JPH0442592A - Metallic-core circuit board - Google Patents
Metallic-core circuit boardInfo
- Publication number
- JPH0442592A JPH0442592A JP15112490A JP15112490A JPH0442592A JP H0442592 A JPH0442592 A JP H0442592A JP 15112490 A JP15112490 A JP 15112490A JP 15112490 A JP15112490 A JP 15112490A JP H0442592 A JPH0442592 A JP H0442592A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- bonding agent
- adhesive
- circuit board
- core circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 238000010030 laminating Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 15
- 239000012535 impurity Substances 0.000 abstract description 11
- 238000005452 bending Methods 0.000 abstract description 9
- 230000015556 catabolic process Effects 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000007767 bonding agent Substances 0.000 abstract 5
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明は、その上に半導体素子を搭載し、発熱基板すな
わち電源、ハイパワー基板として適用される金属コア回
路基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a metal core circuit board on which a semiconductor element is mounted and which is used as a heat generating board, that is, a power source or a high power board.
(従来の技術)
従来から、半導体素子のような電子部品を搭載するため
の回路基板として、種々の材料が使用され各種のパッケ
ージが施されている。そして、これら回路基板の中でも
、アルミニウム等の金属薄板を芯材(コア)として有す
る金属コア回路基板は、耐熱ならびに放熱性、シールド
性、および曲げ加工性が良好であることから、近年、電
源、ハイパワー基板としての使用が広く考えられている
。ある。(Prior Art) Conventionally, various materials have been used and various packages have been applied to circuit boards on which electronic components such as semiconductor elements are mounted. Among these circuit boards, metal core circuit boards that have a thin metal plate such as aluminum as the core have good heat resistance, heat dissipation, shielding properties, and bending workability, so in recent years, they have been used as power supplies, It is widely considered to be used as a high-power board. be.
従来の金属コア回路基板の構造を、以下に示す。The structure of a conventional metal core circuit board is shown below.
すなわち、第2図に示すように、アルミニウム等の軽量
で剛性の高い金属からなる薄板1の上に、絶縁層2が設
けられ、その上に銅等の導体層3が設けられた構造とな
っている。That is, as shown in Fig. 2, the structure is such that an insulating layer 2 is provided on a thin plate 1 made of a lightweight and highly rigid metal such as aluminum, and a conductive layer 3 made of copper or the like is provided on top of the thin plate 1. ing.
そしてこのような金属コア回路基板においては、金属薄
板1と導体層3との接着強度を高めるために、絶縁層2
を接着剤によって構成するか、あるいは粉体塗装、電着
塗装等によって設けられた絶縁被覆の上に、さらに接着
剤の層を塗布形成することが行われている。In such a metal core circuit board, in order to increase the adhesive strength between the thin metal plate 1 and the conductor layer 3, the insulating layer 2 is
A layer of adhesive is further coated on top of an insulating coating formed of an adhesive, or provided by powder coating, electrodeposition coating, or the like.
(発明が解決しようとする課題)
しかしながらこのような従来からの金属コア回路基板に
おいては、絶縁層2として使用される接着剤の特性によ
って、基板の絶縁特性が決定されるため、通常の接着剤
を使用した場合には、以下に示すような種々の問題があ
った。(Problem to be Solved by the Invention) However, in such conventional metal core circuit boards, the insulation characteristics of the board are determined by the characteristics of the adhesive used as the insulating layer 2, so ordinary adhesives When using , there were various problems as shown below.
すなわち、
(1)曲げ加工によって絶縁層2(接着剤層)にクラッ
クが入り、その結果絶縁破壊特性が低下するおそれがあ
る。That is, (1) The bending process may cause cracks in the insulating layer 2 (adhesive layer), resulting in a decrease in dielectric breakdown characteristics.
(2)接着剤等からなる絶縁層2がはじめから不純物を
含有しているばかりでなく、導体層3をエツチングして
回路を形成する際等に、絶縁層2が不純物を取込みやす
い。そのため、絶縁特性が低下しやすい。(2) Not only does the insulating layer 2 made of an adhesive or the like contain impurities from the beginning, but also the insulating layer 2 tends to incorporate impurities when etching the conductor layer 3 to form a circuit. Therefore, the insulation properties tend to deteriorate.
(3)接着剤を塗布する場合に、塗布むらが生じやすい
。そして、その上に直接回路パターンが形成されるため
、このような塗布むらが露出して外観上好ましくない。(3) When applying adhesive, uneven application tends to occur. Since a circuit pattern is directly formed thereon, such coating unevenness is exposed and is unfavorable in terms of appearance.
等の種々の問題があった。There were various problems such as.
