JPH04116815A - Terminal structure of solid electrolytic capacitor - Google Patents
Terminal structure of solid electrolytic capacitorInfo
- Publication number
- JPH04116815A JPH04116815A JP23447090A JP23447090A JPH04116815A JP H04116815 A JPH04116815 A JP H04116815A JP 23447090 A JP23447090 A JP 23447090A JP 23447090 A JP23447090 A JP 23447090A JP H04116815 A JPH04116815 A JP H04116815A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- terminals
- electrolytic capacitor
- resin
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 47
- 239000007787 solid Substances 0.000 title claims description 21
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 4
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000004382 potting Methods 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、小形電子機器で使用されるプリント基板等
への表面実装用に適した固体電解コンデンサの端子構造
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a terminal structure of a solid electrolytic capacitor suitable for surface mounting on a printed circuit board or the like used in small electronic equipment.
近年、電子機器の小形化、携帯化が進むに伴い電子部品
の高密度実装技術が必要不可欠となってきている。この
高密度実装のため、抵抗器や積層セラミックコンデンサ
等は、チップ部品と呼ばれる大きさ１．６Ｘ０．８ｍｍ
２ （１６０８部品）や１．ＯＸｏ、５ｍｍ’の超小形
品（１００５部品）までが開発されている。このような
状況のもとで、比較的大容量の特性を有する電解コンデ
ンサも従来のような円筒形でリード端子付きのものから
、より一層の小形化を図った表面実装用に適したリード
レスの角型固体電解コンデンサが開発されている。In recent years, as electronic devices have become smaller and more portable, high-density packaging technology for electronic components has become essential. Because of this high-density mounting, resistors, multilayer ceramic capacitors, etc. are called chip components with a size of 1.6 x 0.8 mm.
2 (1608 parts) and 1. OXo, ultra-small products (1005 parts) of 5mm' have been developed. Under these circumstances, electrolytic capacitors with relatively large capacity characteristics have changed from the conventional cylindrical shape with lead terminals to leadless capacitors that are more compact and suitable for surface mounting. A square solid electrolytic capacitor has been developed.
この種の角型固体電解コンデンサとして、第３図に示す
ようなものが知られている。第３図（Ａ）乃至（０）は
、従来の表面実装用固体アルミ電解コンデンサの製造に
おける主要工程を工程順に概略的に示した外観斜視図で
ある。As this type of rectangular solid electrolytic capacitor, one shown in FIG. 3 is known. FIGS. 3(A) to 3(0) are external perspective views schematically showing the main steps in manufacturing a conventional surface-mount solid aluminum electrolytic capacitor in order of process.
第３図（Ａ）において参照符号１０はコンデンサ素子で
あり、このコンデンサ素子１０はプラスｔ［！およびマ
イナス電極用の各アルミ箔をセパレータを介して巻回し
たものである。In FIG. 3(A), reference numeral 10 is a capacitor element, and this capacitor element 10 is plus t[! and each aluminum foil for the negative electrode is wound with a separator in between.
尚、各アルミ箔を巻回する際には予めコンデンサ素子１
０の端子取出し口となる金属端子（例えば、アルミ九＠
）１２．１４が各アルミ箔に取り付けられている。第３
図（Ｂ）は、上記コンデンサ素子１０を硝酸マンガンに
含浸して焼成し二酸化マンガン（ＭｎＯ□）層を形成し
た後、新たにリード１１１６．１８を金属端子１２．１
４に溶接したところを示したものである０次に、第３図
（Ｃ）に示すようにこのリード１１１６．１８をフォー
ミングする。更に、第３図（Ｄ）において角型の樹脂ケ
ース２０内にコンデンサ素子１０を挿入した後、樹脂ケ
ース内にエポキシ樹脂２２により封口し、次いでリード
線１６．１８の余分な長さをカットした後、図示のよう
に角型ケースの側面に沿って再度フォーミングして完成
する。In addition, when winding each aluminum foil, capacitor element 1
Metal terminal (for example, aluminum 9@
) 12.14 are attached to each aluminum foil. Third
Figure (B) shows that after the capacitor element 10 is impregnated with manganese nitrate and fired to form a manganese dioxide (MnO□) layer, a new lead 1116.18 is attached to the metal terminal 12.1.
This lead 1116.18 is shown in FIG. 3(C) as shown in FIG. 3(C). Furthermore, in FIG. 3(D), after the capacitor element 10 was inserted into the square resin case 20, the resin case was sealed with epoxy resin 22, and then the excess length of the lead wires 16 and 18 was cut. After that, as shown in the figure, the square case is formed again along the sides to complete the process.
