JPH02113512A - Film capacitor - Google Patents
Film capacitorInfo
- Publication number
- JPH02113512A JPH02113512A JP26640288A JP26640288A JPH02113512A JP H02113512 A JPH02113512 A JP H02113512A JP 26640288 A JP26640288 A JP 26640288A JP 26640288 A JP26640288 A JP 26640288A JP H02113512 A JPH02113512 A JP H02113512A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- capacitor body
- capacitor
- heat absorbing
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 37
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 11
- 239000011358 absorbing material Substances 0.000 claims description 3
- 230000006866 deterioration Effects 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 5
- -1 polyethylene Polymers 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000004698 Polyethylene Substances 0.000 abstract description 3
- 229920000573 polyethylene Polymers 0.000 abstract description 3
- 238000012858 packaging process Methods 0.000 abstract 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 15
- 239000006096 absorbing agent Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、フィルムコンデンサに関するものである。[Detailed description of the invention] Industrial applications The present invention relates to a film capacitor.
従来の技術
近年、電子部品のチップ化が急速に進められている。そ
れに伴って、チップ部品をプリント配線基板上に安定に
装着するために、実装条件が見直されている。たとえば
、プリント配線基板に仮装着したチップ部品を、はんだ
槽に浸漬する時間を延長する手段や、はんだ槽に浸漬す
る回数を増やす手段などが実用化されている。そのため
、フィルムコンデンサにおいては、チップ化に際して、
耐熱性が低いということが、大きな課題となってきてい
る。BACKGROUND OF THE INVENTION In recent years, the use of electronic components as chips has been rapidly progressing. Along with this, mounting conditions are being reviewed in order to stably mount chip components on printed wiring boards. For example, methods have been put into practical use to extend the time during which chip components temporarily attached to a printed wiring board are immersed in a solder bath, or to increase the number of times they are immersed in a solder bath. Therefore, when making a film capacitor into a chip,
Low heat resistance has become a major issue.
従来のフィルムコンデンサは、一般に第２図に示す構造
となっている。A conventional film capacitor generally has a structure shown in FIG.
図において、２１はコンデンサ本体、２２はリード線、
２３は外装体である。In the figure, 21 is the capacitor body, 22 is a lead wire,
23 is an exterior body.
コンデンサ本体２１は、フィルム誘電体が巻回ないしは
積層され、その両側面に電極引き出し用の金属層が溶射
法などで形成されているものである。フィルム誘電体に
は金属化フィルムやフィルムと金属箔とを重ねたものが
使用され、フィルムとしてはポリエチレンテレフタレー
トやポリプロピレンなどが一般に用いられている。The capacitor body 21 is a film dielectric material that is wound or laminated, and metal layers for leading out electrodes are formed on both sides of the capacitor body by thermal spraying or the like. A metallized film or a layered film and metal foil is used as the film dielectric, and polyethylene terephthalate, polypropylene, or the like is generally used as the film.
リード線２２には、はんだめっき銅線やはんだめっき銅
被覆銅線などが使用されている。As the lead wire 22, a solder-plated copper wire, a solder-plated copper-covered copper wire, or the like is used.
そして、外装体２３は通常エポキシ樹脂などをコンデン
サ本体２１に塗装することによって形成されているが、
プラスチックケースなどを用いられることもしばしばあ
る。The exterior body 23 is usually formed by coating the capacitor body 21 with epoxy resin or the like.
Plastic cases are often used.
発明が解決しようとする課題
ところで、近年、フィルムコンデンサの実装の態様が拡
大するに従ってコンデンサ本体の受ける熱影響が大きく
なり、実装後のフィルムコンデンサの電気特性がいちじ
るしく損なわれたり、実装時に外装体に亀裂が生じて外
観を損なわれたりすることがしばしば見受けられるよう
になっている。Problems to be Solved by the Invention However, in recent years, as the manner in which film capacitors are mounted has expanded, the influence of heat on the capacitor body has increased. It is often seen that cracks occur and the appearance is impaired.
本発明はこのような従来品にあった問題を解決するもの
で、実装による電気特性の劣化、外装の損傷の生じない
優れたフィルムコンデンサを提供することを目的とする
。The present invention solves these problems with conventional products, and aims to provide an excellent film capacitor that does not cause deterioration of electrical characteristics or damage to the exterior due to mounting.
課題を解決するための手段
本発明のフィルムコンデンサは、コンデンサ本体と、こ
のコンデンサ本体に接続されているリード線と、コンデ
ンサ本体に接して設けらていれる吸熱材とを備えている
。Means for Solving the Problems The film capacitor of the present invention includes a capacitor body, a lead wire connected to the capacitor body, and a heat absorbing material provided in contact with the capacitor body.
作 用
この構成によって、実装時に、はんだ中に浸っているリ
ード線から伝導してくる熱が吸熱材に吸収され、コンデ
ンサ本体に伝わる熱がいちじるししく減じて、その過度
の温度上昇が阻止され、実装による電気特性の劣化と外
装の損傷の発生が防止される。Effect: With this configuration, during mounting, the heat conducted from the lead wires immersed in the solder is absorbed by the heat absorbing material, and the heat transferred to the capacitor body is significantly reduced, preventing excessive temperature rise. This prevents deterioration of electrical characteristics and damage to the exterior due to mounting.
実施例
以下、本発明の一実施例のフィルムコンデンサについて
、第１図を参照しながら説明する。EXAMPLE Hereinafter, a film capacitor according to an example of the present invention will be explained with reference to FIG.
