NO901480D0 - Tett fluid-fotokjemisk fremgangsmaate til substratbehandling. - Google Patents

Tett fluid-fotokjemisk fremgangsmaate til substratbehandling.

Info

Publication number
NO901480D0
NO901480D0 NO901480A NO901480A NO901480D0 NO 901480 D0 NO901480 D0 NO 901480D0 NO 901480 A NO901480 A NO 901480A NO 901480 A NO901480 A NO 901480A NO 901480 D0 NO901480 D0 NO 901480D0
Authority
NO
Norway
Prior art keywords
substrate
substrate treatment
close fluid
chemical procedure
photo chemical
Prior art date
Application number
NO901480A
Other languages
English (en)
Other versions
NO901480L (no
Inventor
David P Jackson
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of NO901480D0 publication Critical patent/NO901480D0/no
Publication of NO901480L publication Critical patent/NO901480L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S210/00—Liquid purification or separation
    • Y10S210/902—Materials removed
    • Y10S210/908—Organic

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Physical Water Treatments (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Catalysts (AREA)
  • Treatment Of Sludge (AREA)
  • Weting (AREA)
  • Cleaning In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
NO90901480A 1989-04-03 1990-04-02 Tett fluidfotokjemisk fremgangsmaate til substratbehandling NO901480L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/332,124 US5068040A (en) 1989-04-03 1989-04-03 Dense phase gas photochemical process for substrate treatment

Publications (2)

Publication Number Publication Date
NO901480D0 true NO901480D0 (no) 1990-04-02
NO901480L NO901480L (no) 1990-10-04

Family

ID=23296806

Family Applications (1)

Application Number Title Priority Date Filing Date
NO90901480A NO901480L (no) 1989-04-03 1990-04-02 Tett fluidfotokjemisk fremgangsmaate til substratbehandling

Country Status (8)

Country Link
US (3) US5068040A (no)
EP (1) EP0391035B1 (no)
JP (1) JP2770883B2 (no)
AT (1) ATE108224T1 (no)
CA (1) CA2009748A1 (no)
DE (1) DE69010368T2 (no)
DK (1) DK0391035T3 (no)
NO (1) NO901480L (no)

