるを得ず体積効
率からみてあまり良いとは言えなかった。Further, the epoxy resin 22 and the like injected into the resin case 20 form irregularities due to surface tension in a molten state. Therefore, in order to ensure a sufficient thickness up to the capacitor element 10 in the concave portion, the resin case 20 must be considerably longer than the length of the capacitor element 10, and it cannot be said that it is not very good in terms of volumetric efficiency. Was.
そこで、本発明の目的は、樹脂のポッティング量の管
理調整を不用にできると共に信頼性の向上が図れ、さら
に小形化も図れる表面実装用に適した固体電解コンデン
サの端子構造を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a terminal structure of a solid electrolytic capacitor suitable for surface mounting, which can make the management and adjustment of the potting amount of the resin unnecessary, can improve the reliability, and can further reduce the size.
本発明に係る固体電解コンデンサの端子構造は、プラ
ス電極およびマイナス電極用の各金属箔に金属端子をそ
れぞれ取付けると共にセパレータを介して各金属箔を巻
回した後、半導体母液に含浸焼成し、再化成処理を行っ
て形成されるコンデンサ素子を角型樹脂ケースに挿入し
エポキシ樹脂等で封口して作られる固体電解コンデンサ
において、 前記角型樹脂ケースの金属端子側の側面を該金属端子
とエポキシ樹脂とが露出するようエポキシ樹脂と共に切
断し、この露出した各金属端子に対して外部接続用端子
をそれぞれ設けることを特徴とする。The terminal structure of the solid electrolytic capacitor according to the present invention is such that, after attaching a metal terminal to each of the metal foils for the plus electrode and the minus electrode, winding each metal foil through a separator, impregnating and firing the semiconductor mother liquor, In a solid electrolytic capacitor made by inserting a capacitor element formed by performing a chemical conversion treatment into a rectangular resin case and sealing it with an epoxy resin or the like, the metal terminal side of the square resin case is formed of a metal terminal and an epoxy resin. Are cut together with the epoxy resin so that the exposed metal terminals are exposed, and an external connection terminal is provided for each of the exposed metal terminals.
本発明に係る固体電解コンデンサの端子構造によれ
ば、エポキシ樹脂と共に切断して角型樹脂ケースの露出
した金属端子に対し外部接続用端子の金属板片を超音波
溶接またはレーザ溶接により接続する端子構造であるた
め、すなわち封口後の加工を可能とする端子構造である
ため、封口前にリード線などのフォーミング加工をしな
ければならない従来の端子構造に比べて、コンデンサ素
子に対するストレスを軽減することができる。ADVANTAGE OF THE INVENTION According to the terminal structure of the solid electrolytic capacitor which concerns on this invention, the terminal which cuts with an epoxy resin and connects the metal plate piece of an external connection terminal to the exposed metal terminal of a square resin case by ultrasonic welding or laser welding. Due to the structure, that is, the terminal structure that enables processing after sealing, reducing stress on the capacitor element compared to the conventional terminal structure that requires forming processing such as lead wires before sealing. Can be.
次に、本発明に係る固体電解コンデンサの端子構造の
実施例につき、添付図面を参照しながら以下詳細に説明
する。Next, an embodiment of a terminal structure of a solid electrolytic capacitor according to the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明の一実施例を示す固体電解コンデンサ
の外観斜視図であり、第２図（Ａ）乃至（Ｄ）は、本発
明に係る表面実装用固体アルミ電解コンデンサの主要製
造工程を工程順に概略的に示した外観斜視図である。FIG. 1 is an external perspective view of a solid electrolytic capacitor showing one embodiment of the present invention, and FIGS. 2 (A) to 2 (D) show main manufacturing steps of a solid aluminum electrolytic capacitor for surface mounting according to the present invention. It is the external appearance perspective view shown roughly in the order of process.
