JPH036825U - - Google Patents
Info
- Publication number
- JPH036825U JPH036825U JP6559789U JP6559789U JPH036825U JP H036825 U JPH036825 U JP H036825U JP 6559789 U JP6559789 U JP 6559789U JP 6559789 U JP6559789 U JP 6559789U JP H036825 U JPH036825 U JP H036825U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- exterior material
- close contact
- lead terminal
- unplated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Details Of Resistors (AREA)
Description
第1図は本考案の一実施例をエネルギー閉じ込
め型圧電共振子に用いた一例の断面図。第2図は
電子部品内における半田付の問題を示す断面図。
1……エネルギー閉じ込め型圧電共振子、2…
…圧電基板、2a……電極、3……電極、4……
空隙、5……リード端子、5a……メツキ材、6
……半田、7……外装樹脂、A……外装樹脂とリ
ード端子の密着部。
FIG. 1 is a sectional view of an example in which an embodiment of the present invention is used in an energy trap type piezoelectric resonator. FIG. 2 is a cross-sectional view showing soldering problems within electronic components. 1...Energy trapping type piezoelectric resonator, 2...
...piezoelectric substrate, 2a...electrode, 3...electrode, 4...
Gap, 5... Lead terminal, 5a... Plating material, 6
... Solder, 7... Exterior resin, A... Close contact between exterior resin and lead terminal.
Claims (1)
端子を半田付により固着し、少なくともこの半田
付部を含む上記部材を外装材で被包した電子部品
において、 上記リード端子の上記外装材との密着部が無メ
ツキ状態であることを特徴とした電子部品。[Scope of Claim for Utility Model Registration] An electronic component in which a lead terminal whose surface is plated is fixed to a predetermined member by soldering, and the member including at least the soldered portion is covered with an exterior material, An electronic component characterized in that a portion of the terminal in close contact with the above-mentioned exterior material is unplated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6559789U JPH036825U (en) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6559789U JPH036825U (en) | 1989-06-05 | 1989-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH036825U true JPH036825U (en) | 1991-01-23 |
Family
ID=31597567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6559789U Pending JPH036825U (en) | 1989-06-05 | 1989-06-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH036825U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006314238A (en) * | 2005-05-12 | 2006-11-24 | Nobuyuki Takanashi | Method for making sheet openably adhering to planting structure, and sheet-openable greenhouse |
-
1989
- 1989-06-05 JP JP6559789U patent/JPH036825U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006314238A (en) * | 2005-05-12 | 2006-11-24 | Nobuyuki Takanashi | Method for making sheet openably adhering to planting structure, and sheet-openable greenhouse |
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