JPH03125519U - - Google Patents
Info
- Publication number
- JPH03125519U JPH03125519U JP3378890U JP3378890U JPH03125519U JP H03125519 U JPH03125519 U JP H03125519U JP 3378890 U JP3378890 U JP 3378890U JP 3378890 U JP3378890 U JP 3378890U JP H03125519 U JPH03125519 U JP H03125519U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- capacitor
- face
- center conductor
- conductive coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Description
第１図は本考案の一実施例の斜面図、第２図は
その断面図、第３図及び第４図はいずれも他の実
施例の断面図、第５図及び第６図はいずれも更に
他の実施例の斜面図、第７図、第８図及び第９図
はいずれも従来例の断面図である。
１……コンデンサ、２，３……インダクタンス
素子、６，７……電極、９……円筒状磁性コア、
１０……導電被膜、１１，１１ａ，１１ｂ……導
体棒、１２……導電性接合剤、１３，１４……外
部端子。
Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a sectional view thereof, Figs. 3 and 4 are sectional views of other embodiments, and Figs. 5 and 6 are both sectional views. Furthermore, the perspective views of other embodiments, FIG. 7, FIG. 8, and FIG. 9 are all sectional views of the conventional example. 1... Capacitor, 2, 3... Inductance element, 6, 7... Electrode, 9... Cylindrical magnetic core,
10... Conductive film, 11, 11a, 11b... Conductor rod, 12... Conductive bonding agent, 13, 14... External terminal.
Claims (1)
とから成り、該コンデンサは貫通孔の内面と外周
面に各々電極が形成されたものであり、該インダ
クタンス素子は貫通孔内面、該貫通孔の一端部及
び他端部に連なる一方の端面及び他方の端面並び
に少なくとも該一方の端面に連なる外周面の一端
部に導電被膜が形成され該外周面の一端部の導電
被膜が外部端子として用いられる磁性コアから成
るものであり、前記コンデンサの貫通孔には該貫
通孔より僅かに長い中心導体が挿通されて該中心
導体の中間部に前記コンデンサが配置され、該コ
ンデンサの貫通孔から突出した前記中心導体の両
端部の各々前記インダクタンス素子の貫通孔の他
端部に挿入され、前記中心導体と前記磁性コアの
前記他方の端面の導電被膜とが半田等の導電性接
合剤で電気的に接続すると共に固着されたことを
特徴とするチユプ型電磁波除去フイルタ。 Consisting of one capacitor and two inductance elements, the capacitor has electrodes formed on the inner surface and outer peripheral surface of the through hole, respectively, and the inductance element is formed on the inner surface of the through hole, one end of the through hole, and A conductive coating is formed on one end face continuous to the other end face, the other end face, and at least one end part of an outer circumferential face continuous with the one end face, and the conductive coating at one end of the outer circumferential face is made of a magnetic core used as an external terminal. A center conductor slightly longer than the through hole is inserted into the through hole of the capacitor, the capacitor is placed in the middle of the center conductor, and both ends of the center conductor protrude from the through hole of the capacitor. each of the parts is inserted into the other end of the through hole of the inductance element, and the center conductor and the conductive coating on the other end surface of the magnetic core are electrically connected and fixed with a conductive bonding agent such as solder. A chip-type electromagnetic wave removal filter characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3378890U JPH03125519U (en) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3378890U JPH03125519U (en) | 1990-03-30 | 1990-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03125519U true JPH03125519U (en) | 1991-12-18 |
Family
ID=31537721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3378890U Pending JPH03125519U (en) | 1990-03-30 | 1990-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03125519U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018105364A1 (en) * | 2016-12-05 | 2018-06-14 | 株式会社村田製作所 | Electronic component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138913A (en) * | 1979-04-17 | 1980-10-30 | Tdk Corp | Passive composite element |
| JPH0123121B2 (en) * | 1984-08-29 | 1989-05-01 | Kobe Senka Ind Works | |
| JPH0123120B2 (en) * | 1985-12-27 | 1989-05-01 | Kiubu Shoji Kk |
-
1990
- 1990-03-30 JP JP3378890U patent/JPH03125519U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138913A (en) * | 1979-04-17 | 1980-10-30 | Tdk Corp | Passive composite element |
| JPH0123121B2 (en) * | 1984-08-29 | 1989-05-01 | Kobe Senka Ind Works | |
| JPH0123120B2 (en) * | 1985-12-27 | 1989-05-01 | Kiubu Shoji Kk |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018105364A1 (en) * | 2016-12-05 | 2018-06-14 | 株式会社村田製作所 | Electronic component |
| JPWO2018105364A1 (en) * | 2016-12-05 | 2019-10-24 | 株式会社村田製作所 | Electronic components |
| US10971310B2 (en) | 2016-12-05 | 2021-04-06 | Murata Manufacturing Co., Ltd | Electronic component |