このようにして、電子部品のリード線を押通する透孔の
ない、いわゆるフェイスボンディング基板に載置して使
用される表面実装用に適したリードレス型固体電解コン
デンサを得ることができる。In this way, it is possible to obtain a leadless solid electrolytic capacitor suitable for surface mounting, which is used by being placed on a so-called face bonding board, which does not have through holes through which lead wires of electronic components can be pushed.
しかしながら、前述した固体電解コンデンサの構造では
、コンデンサ素子１０のリード線１６．１８を樹脂ケー
ス２０に封口する前に溶接したり、フォーミングしたり
する加工が行われるため、コンデンサ素子１０に対する
ストレスが大きく歩留まりや信頼性の点で難点があった
。However, in the structure of the solid electrolytic capacitor described above, processing such as welding or forming is performed before the lead wires 16 and 18 of the capacitor element 10 are sealed in the resin case 20, so the stress on the capacitor element 10 is large. There were drawbacks in terms of yield and reliability.
また、コンデンサ素子１０を樹脂ケース２０内にエポキ
シ樹脂２２等で封口する際、ａｔ脂の量が多すぎて樹脂
ダレが生じることのないように、樹脂２２のボッティン
グ量の適正な管理および調整作業が必要であるといった
煩わしさがあった。In addition, when sealing the capacitor element 10 in the resin case 20 with the epoxy resin 22 or the like, the amount of botting of the resin 22 is properly managed and adjusted so that resin sag does not occur due to too large an amount of AT fat. There was the inconvenience of having to do some work.
さらに、樹脂ケース２０内に注入したエポキシ樹脂２２
等は、その溶融状態において表面張力による凹凸を形成
する。そのため、凹部におけるコンデンサ素子１０まで
の厚さを充分確保するためには、コンデンサ素子１０の
長さに比べて、樹脂ケース２０をかなり長くせざるを得
す体積効率からみてあまり良いとは言えなかった。Furthermore, the epoxy resin 22 injected into the resin case 20
etc., form irregularities due to surface tension in their molten state. Therefore, in order to ensure sufficient thickness up to the capacitor element 10 in the recess, the resin case 20 must be made considerably longer than the length of the capacitor element 10, which is not very good from a volumetric efficiency standpoint. Ta.
そこで、本発明の目的は、樹脂のボッティング量の管理
調整を不用にできると共に信頼性の向上が図れ、さらに
小形化も図れる表面実装用に適した固体電解コンデンサ
の端子構造を提供するにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a terminal structure of a solid electrolytic capacitor suitable for surface mounting, which can eliminate the need for controlling and adjusting the amount of resin botting, improve reliability, and further reduce the size of the capacitor. .
本発明に係る固体電解コンデンサの端子構造は、プラス
電極およびマイナス電極用の各金属箔に金属端子をそれ
ぞれ取付けると共にセパレータを介して各金属箔を巻回
した後、電解液に含浸焼成し、化成処理を行って形成さ
れるコンデンサ素子を角型樹脂ケースに挿入しエポキシ
樹脂等で封口して作られる固体電解コンデンサにおいて
、
前記角型樹脂ケースの金属端子側の側面を該金属端子と
エポキシ樹脂とが露出するようエポキシ樹脂と共に切断
し、この露出した各金属端子に対して外部接続用端子を
それぞれ設けることを特徴とする。The terminal structure of the solid electrolytic capacitor according to the present invention involves attaching metal terminals to each metal foil for the positive and negative electrodes, winding each metal foil through a separator, impregnating it with an electrolytic solution, baking it, and chemically converting it. In a solid electrolytic capacitor manufactured by inserting a capacitor element formed by processing into a square resin case and sealing it with epoxy resin, etc., the side surface of the square resin case on the metal terminal side is connected to the metal terminal and the epoxy resin. It is characterized in that it is cut together with the epoxy resin so that the metal terminals are exposed, and external connection terminals are provided for each of the exposed metal terminals.
本発明に係る固体電解コンデンサの端子構造によれば、
エポキシ樹脂と共に切断して角型樹脂ケースの露出した
金属端子に対し外部接続用端子の金属板片を超音波溶接
またはレーザ溶接により接続する端子ｍ造であるため、
すなわち封口後の加工を可能とする端子構造であるため
、封口前にリード線などのフォーミング加工をしなけれ
ばならない従来の端子構造に比べて、コンデンサ素子に
対するストレスを軽減することができる。According to the terminal structure of the solid electrolytic capacitor according to the present invention,
Because the terminal is made by cutting the epoxy resin together and connecting the metal plate piece of the external connection terminal to the exposed metal terminal of the square resin case by ultrasonic welding or laser welding,
In other words, since the terminal structure allows processing after sealing, stress on the capacitor element can be reduced compared to conventional terminal structures that require forming processing of lead wires and the like before sealing.