図において、１はコンデンサ本体で、たとえば金１化ポ
ｌＪエチレンテレフタレートフィルムを巻回し、その両
端面に亜鉛を溶射して構成したものである。２はリード
線で、はんだめっき銅線からなる。３はエポキシ樹脂に
よる外装体である。In the figure, reference numeral 1 denotes a capacitor body, which is constructed by winding, for example, a gold-monide polyJ ethylene terephthalate film and spraying zinc onto both end surfaces. 2 is a lead wire made of solder-plated copper wire. 3 is an exterior body made of epoxy resin.
そして、７は吸熱体で、コンデンサ本体１の端面のリー
ド線２の接続部分に融点１２０℃の低分子量ポリエチレ
ンを塗布して形成したものである。Reference numeral 7 denotes a heat absorbing body, which is formed by applying low molecular weight polyethylene having a melting point of 120° C. to the connection portion of the lead wire 2 on the end face of the capacitor body 1.
この実施例によれば、実装時に、はんだ槽からの熱がリ
ード線２を通ってコンデンサ本体１へ伝導する。しかし
ながら、吸熱体４付近の温度がそ融点にまで達すると、
吸熱体４はリード線２を伝導して来た熱を吸収しながら
融解する。そのため、コンデンサ本体１に伝わる熱はい
ちじるしく減じ、コンデンサ本体１の温度上昇が抑制さ
れる。その結果、実装における電気特性の劣化が防止さ
れ、かつ、外装体の損傷も発生しない。According to this embodiment, heat from the solder bath is conducted to the capacitor body 1 through the lead wire 2 during mounting. However, when the temperature near the heat absorber 4 reaches its melting point,
The heat absorbing body 4 melts while absorbing the heat conducted through the lead wire 2. Therefore, the heat transmitted to the capacitor body 1 is significantly reduced, and the temperature rise of the capacitor body 1 is suppressed. As a result, deterioration of electrical characteristics during mounting is prevented, and damage to the exterior body does not occur.
なお、本実施例においては、吸熱体４として融点１２０
℃の低分子量ポリエチレンをコンデンサ本体１とリード
線２の接続部分にのみ塗布形成しているが、その融点や
材質、量、さらには塗布面積については実装時の温度条
件や製造コストにより適宜選択すればよく、上述して例
に限られるものではない。In this example, the heat absorbing body 4 has a melting point of 120
℃ low molecular weight polyethylene is applied only to the connecting part between the capacitor body 1 and the lead wire 2, but the melting point, material, amount, and application area should be selected as appropriate depending on the temperature conditions at the time of mounting and manufacturing cost. However, the present invention is not limited to the examples described above.
また、本実施例においては、融解熱を利用する吸熱材を
使用しているが、言うまでもなく、材料の吸熱性の発現
がなにを利用しているものかについての制約は特にない
。Further, in this example, an endothermic material that utilizes heat of fusion is used, but needless to say, there are no particular restrictions on what material is used to exhibit the endothermic property of the material.
さらに、外装体４から延出しているリード線４上に吸熱
体を設けることも考えられるが、この場合には、効果の
点で上記実施例に比べて劣る、吸熱材の装着がむずかし
い、実装時にプリント配線基板上を汚染する可能性が強
いなどの問題があり、実用的でない。Furthermore, it is conceivable to provide a heat absorber on the lead wire 4 extending from the exterior body 4, but in this case, the effect would be inferior to the above embodiment, the attachment of the heat absorber would be difficult, and the mounting would be difficult. There are problems such as a strong possibility of contaminating the printed wiring board, which makes it impractical.
発明の効果
本発明は、コンデンサ本体に接して設けられた吸熱体を
備えているので、外装を施こすことにより、実装による
電気特性の劣化や外装の損傷の生じるおそれのないフィ
ルムコンデンサを提供することかできる。Effects of the Invention The present invention provides a film capacitor that is provided with a heat absorber provided in contact with the capacitor body, so that there is no risk of deterioration of electrical characteristics or damage to the exterior due to mounting by applying an exterior. I can do it.
第１図は本発明の一実施例におけるフィルムコンデンサ
の断面図、第２図は従来のフィルムコンデンサの断面図
である。
１・・・・・・コンデンサ本体、２・・・・・・リード
線、３・・・・・・外装体、４・・・・・・吸熱体。
代理人の氏名 弁理士 粟野重孝 ほか１名／−ココデ
ンーｒｊＫ体
乙−
４−吸奔藝本
２ノFIG. 1 is a sectional view of a film capacitor according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional film capacitor. 1...Capacitor body, 2...Lead wire, 3...Exterior body, 4...Heat absorber. Name of agent: Patent attorney Shigetaka Awano and 1 other person/-Cocoden-rjK-tai-tsu- 4-Sukutogeibon 2no
Claims (1)
るリード線と、前記コンデンサ本体に接して設けらてい
れる吸熱材とを備えていることを特徴とするフィルムコ
ンデンサ。A film capacitor comprising a capacitor body, a lead wire connected to the capacitor body, and a heat absorbing material provided in contact with the capacitor body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26640288A JPH02113512A (en) | 1988-10-21 | 1988-10-21 | Film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26640288A JPH02113512A (en) | 1988-10-21 | 1988-10-21 | Film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113512A true JPH02113512A (en) | 1990-04-25 |
Family
ID=17430433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26640288A Pending JPH02113512A (en) | 1988-10-21 | 1988-10-21 | Film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113512A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6787711B2 (en) * | 2001-12-14 | 2004-09-07 | Fujitsu Limited | Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device |
-
1988
- 1988-10-21 JP JP26640288A patent/JPH02113512A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6787711B2 (en) * | 2001-12-14 | 2004-09-07 | Fujitsu Limited | Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device |
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