本発明はこれらの問題を解決するためになされたもので
、絶縁性と曲げ加工性が良好であるうえに、導体層をエ
ツチングする際に絶縁層が不純物を取込むことがなく、
かつ曲げ加工による絶縁破壊特性の低下が生じない金属
コア回路基板を提供することを目的とする。The present invention was made to solve these problems, and not only has good insulation properties and bending workability, but also prevents the insulating layer from taking in impurities when etching the conductive layer.
Another object of the present invention is to provide a metal core circuit board whose dielectric breakdown characteristics do not deteriorate due to bending.
[発明の構成]
(課題を解決するための手段)
本発明の金属コア回路基板は、可とう性を有する絶縁層
と導体層とを積層してなる基板と、金属薄板とを、前記
絶縁層を内側にして、接着剤層を介して貼り合せてなる
ことを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The metal core circuit board of the present invention includes a substrate formed by laminating a flexible insulating layer and a conductor layer, and a thin metal plate, It is characterized by being attached to the inside through an adhesive layer.
(作用)
本発明の金属コア回路基板においては、可とう性の絶縁
層と導体層とを積層してなる基板の絶縁層面に、金属薄
板が接着剤層を介して金属薄板が貼り合されているので
、放熱性、絶縁特性、および曲げ加工性が良好である。(Function) In the metal core circuit board of the present invention, a thin metal plate is bonded to the insulating layer surface of the board formed by laminating a flexible insulating layer and a conductive layer via an adhesive layer. Because of this, it has good heat dissipation, insulation properties, and bendability.
そして、曲げ加工によって万一接着剤層にクラックが入
っても、その上に基板の絶縁層が接合されているので、
絶縁破壊が生じない。Even if the adhesive layer cracks due to bending, the insulating layer of the board is bonded on top of it.
No dielectric breakdown occurs.
また、接着剤層と導体層との間に絶縁層が介挿されるの
で、導体層をエツチングする際等に、接着剤層に不純物
を侵入することがない。Furthermore, since the insulating layer is interposed between the adhesive layer and the conductor layer, impurities do not enter the adhesive layer when etching the conductor layer.
さらに、回路形成時にはすぐ下側の絶縁層が現れ接着剤
の層が露出することがないので、接着剤の塗布むらに起
因する外観不良が生じない。Furthermore, when the circuit is formed, the insulating layer immediately below is exposed and the adhesive layer is not exposed, so there is no appearance defect caused by uneven application of the adhesive.
またさらに、絶縁フィルム等の可とう性の高い絶縁層の
上に導体層が設けられた2層構造の基板と、金属薄板と
を、接着剤で貼り合わせることによって製造することが
でき、既存の基板をそのまま使用することができるので
、製造が容易でコストがかからない。Furthermore, it can be manufactured by bonding together a two-layer structure board, in which a conductor layer is provided on a highly flexible insulating layer such as an insulating film, and a thin metal plate using an adhesive. Since the substrate can be used as is, manufacturing is easy and inexpensive.
(実施例) 以下、本発明の実施例を図面に基いて説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第1図は、本発明の金属コア回路基板の一実施例を示す
断面図である。FIG. 1 is a sectional view showing an embodiment of the metal core circuit board of the present invention.
図において符号4は、ポリイミドフィルムのような可と
う性の高い絶縁樹脂フィルムを示し、この上には、銅箔
等の導体層5が張り合わされている。In the figure, reference numeral 4 indicates a highly flexible insulating resin film such as a polyimide film, on which a conductor layer 5 such as copper foil is laminated.
このような可とう性に優れかつワイヤボンディング性等
が良好な基板の絶縁樹脂フィルム4面には、公知の接着
剤が、コーター等の塗布装置を用いて5〜20μ日の厚
さに塗布され、この接着剤層6の上には、アルミニウム
等の金属の薄板7が、重ねられ接着されている。A known adhesive is applied to the four sides of the insulating resin film of such a substrate, which has excellent flexibility and good wire bonding properties, to a thickness of 5 to 20 μm using a coating device such as a coater. On this adhesive layer 6, a thin plate 7 of metal such as aluminum is superimposed and bonded.
ここで、接着剤層6はなるべく薄く塗布形成することが
望ましく、またなるべく不純物を含有しない接着剤を使
用することが望ましい。Here, it is desirable to form the adhesive layer 6 by coating it as thinly as possible, and it is also desirable to use an adhesive that contains as few impurities as possible.
