NO930970L - Halvleder-kondensator og mikrofonanordninger - Google Patents
Halvleder-kondensator og mikrofonanordningerInfo
- Publication number
- NO930970L NO930970L NO93930970A NO930970A NO930970L NO 930970 L NO930970 L NO 930970L NO 93930970 A NO93930970 A NO 93930970A NO 930970 A NO930970 A NO 930970A NO 930970 L NO930970 L NO 930970L
- Authority
- NO
- Norway
- Prior art keywords
- capacitor
- diaphragm
- condensor
- semiconductor
- constituting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85348892A | 1992-03-18 | 1992-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
NO930970D0 NO930970D0 (no) | 1993-03-17 |
NO930970L true NO930970L (no) | 1993-09-20 |
Family
ID=25316164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO93930970A NO930970L (no) | 1992-03-18 | 1993-03-17 | Halvleder-kondensator og mikrofonanordninger |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0561566B1 (fr) |
JP (1) | JP3451593B2 (fr) |
AU (1) | AU659290B2 (fr) |
CA (1) | CA2092627A1 (fr) |
DE (1) | DE69325732T2 (fr) |
DK (1) | DK0561566T3 (fr) |
FI (1) | FI931183A (fr) |
NO (1) | NO930970L (fr) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5490220A (en) * | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
FR2721471B1 (fr) * | 1994-06-17 | 1996-08-02 | Schlumberger Ind Sa | Transducteur ultrasonore et procédé de fabrication d'un tel transducteur. |
US5573679A (en) * | 1995-06-19 | 1996-11-12 | Alberta Microelectronic Centre | Fabrication of a surface micromachined capacitive microphone using a dry-etch process |
NL1001733C2 (nl) * | 1995-11-23 | 1997-05-27 | Stichting Tech Wetenschapp | Stelsel van een substraat en een opnemer. |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
JP2000022172A (ja) * | 1998-06-30 | 2000-01-21 | Matsushita Electric Ind Co Ltd | 変換装置及びその製造方法 |
US6088463A (en) * | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
DE69939976D1 (de) * | 1999-05-28 | 2009-01-08 | Texas Instruments Inc | Digitaler Lautsprecher |
US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
DE60003441T2 (de) * | 1999-09-06 | 2004-04-29 | Sonionmems A/S | Druckwandler |
US6732588B1 (en) * | 1999-09-07 | 2004-05-11 | Sonionmems A/S | Pressure transducer |
JP3611779B2 (ja) * | 1999-12-09 | 2005-01-19 | シャープ株式会社 | 電気信号−音響信号変換器及びその製造方法並びに電気信号−音響変換装置 |
DE60118208T2 (de) * | 2000-08-11 | 2007-04-12 | Knowles Electronics, LLC, Itasca | Breitbandiger miniaturwandler |
EP1206160A1 (fr) * | 2000-11-09 | 2002-05-15 | Texas Instruments Incorporated | Haut-parleur numérique |
JP2002345088A (ja) * | 2001-05-18 | 2002-11-29 | Mitsubishi Electric Corp | 圧力感応装置及びこれに用いられる半導体基板の製造方法 |
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
DE10221660B4 (de) * | 2002-05-15 | 2007-12-27 | Infineon Technologies Ag | Verfahren zur Herstellung eines mikromechanischen, kapazitiven Wandlers |
US7253016B2 (en) | 2002-05-15 | 2007-08-07 | Infineon Technologies Ag | Micromechanical capacitive transducer and method for producing the same |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
JP2004356707A (ja) | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構 |
JP2004356708A (ja) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構及びその製造方法 |
JP2005039652A (ja) | 2003-07-17 | 2005-02-10 | Hosiden Corp | 音響検出機構 |
WO2005050680A1 (fr) | 2003-11-20 | 2005-06-02 | Matsushita Electric Industrial Co., Ltd. | Electret et condensateur a electret |
US7346178B2 (en) * | 2004-10-29 | 2008-03-18 | Silicon Matrix Pte. Ltd. | Backplateless silicon microphone |
JP2007104467A (ja) * | 2005-10-06 | 2007-04-19 | Micro Precision Kk | 音響センサおよびその製造方法 |
CN105704622A (zh) * | 2006-01-20 | 2016-06-22 | 应美盛股份有限公司 | 用于电容式传声器隔膜的支撑设备 |
JP4811035B2 (ja) * | 2006-01-31 | 2011-11-09 | パナソニック電工株式会社 | 音響センサ |
JP2007267049A (ja) * | 2006-03-29 | 2007-10-11 | Yamaha Corp | コンデンサマイクロホン |
JP2007228345A (ja) * | 2006-02-24 | 2007-09-06 | Yamaha Corp | コンデンサマイクロホン |
JP4737721B2 (ja) * | 2006-03-10 | 2011-08-03 | ヤマハ株式会社 | コンデンサマイクロホン |
JP4605470B2 (ja) * | 2006-03-31 | 2011-01-05 | ヤマハ株式会社 | コンデンサマイクロホン |
JP4737719B2 (ja) * | 2006-02-24 | 2011-08-03 | ヤマハ株式会社 | コンデンサマイクロホン |
DE102006011545B4 (de) * | 2006-03-14 | 2016-03-17 | Robert Bosch Gmbh | Mikromechanisches Kombi-Bauelement und entsprechendes Herstellungsverfahren |
GB0605576D0 (en) | 2006-03-20 | 2006-04-26 | Oligon Ltd | MEMS device |