第２図（Ａ）において参照符号10はコンデンサ素子で
あり、第３図（Ａ）の従来例と同様にコンデンサ素子10
はプラス電極およびマイナス電極用の各アルミ箔をセパ
レータを介して巻回したものである。尚、各アルミ箔を
巻回する際には予めコンデンサ素子10の端子取出し口と
なる金属端子（例えば、アルミ丸棒）12,14が各アルミ
箔に取付けられている。第２図（Ｂ）は、上記コンデン
サ素子10を硝酸マンガンに含浸して焼成し二酸化マンガ
ン（MnO2）層を形成した後、角型樹脂ケース24内に挿入
しエポキシ樹脂22により封口した状態を示す。第２図
（Ｃ）において、角型樹脂ケース24の金属端子側の側面
をエポキシ樹脂22および金属端子12,14と共に切断す
る。第２図（Ｄ）において露出した金属端子12,14にそ
れぞれ外部接続用端子の金属板片26,28を超音波溶接ま
たはレーザ溶接等の溶接30により取付ける。最後に第１
図に示すように樹脂ケース24上に定格や電極の極性等を
印刷すれば、表面実装用固体電解コンデンサの完成であ
る。In FIG. 2A, reference numeral 10 denotes a capacitor element, which is the same as in the conventional example of FIG. 3A.
Is obtained by winding each aluminum foil for a plus electrode and a minus electrode via a separator. When winding each aluminum foil, metal terminals (for example, aluminum round bars) 12 and 14 serving as terminal outlets of the capacitor element 10 are attached to each aluminum foil in advance. FIG. 2B shows a state in which the capacitor element 10 is impregnated with manganese nitrate and fired to form a manganese dioxide (MnO 2 ) layer, which is then inserted into a rectangular resin case 24 and sealed with an epoxy resin 22. Show. In FIG. 2 (C), the side surface of the square resin case 24 on the metal terminal side is cut together with the epoxy resin 22 and the metal terminals 12 and 14. Metal plate pieces 26 and 28 as external connection terminals are attached to the exposed metal terminals 12 and 14 in FIG. 2 (D) by welding 30 such as ultrasonic welding or laser welding. Finally the first
As shown in the figure, when the rating, the polarity of the electrodes, and the like are printed on the resin case 24, the solid electrolytic capacitor for surface mounting is completed.
なお、本実施例では、露出した金属端子12,14にそれ
ぞれ外部接続用端子の金属板片26,28との電気的な接続
は溶接により行う場合を示したが、ワイヤボンディング
（図示せず）により接続することも可能である。ワイヤ
ボンディングを使用する場合には、ワイヤの太さまたは
並列本数を適当に選択することによってワイヤを流れる
電流容量を所望の上限値に設定でき、上限値を越えるよ
うな過電流時あるいはショート時にはワイヤの溶断によ
て発火防止を図ることができる。In this embodiment, the case where the exposed metal terminals 12 and 14 are electrically connected to the metal plate pieces 26 and 28 of the external connection terminals by welding, respectively, is shown, but wire bonding (not shown) is used. Can also be connected. When wire bonding is used, the current capacity flowing through the wire can be set to a desired upper limit by appropriately selecting the thickness or the number of parallel wires. It is possible to prevent ignition by fusing.
前述した実施例から明らなように、本発明の固体電解
コンデンサの端子構造によれば、コンデンサ素子をエポ
キシ樹脂などにより封口した後に外部接続用端子を取付
ける構造であるため、コンデンサ素子に対するストレス
が軽減され、製品の信頼性向上に効果を奏する。As is apparent from the above-described embodiment, according to the terminal structure of the solid electrolytic capacitor of the present invention, since the capacitor element is sealed with epoxy resin or the like and the external connection terminal is attached, stress on the capacitor element is reduced. This is effective in improving product reliability.
また、不要な長さの樹脂ケースを切断してから外部接
続用端子を取付ける構造であるため、同一容量のコンデ
ンサ素子に対する従来の樹脂ケースの大きさと比べて小
さくなり、体積効率が向上する。In addition, since the external connection terminal is attached after cutting the unnecessary length of the resin case, the size is smaller than the size of the conventional resin case for the capacitor element having the same capacity, and the volume efficiency is improved.
さらに、封口後エポキシ樹脂も含めて樹脂ケースを切
断してしまうため、樹脂面の管理やポッティング量の調
整が不要であり、樹脂ダレもない。Furthermore, since the resin case including the epoxy resin is cut after sealing, it is not necessary to manage the resin surface and adjust the amount of potting, and there is no resin dripping.