このように構成される実施例の金属コア回路基板におい
ては、接着剤層6の上に2層構造の基板が重ねられてい
るので、導体層5をエツチングして回路を形成する際に
、接着剤層6が露出して不純物を取込むことがない。そ
のうえ、それ自体にも不純物が少ない接着剤が使用され
ているので、このような後工程で不純物が侵入増加する
ことがなく、特性の良好なパッケージが得られる。In the metal core circuit board of the embodiment configured as described above, the two-layer structure board is stacked on the adhesive layer 6, so when etching the conductor layer 5 to form a circuit, the adhesive The agent layer 6 is not exposed and does not take in impurities. Furthermore, since the adhesive itself has few impurities, there is no increase in impurities entering in such post-processes, and a package with good characteristics can be obtained.
また従来の金属コア回路基板では、曲げ加工の際に接着
剤層6にクラックが入り、ここから絶縁破壊が生じる可
能性があったが、実施例の金属コア回路基板では、接着
剤層6の上に絶縁樹脂フィルム4が積層されているので
、接着剤層6にクラックが入っても絶縁破壊に至らない
。In addition, in the conventional metal core circuit board, there was a possibility that the adhesive layer 6 would crack during bending, resulting in dielectric breakdown, but in the metal core circuit board of the example, the adhesive layer 6 Since the insulating resin film 4 is laminated thereon, even if the adhesive layer 6 cracks, it will not lead to dielectric breakdown.
さらに、導体層5のエツチングによって回路が形成され
た後は、導体層5の下側の絶縁樹脂フィルム4が露出さ
れ、接着剤層6は露出されないので、接着剤の塗布むら
があっても外観が損われることがない。Furthermore, after the circuit is formed by etching the conductor layer 5, the insulating resin film 4 under the conductor layer 5 is exposed and the adhesive layer 6 is not exposed, so even if there is uneven application of the adhesive, the appearance will not be damaged.
[発明の効果]
以上説明したように本発明の金属コア回路基板線におい
ては、使用する接着剤の特性の如何に関わらず、金属薄
板と貼り合わられる2層基板の特性が顕著に現れており
、曲げ加工性およびワイヤボンディング性が良好である
。[Effects of the Invention] As explained above, in the metal core circuit board wire of the present invention, the characteristics of the two-layer board bonded to the metal thin plate are clearly exhibited, regardless of the characteristics of the adhesive used. , good bending workability and wire bonding properties.
また、導体層のエツチング工程での接着剤層への不純物
の取込みがなく、絶縁特性の低下が生じない。Further, impurities are not introduced into the adhesive layer during the etching process of the conductor layer, and the insulation properties do not deteriorate.
さらに、曲げ加工による絶縁破壊発生が防止され、外観
も良好である。Furthermore, the occurrence of dielectric breakdown due to bending is prevented, and the appearance is also good.
第1図は、本発明の金属コア回路基板の一実施例を示す
断面図、第2図は、従来の金属コア回路基板の断面図で
ある。
4・・・・・・・・・絶縁樹脂フィ
5・・・・・・・・・導体層
6・・・・・・・・・接着剤層
7・・・・・・・・・金属薄板。
ル ムFIG. 1 is a sectional view showing an embodiment of the metal core circuit board of the present invention, and FIG. 2 is a sectional view of a conventional metal core circuit board. 4...Insulating resin filler 5...Conductor layer 6...Adhesive layer 7...Thin metal plate . room
Claims (1)
る基板と、金属薄板とを、前記絶縁層を内側にして、接
着剤層を介して貼り合せてなることを特徴とする金属コ
ア回路基板。(1) A substrate formed by laminating a flexible insulating layer and a conductive layer, and a thin metal plate are bonded together via an adhesive layer with the insulating layer inside. Metal core circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15112490A JPH0442592A (en) | 1990-06-08 | 1990-06-08 | Metallic-core circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15112490A JPH0442592A (en) | 1990-06-08 | 1990-06-08 | Metallic-core circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0442592A true JPH0442592A (en) | 1992-02-13 |
Family
ID=15511892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15112490A Pending JPH0442592A (en) | 1990-06-08 | 1990-06-08 | Metallic-core circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0442592A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008103503A (en) * | 2006-10-18 | 2008-05-01 | Shinwa Frontech Corp | Manufacturing method of circuit board |
JP2012119563A (en) * | 2010-12-02 | 2012-06-21 | Mitsui Mining & Smelting Co Ltd | Flexible substrate for semiconductor device, and semiconductor device |
-
1990
- 1990-06-08 JP JP15112490A patent/JPH0442592A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008103503A (en) * | 2006-10-18 | 2008-05-01 | Shinwa Frontech Corp | Manufacturing method of circuit board |
US8110118B2 (en) | 2006-10-18 | 2012-02-07 | Yazaki Corporation | Method of manufacturing circuit board |
JP2012119563A (en) * | 2010-12-02 | 2012-06-21 | Mitsui Mining & Smelting Co Ltd | Flexible substrate for semiconductor device, and semiconductor device |
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