CN100390909C - 电容器的红外线屏蔽 - Google Patents

电容器的红外线屏蔽 Download PDF

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Publication number
CN100390909C
CN100390909C CNB961079908A CN96107990A CN100390909C CN 100390909 C CN100390909 C CN 100390909C CN B961079908 A CNB961079908 A CN B961079908A CN 96107990 A CN96107990 A CN 96107990A CN 100390909 C CN100390909 C CN 100390909C
Authority
CN
China
Prior art keywords
capacitor
plastic film
film capacitor
shielding
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB961079908A
Other languages
English (en)
Chinese (zh)
Other versions
CN1148723A (zh
Inventor
里克·A·普赖斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN1148723A publication Critical patent/CN1148723A/zh
Application granted granted Critical
Publication of CN100390909C publication Critical patent/CN100390909C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
    • F16D3/00—Yielding couplings, i.e. with means permitting movement between the connected parts during the drive
    • F16D3/16—Universal joints in which flexibility is produced by means of pivots or sliding or rolling connecting parts
    • F16D3/26—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected
    • F16D3/38—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected with a single intermediate member with trunnions or bearings arranged on two axes perpendicular to one another
    • F16D3/382—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected with a single intermediate member with trunnions or bearings arranged on two axes perpendicular to one another constructional details of other than the intermediate member
    • F16D3/387—Fork construction; Mounting of fork on shaft; Adapting shaft for mounting of fork
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CNB961079908A 1995-06-21 1996-06-05 电容器的红外线屏蔽 Expired - Fee Related CN100390909C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49350495A 1995-06-21 1995-06-21
US493504 1995-06-21

Publications (2)

Publication Number Publication Date
CN1148723A CN1148723A (zh) 1997-04-30
CN100390909C true CN100390909C (zh) 2008-05-28

Family

ID=23960496

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB961079908A Expired - Fee Related CN100390909C (zh) 1995-06-21 1996-06-05 电容器的红外线屏蔽

Country Status (15)

Country Link
US (1) US6278601B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0750325B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (2) JP3902262B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR970003883A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN100390909C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE230516T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU695731B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BR (1) BR9601868A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA2176441C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69625548T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK (1) DK0750325T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES2188723T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NO (1) NO962618L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NZ (1) NZ286847A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW304271B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10112355C1 (de) * 2001-03-13 2002-06-13 Daimler Chrysler Ag Verfahren und Schutzvorrichtung zur Montage eines temperaturempfindlichen elektronischen Bauteils
US6681771B2 (en) * 2002-03-22 2004-01-27 Jean-Francois Durette Organ shields for medical procedures
DE102014100469A1 (de) 2013-11-29 2015-06-03 Epcos Ag Elektronisches Bauelement und Verwendung desselben
DE102017206386A1 (de) * 2017-04-13 2018-10-18 Robert Bosch Gmbh Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit
US11153976B2 (en) 2018-05-24 2021-10-19 International Business Machines Corporation Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper
CN110858514A (zh) * 2018-08-24 2020-03-03 南通三鑫电子科技股份有限公司 一种反光电容器
CN113012940A (zh) * 2021-02-26 2021-06-22 宁波央腾汽车电子有限公司 一种集成屏蔽功能的薄膜电容结构
JP2024513157A (ja) * 2021-03-31 2024-03-22 ケメット エレクトロニクス コーポレーション 耐熱性が向上した電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469038A (en) * 1987-09-10 1989-03-15 Matsushita Electronics Corp Resin-sealed semiconductor device
JPS6489501A (en) * 1987-09-30 1989-04-04 Nec Corp Chiplike resin-covered electronic component
JPH07142624A (ja) * 1993-11-17 1995-06-02 Nec Corp 半導体装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3718800A (en) 1968-03-05 1973-02-27 Argus Eng Co Infrared heating apparatus
US3592992A (en) 1969-03-13 1971-07-13 Argus Eng Co Soldering method and apparatus
US3612963A (en) 1970-03-11 1971-10-12 Union Carbide Corp Multilayer ceramic capacitor and process
US4123309A (en) * 1973-11-29 1978-10-31 Minnesota Mining And Manufacturing Company Transfer letter system
US4462062A (en) 1981-02-27 1984-07-24 Illinois Tool Works Inc. Capacitive structure
US4481708A (en) 1982-01-18 1984-11-13 Analog Devices, Inc. Reduced internal temperature technique for hermetic sealing of enclosures
ATE29616T1 (de) 1983-06-03 1987-09-15 Wolfgang Westermann Kunststoffolien-wickelkondensator.
US4603373A (en) * 1983-07-13 1986-07-29 Electronic Concepts, Inc. Outer wrapping for a metallized wound capacitor
US4516187A (en) 1983-07-13 1985-05-07 Electronic Concepts, Inc. Outer wrapping and planar terminations for a metallized wound capacitor and method therefor
JPH0656826B2 (ja) 1984-06-04 1994-07-27 東レ株式会社 コンデンサ
US4580190A (en) 1984-12-07 1986-04-01 Illinois Tool Works Inc. Surface mountable electrical package
DE3505888C1 (de) 1985-02-20 1986-08-14 Wolfgang Dipl.-Ing. 6800 Mannheim Westermann Kunststoffolien-Wickelkondensator in Chipbauweise
JPS61241949A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 半導体装置
DE3737457A1 (de) 1987-11-04 1989-05-18 Peter Gammelin Loetvorrichtung
US4838475A (en) 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
JPH0677830B2 (ja) 1987-12-25 1994-10-05 松下電器産業株式会社 基板加熱方法
US5268051A (en) * 1988-11-09 1993-12-07 Polysar Rubber Corporation Self-bonding tapes
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
US5371650A (en) * 1994-02-15 1994-12-06 Electronic Concepts, Inc. Hermetically sealed capacitor and method for making the same
DE4415950A1 (de) * 1994-05-05 1995-11-09 Siemens Matsushita Components Elektrisches Bauelement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469038A (en) * 1987-09-10 1989-03-15 Matsushita Electronics Corp Resin-sealed semiconductor device
JPS6489501A (en) * 1987-09-30 1989-04-04 Nec Corp Chiplike resin-covered electronic component
JPH07142624A (ja) * 1993-11-17 1995-06-02 Nec Corp 半導体装置

Also Published As

Publication number Publication date
BR9601868A (pt) 1999-01-12
JP2006310892A (ja) 2006-11-09
KR970003883A (ko) 1997-01-29
ES2188723T3 (es) 2003-07-01
AU5213096A (en) 1997-01-09
ATE230516T1 (de) 2003-01-15
EP0750325A1 (en) 1996-12-27
DE69625548D1 (de) 2003-02-06
NO962618D0 (no) 1996-06-20
JP4012236B2 (ja) 2007-11-21
AU695731B2 (en) 1998-08-20
CA2176441C (en) 2000-07-11
CN1148723A (zh) 1997-04-30
EP0750325B1 (en) 2003-01-02
TW304271B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1997-05-01
JPH097886A (ja) 1997-01-10
NO962618L (no) 1996-12-23
JP3902262B2 (ja) 2007-04-04
US6278601B1 (en) 2001-08-21
CA2176441A1 (en) 1996-12-22
DE69625548T2 (de) 2009-09-17
NZ286847A (en) 1997-04-24
MX9602108A (es) 1997-09-30
DK0750325T3 (da) 2003-04-22

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Legal Events

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080528

Termination date: 20130605