次に、本発明に係る固体電解コンデンサの端子構造の実
施例につき、添付図面を参照しながら以下詳細に説明す
る。Next, embodiments of the terminal structure of a solid electrolytic capacitor according to the present invention will be described in detail below with reference to the accompanying drawings.
第１図は本発明の一実施例を示す固体電解コンデンサの
外観斜視図であり、第２図（Ａ）乃至（Ｄ）は、本発明
に係る表面実装用固体アルミ電解コンデンサの主要製造
工程を工程順に概略的に示した外観斜視図である。FIG. 1 is an external perspective view of a solid electrolytic capacitor showing one embodiment of the present invention, and FIGS. 2(A) to (D) show the main manufacturing process of the solid aluminum electrolytic capacitor for surface mounting according to the present invention. It is an external perspective view schematically shown in the order of steps.
第２図（Ａ）において参照符号１０はコンデンサ素子で
あり、第３図（Ａ）の従来例と同様にコンデンサ素子１
０はプラスｔ［！およびマイナス電極用の各アルミ箔を
セパレータを介して巻回したものである。尚、各アルミ
箔を巻回する際には予めコンデンサ素子１０の端子取出
し口となる金属端子（例えば、アルミ丸棒）１２．１４
が各アルミ箔に取付けられている。第２図（Ｂ）は、上
記コンデンサ素子１０を硝酸マンガンに含浸して焼成し
二酸化マンガン（ＭｎＯ２）層を形成した後、角型樹脂
ケース２４内に挿入しエポキシ樹脂２２により封口した
状態を示す、第２図（Ｃ）において、角型樹脂ケース２
４の金属端子側の側面をエポキシ樹脂２２および金属端
子１２゜１４と共に切断する。第２図（Ｄ）において露
出しな金属端子１２．１４にそれぞれ外部接続用端子の
金属板片２６．２８を超音波溶接またはレーザ溶接等の
溶接３０により取付ける。′ｌｋ後に第１図に示すよう
に樹脂ケース２４上に定格や電極の極性等を印刷すれば
、表面実装用固体電解コンデンサの完成である。In FIG. 2(A), reference numeral 10 is a capacitor element, and the capacitor element 1 is similar to the conventional example in FIG. 3(A).
0 is plus t[! and each aluminum foil for the negative electrode is wound with a separator in between. In addition, when winding each aluminum foil, the metal terminals (for example, aluminum round bars) 12 and 14 that will be the terminal outlet of the capacitor element 10 are
is attached to each aluminum foil. FIG. 2(B) shows a state in which the capacitor element 10 is impregnated with manganese nitrate and fired to form a manganese dioxide (MnO2) layer, and then inserted into a square resin case 24 and sealed with an epoxy resin 22. , In FIG. 2(C), the square resin case 2
The side surface of 4 on the metal terminal side is cut together with the epoxy resin 22 and the metal terminals 12 and 14. In FIG. 2(D), metal plate pieces 26 and 28 of external connection terminals are attached to the exposed metal terminals 12 and 14 by welding 30 such as ultrasonic welding or laser welding. After printing the rating, electrode polarity, etc. on the resin case 24 as shown in FIG. 1, the solid electrolytic capacitor for surface mounting is completed.
なお、本実施例では、露出した金属端子１２．１４にそ
れぞれ外部接続用端子の金属板片２６．２８との電気的
な接続は溶接により行う場合を示したが、ワイヤボンデ
ィング（図示せず）により接続することも可能である。In this embodiment, the exposed metal terminals 12 and 14 are electrically connected to the metal plate pieces 26 and 28 of the external connection terminals by welding, but wire bonding (not shown) is used. It is also possible to connect by
ワイヤボンディングを使用する場合には、ワイヤの太さ
または並列本数を適当に選択することによってワイヤを
流れる電流容量を所望の上限値に設定でき、上限値を越
えるような過電流時あるいはショート時にはワイヤの溶
断によって発火防止を図ることができる。When using wire bonding, the current capacity flowing through the wire can be set to the desired upper limit by appropriately selecting the thickness of the wire or the number of wires in parallel.In the event of an overcurrent that exceeds the upper limit or a short circuit, the wire Ignition can be prevented by blowing out the flame.
前述した実施例から明らかなように、本発明の固体電解
コンデンサの端子構造によれば、コンデンサ素子をエポ
キシ樹脂などにより封口した後に外部接続用端子を取付
ける構造であるため、コンデンサ素子に対するストレス
が軽減され、製品の信頼性向上に効果を奏する。As is clear from the embodiments described above, according to the terminal structure of the solid electrolytic capacitor of the present invention, the external connection terminal is attached after the capacitor element is sealed with epoxy resin, etc., so stress on the capacitor element is reduced. This is effective in improving product reliability.