ATE471635T1 (de) * | 2006-03-30 | 2010-07-15 | Sonion Mems As | Akustischer einchip-mems-wandler und herstellungsverfahren |
DE102006024668A1 (de) * | 2006-05-26 | 2007-11-29 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zu dessen Herstellung |
JP4797829B2 (ja) * | 2006-06-26 | 2011-10-19 | ヤマハ株式会社 | コンデンサマイクロホン及びコンデンサマイクロホンの製造方法 |
JP4936199B2 (ja) * | 2006-07-19 | 2012-05-23 | パナソニック株式会社 | 移動体の位置検出システム |
JPWO2008010269A1 (ja) * | 2006-07-19 | 2009-12-10 | パナソニック電工株式会社 | 移動体の位置検出システム |
GB2453104B (en) * | 2007-09-19 | 2012-04-25 | Wolfson Microelectronics Plc | Mems device and process |
GB2452941B (en) * | 2007-09-19 | 2012-04-11 | Wolfson Microelectronics Plc | Mems device and process |
TWI365525B (en) * | 2007-12-24 | 2012-06-01 | Ind Tech Res Inst | An ultra thin package for a sensor chip of a micro electro mechanical system |
JP5721452B2 (ja) | 2011-01-27 | 2015-05-20 | ローム株式会社 | 静電容量型memsセンサ |
US9204222B2 (en) | 2011-02-25 | 2015-12-01 | Nokia Technologies Oy | Transducer apparatus with a tension actuator |
DE102011016934A1 (de) * | 2011-04-13 | 2012-10-18 | Epcos Ag | MEMS-Sensor |
KR101379680B1 (ko) | 2012-05-09 | 2014-04-01 | 이화여자대학교 산학협력단 | 듀얼 백플레이트를 갖는 mems 마이크로폰 및 제조방법 |
DE102013201795A1 (de) | 2013-02-05 | 2014-08-07 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Membranstruktur |
WO2014194316A1 (fr) * | 2013-05-31 | 2014-12-04 | Robert Bosch Gmbh | Membrane piégée |
DE102013212173B4 (de) | 2013-06-26 | 2016-06-02 | Robert Bosch Gmbh | MEMS-Bauelement mit einer auslenkbaren Membran und einem feststehenden Gegenelement sowie Verfahren zu dessen Herstellung |
DE102014108984B4 (de) * | 2014-06-26 | 2017-04-06 | Tdk Corporation | Wandlerelement |
US9745188B1 (en) | 2016-02-26 | 2017-08-29 | Infineon Technologies Ag | Microelectromechanical device and method for forming a microelectromechanical device |
US9856134B2 (en) | 2016-02-26 | 2018-01-02 | Infineon Technologies Ag | Microelectromechanical system and a method of manufacturing a microelectromechanical system |
DE102016210444A1 (de) * | 2016-06-13 | 2017-12-14 | Robert Bosch Gmbh | Mikroelektromechanisches Mikrofon |
CZ308267B6 (cs) * | 2019-02-13 | 2020-04-01 | ÄŚeskĂ© vysokĂ© uÄŤenĂ technickĂ© v Praze | Miniaturní snímač akustického tlaku v kapalinách a plynech |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH466376A (de) * | 1968-03-01 | 1968-12-15 | Ibm | Anordnung zur Umwandlung von Drücken in digitale elektrische Signale |
US3772133A (en) * | 1971-11-08 | 1973-11-13 | Industrial Research Prod Inc | Backplate construction for electret transducer |
AU5817473A (en) * | 1973-07-17 | 1975-01-23 | Detlef Fischer | Directional microphone |
NL7313455A (nl) * | 1973-10-01 | 1975-04-03 | Philips Nv | Mikrofoon met elektrostatische capsule. |
SE428081B (sv) * | 1981-10-07 | 1983-05-30 | Ericsson Telefon Ab L M | Tilledningsram for en elektretmikrofon |
US4651120A (en) * | 1985-09-09 | 1987-03-17 | Honeywell Inc. | Piezoresistive pressure sensor |
JPH0748564B2 (ja) * | 1988-05-07 | 1995-05-24 | シャープ株式会社 | シリコンマイクロセンサ |
JP2681207B2 (ja) * | 1989-02-01 | 1997-11-26 | 株式会社 オーディオテクニカ | 静電型電気音響変換器の振動板 |
US4993072A (en) * | 1989-02-24 | 1991-02-12 | Lectret S.A. | Shielded electret transducer and method of making the same |
US5146435A (en) * | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
-
1993
- 1993-03-11 DK DK93301864T patent/DK0561566T3/da active
- 1993-03-11 EP EP93301864A patent/EP0561566B1/fr not_active Expired - Lifetime
- 1993-03-11 DE DE69325732T patent/DE69325732T2/de not_active Expired - Fee Related
- 1993-03-12 CA CA002092627A patent/CA2092627A1/fr not_active Abandoned
- 1993-03-16 AU AU35260/93A patent/AU659290B2/en not_active Ceased
- 1993-03-17 NO NO93930970A patent/NO930970L/no not_active Application Discontinuation
- 1993-03-17 FI FI931183A patent/FI931183A/fi unknown
- 1993-03-18 JP JP05816193A patent/JP3451593B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69325732T2 (de) | 2000-04-27 |
EP0561566A3 (en) | 1994-12-14 |
EP0561566B1 (fr) | 1999-07-28 |
JPH0750899A (ja) | 1995-02-21 |
DE69325732D1 (de) | 1999-09-02 |
CA2092627A1 (fr) | 1993-09-19 |
EP0561566A2 (fr) | 1993-09-22 |
FI931183A (fi) | 1993-09-19 |
DK0561566T3 (da) | 2000-03-27 |
AU659290B2 (en) | 1995-05-11 |
FI931183A0 (fi) | 1993-03-17 |
NO930970D0 (no) | 1993-03-17 |
AU3526093A (en) | 1993-09-23 |
JP3451593B2 (ja) | 2003-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |