JPS6312823U - - Google Patents
Info
- Publication number
- JPS6312823U JPS6312823U JP9195486U JP9195486U JPS6312823U JP S6312823 U JPS6312823 U JP S6312823U JP 9195486 U JP9195486 U JP 9195486U JP 9195486 U JP9195486 U JP 9195486U JP S6312823 U JPS6312823 U JP S6312823U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- capacitor
- winding
- electrode
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例につき製作工程を示
す図である。
１……巻回体、２……電極、２１……Ｚｎ層、
２２……高融点半田合金層。
FIG. 1 is a diagram showing the manufacturing process for one embodiment of the present invention. 1... Winding body, 2... Electrode, 21... Z n layer,
22...High melting point solder alloy layer.
Claims (1)
、それぞれ巻口端部の金属蒸着部と接触して高融
点金属の溶射金属層を形成させてなる電極部を設
けたコンデンサ素子、もしくは該コンデンサ素子
から巻回軸方向に矩形立方体状にきり出されたコ
ンデンサ素子を、樹脂含浸処理後メツキ液中に浸
し、前記電極部をメツキ加工し、素子の端子部と
なしたことを特徴とするチツプ型フイルムコンデ
ンサ。 A capacitor element having electrode parts formed by forming a sprayed metal layer of a high melting point metal in contact with the metal vapor deposited part at the end of the winding on both sides of a wound body of metallized plastic film, or from the capacitor element. A chip-type film characterized in that a capacitor element cut into a rectangular cube shape in the direction of the winding axis is impregnated with a resin and then immersed in a plating solution, and the electrode part is plated to form a terminal part of the element. capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9195486U JPS6312823U (en) | 1986-06-18 | 1986-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9195486U JPS6312823U (en) | 1986-06-18 | 1986-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6312823U true JPS6312823U (en) | 1988-01-27 |
Family
ID=30953209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9195486U Pending JPS6312823U (en) | 1986-06-18 | 1986-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312823U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01223713A (en) * | 1988-03-02 | 1989-09-06 | Nichicon Corp | Manufacture of chip type film capacitor |
| JPH01287913A (en) * | 1988-05-13 | 1989-11-20 | Nichicon Corp | Manufacture of chip type film capacitor |
| JPH0271431U (en) * | 1988-11-19 | 1990-05-31 |
-
1986
- 1986-06-18 JP JP9195486U patent/JPS6312823U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01223713A (en) * | 1988-03-02 | 1989-09-06 | Nichicon Corp | Manufacture of chip type film capacitor |
| JPH01287913A (en) * | 1988-05-13 | 1989-11-20 | Nichicon Corp | Manufacture of chip type film capacitor |
| JPH0271431U (en) * | 1988-11-19 | 1990-05-31 |
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