また、不要な長さの樹脂ケースを切断してから外部接続
用端子を取付ける構造であるため、同一容量のコンデン
サ素子に対する従来の樹脂ケースの大きさと比べて小さ
くなり、体積効率が向上する。Furthermore, since the external connection terminals are attached after cutting the resin case to an unnecessary length, the size of the conventional resin case is smaller than that for a capacitor element of the same capacity, improving volumetric efficiency.
さらに、封口後エポキシ樹脂も含めて樹脂ケースを切断
してしまうため、樹脂面の管理やボッティング量の調整
が不要であり、樹脂ダレもない。Furthermore, since the resin case including the epoxy resin is cut after sealing, there is no need to manage the resin surface or adjust the amount of botting, and there is no resin dripping.
また、コンデンサ素子の金属端子と樹脂ケースに取付け
た外部接続用端子との接続にワイヤボンディングを用い
る場合には、ワイヤが過を流に対する溶断ヒユーズとし
て働き発火防止に役立てることができる。Furthermore, when wire bonding is used to connect the metal terminals of the capacitor element and the external connection terminals attached to the resin case, the wires act as fuses against excessive flow and can be useful for preventing ignition.
以上、本発明の好適な実施例について説明したが、本発
明は前記実施例に限定されることなく、本発明の精神を
逸脱しない範囲内において種々の設計変更をなし得るこ
とは勿論である。Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and it goes without saying that various design changes can be made without departing from the spirit of the present invention.
第１図は本発明に係る固体電解コンデンサの一実施例を
示す外観斜視図、第２図（Ａ）乃至（Ｄ）は本発明に係
る表面実装用固体アルミ電解コンデンサの主要製造工程
を工程順に概略的に示した外観斜視図、第３図（Ａ）乃
至（Ｄ）は従来の表面実装用固体アルミ電解コンデンサ
の製造における主要工程を概略的に示した外観斜視図で
ある。
１０・・・コンデンサ素子
１２．１４・・・金属端子
１６．１８・・・リード線
２０・・・樹脂ケース
２２・・・エポキシ樹脂
２４・・・樹脂ケース
２６．２８・・・外部接続用端子の金属板片３０・・・
溶接
ＦＩＧ、１Fig. 1 is an external perspective view showing one embodiment of the solid electrolytic capacitor according to the present invention, and Figs. 2 (A) to (D) show the main manufacturing steps of the solid aluminum electrolytic capacitor for surface mounting according to the present invention in order of process. FIGS. 3(A) to 3(D) are perspective views schematically showing main steps in manufacturing a conventional solid aluminum electrolytic capacitor for surface mounting. 10... Capacitor element 12.14... Metal terminal 16.18... Lead wire 20... Resin case 22... Epoxy resin 24... Resin case 26.28... External connection terminal Metal plate piece 30...
Welding FIG, 1
Claims (1)
属端子をそれぞれ取付けると共にセパレータを介して各
金属箔を巻回した後、電解液に含浸焼成し、化成処理を
行って形成されるコンデンサ素子を角型樹脂ケースに挿
入しエポキシ樹脂等で封口して作られる固体電解コンデ
ンサにおいて、 前記角型樹脂ケースの金属端子側の側面を 該金属端子とエポキシ樹脂とが露出するようエポキシ樹
脂と共に切断し、この露出した各金属端子に対して外部
接続用端子をそれぞれ設けることを特徴とする固体電解
コンデンサの端子構造。(1) A capacitor element formed by attaching metal terminals to each metal foil for the positive and negative electrodes, winding each metal foil through a separator, impregnating it with an electrolytic solution, firing, and performing chemical conversion treatment. In a solid electrolytic capacitor manufactured by inserting a metal terminal into a square resin case and sealing it with epoxy resin, etc., the side surface of the square resin case on the metal terminal side is cut along with the epoxy resin so that the metal terminal and the epoxy resin are exposed. A terminal structure for a solid electrolytic capacitor, characterized in that each of the exposed metal terminals is provided with an external connection terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02234470A JP3107388B2 (en) | 1990-09-06 | 1990-09-06 | Terminal structure of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02234470A JP3107388B2 (en) | 1990-09-06 | 1990-09-06 | Terminal structure of solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04116815A true JPH04116815A (en) | 1992-04-17 |
| JP3107388B2 JP3107388B2 (en) | 2000-11-06 |
Family
ID=16971515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02234470A Expired - Fee Related JP3107388B2 (en) | 1990-09-06 | 1990-09-06 | Terminal structure of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3107388B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9599805B2 (en) | 2011-10-19 | 2017-03-21 | National Synchrotron Radiation Research Center | Optical imaging system using structured illumination |
-
1990
- 1990-09-06 JP JP02234470A patent/JP3107388B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3107388B2 (en) | 2000-11-06 |
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