また、コンデンサ素子の金属端子と樹脂ケースに取付
けた外部接続用端子との接続にワイヤボンディングを用
いる場合には、ワイヤが過電流に対する溶断ヒューズと
して働き発火防止に役立てることができる。When wire bonding is used to connect the metal terminal of the capacitor element to the external connection terminal attached to the resin case, the wire functions as a fusing fuse against overcurrent and can be used to prevent ignition.
以上、本発明の好適な実施例について説明したが、本
発明は前記実施例に限定されることなく、本発明の精神
を逸脱しない範囲内において種々の設計変更をなし得る
ことは勿論である。The preferred embodiment of the present invention has been described above. However, the present invention is not limited to the above-described embodiment, and it is needless to say that various design changes can be made without departing from the spirit of the present invention.
第１図は本発明に係る固体電解コンデンサの一実施例を
示す外観斜視図、第２図（Ａ）乃至（Ｄ）は本発明に係
る表面実装用固体アルミ電解コンデンサの主要製造工程
を工程順に概略的に示した外観斜視図、第３図（Ａ）乃
至（Ｄ）は従来の表面実装用固体アルミ電解コンデンサ
の製造における主要工程を概略的に示した外観斜視図で
ある。 10……コンデンサ素子 12,14……金属端子 16,18……リード線 20……樹脂ケース 22……エポキシ樹脂 24……樹脂ケース 26,28……外部接続用端子の金属板片 30……溶接FIG. 1 is an external perspective view showing one embodiment of a solid electrolytic capacitor according to the present invention, and FIGS. 2 (A) to 2 (D) show the main manufacturing steps of a solid aluminum electrolytic capacitor for surface mounting according to the present invention in the order of steps. FIGS. 3 (A) to 3 (D) are perspective views schematically showing main steps in manufacturing a conventional solid aluminum electrolytic capacitor for surface mounting. 10 Capacitor element 12, 14 Metal terminal 16, 18 Lead wire 20 Resin case 22 Epoxy resin 24 Resin case 26, 28 Metal plate piece for external connection terminal 30 welding
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 9/008 H01G 9/08 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01G 9/008 H01G 9/08
Claims (1)
箔に金属端子をそれぞれ取付けると共にセパレータを介
して各金属箔を巻回した後、半導体母液に含浸焼成し、
再化成処理を行って形成されたコンデンサ素子を角型樹
脂ケースに挿入しエポキシ樹脂等で封口して作られる固
体電解コンデンサにおいて、 前記角型樹脂ケースの金属端子側の側面を該金属端子と
エポキシ樹脂とが露出するようエポキシ樹脂と共に切断
し、この露出した各金属端子に対して外部接続用端子を
それぞれ設けることを特徴とする固体電解コンデンサの
端子構造。1. A metal terminal is attached to each metal foil for a positive electrode and a negative electrode, and each metal foil is wound through a separator, and then impregnated and fired in a semiconductor mother liquor.
In a solid electrolytic capacitor made by inserting a capacitor element formed by performing a re-chemical treatment into a rectangular resin case and sealing with an epoxy resin or the like, A terminal structure for a solid electrolytic capacitor, characterized in that the terminal is cut with an epoxy resin so that the resin is exposed, and an external connection terminal is provided for each of the exposed metal terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02234470A JP3107388B2 (en) | 1990-09-06 | 1990-09-06 | Terminal structure of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02234470A JP3107388B2 (en) | 1990-09-06 | 1990-09-06 | Terminal structure of solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04116815A JPH04116815A (en) | 1992-04-17 |
| JP3107388B2 true JP3107388B2 (en) | 2000-11-06 |
Family
ID=16971515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02234470A Expired - Fee Related JP3107388B2 (en) | 1990-09-06 | 1990-09-06 | Terminal structure of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3107388B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9599805B2 (en) | 2011-10-19 | 2017-03-21 | National Synchrotron Radiation Research Center | Optical imaging system using structured illumination |
-
1990
- 1990-09-06 JP JP02234470A patent/JP3107388B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9599805B2 (en) | 2011-10-19 | 2017-03-21 | National Synchrotron Radiation Research Center | Optical imaging system using structured illumination |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04116815A (en) | 1992-04-17 |
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