Families Citing this family (174)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5505856A (en) * 1989-05-23 1996-04-09 Eco Purification Systems, Bv Process for the purification of contaminated water by activated ozone
EP0502356A3 (en) * 1991-02-28 1993-03-10 Texas Instruments Incorporated Photo-stimulated removal of trace metals
US5695569A (en) * 1991-02-28 1997-12-09 Texas Instruments Incorporated Removal of metal contamination
US5470154A (en) * 1991-04-18 1995-11-28 Osaka Sanso Kogyo Ltd. Method of cleaning the reflector mirror in an optical dew point meter and an optical dew point meter equipped with a cleaning device
US5221424A (en) * 1991-11-21 1993-06-22 Applied Materials, Inc. Method for removal of photoresist over metal which also removes or inactivates corosion-forming materials remaining from previous metal etch
KR930019861A (ko) * 1991-12-12 1993-10-19 완다 케이. 덴슨-로우 조밀상 기체를 이용한 코팅 방법
US5328517A (en) * 1991-12-24 1994-07-12 Mcdonnell Douglas Corporation Method and system for removing a coating from a substrate using radiant energy and a particle stream
FR2686351A1 (fr) * 1992-01-20 1993-07-23 Metalimphy Procede de nettoyage et degraissage de produits metalliques conditionnes sous forme de bobine ou de feuilles formant tas et installation pour sa mise en óoeuvre.
JP2727481B2 (ja) * 1992-02-07 1998-03-11 キヤノン株式会社 液晶素子用ガラス基板の洗浄方法
US6391117B2 (en) 1992-02-07 2002-05-21 Canon Kabushiki Kaisha Method of washing substrate with UV radiation and ultrasonic cleaning
US5777726A (en) * 1992-05-12 1998-07-07 Raytheon Company Spectrophotometric supercritical fluid contamination monitor
US5417826A (en) * 1992-06-15 1995-05-23 Micron Technology, Inc. Removal of carbon-based polymer residues with ozone, useful in the cleaning of plasma reactors
US5368171A (en) * 1992-07-20 1994-11-29 Jackson; David P. Dense fluid microwave centrifuge
US5316591A (en) * 1992-08-10 1994-05-31 Hughes Aircraft Company Cleaning by cavitation in liquefied gas
US5456759A (en) * 1992-08-10 1995-10-10 Hughes Aircraft Company Method using megasonic energy in liquefied gases
JPH06224175A (ja) 1992-08-12 1994-08-12 Texas Instr Inc <Ti> ＣａＦ２エッチング法
US5256308A (en) * 1992-08-19 1993-10-26 Betz Laboratories, Inc. Method for the cure and removal of overspray paint from the water wash system of paint spray booths
US6017397A (en) * 1993-03-05 2000-01-25 Hyundai Eletronics America Automated washing method
US5656096A (en) * 1993-05-25 1997-08-12 Polygon Industries, Inc. Method for photopyrolitically removing a contaminant
US5377705A (en) * 1993-09-16 1995-01-03 Autoclave Engineers, Inc. Precision cleaning system
US5370740A (en) * 1993-10-01 1994-12-06 Hughes Aircraft Company Chemical decomposition by sonication in liquid carbon dioxide
TW260806B (no) * 1993-11-26 1995-10-21 Ushio Electric Inc
US5486267A (en) * 1994-02-28 1996-01-23 International Business Machines Corporation Method for applying photoresist
US5470480A (en) * 1994-05-09 1995-11-28 Eka Nobel, Inc. Process for treating waste water effluent
KR0137841B1 (ko) * 1994-06-07 1998-04-27 문정환 식각잔류물 제거방법
JPH0864559A (ja) * 1994-06-14 1996-03-08 Fsi Internatl Inc 基板面から不要な物質を除去する方法
US6124211A (en) * 1994-06-14 2000-09-26 Fsi International, Inc. Cleaning method
US5534107A (en) * 1994-06-14 1996-07-09 Fsi International UV-enhanced dry stripping of silicon nitride films
JPH0829989A (ja) * 1994-07-14 1996-02-02 Furontetsuku:Kk フォトレジスト膜の除去方法
US5635102A (en) 1994-09-28 1997-06-03 Fsi International Highly selective silicon oxide etching method
US5501761A (en) * 1994-10-18 1996-03-26 At&T Corp. Method for stripping conformal coatings from circuit boards
EP0791093B1 (en) * 1994-11-09 2001-04-11 R.R. STREET &amp; CO., INC. Method and system for rejuvenating pressurized fluid solvents used in cleaning substrates
JPH08330266A (ja) * 1995-05-31 1996-12-13 Texas Instr Inc <Ti> 半導体装置等の表面を浄化し、処理する方法
US5637231A (en) * 1995-06-07 1997-06-10 Huron Valley Technology, Inc. Method and apparatus for using ozone in a pressure vessel to treat stream of pollutants
JPH0950735A (ja) * 1995-08-07 1997-02-18 Niles Parts Co Ltd 車両用ターンシグナルスイッチのキャンセル機構
US5783082A (en) * 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
US5709754A (en) * 1995-12-29 1998-01-20 Micron Technology, Inc. Method and apparatus for removing photoresist using UV and ozone/oxygen mixture
US5782986A (en) * 1996-01-11 1998-07-21 Fsi International Process for metals removal using beta-diketone or beta-ketoimine ligand forming compounds
US5824604A (en) * 1996-01-23 1998-10-20 Mattson Technology, Inc. Hydrocarbon-enhanced dry stripping of photoresist
US5872157A (en) * 1996-01-30 1999-02-16 The University Of North Carolina At Chapel Hill Method for olefin oxidation
US5868856A (en) * 1996-07-25 1999-02-09 Texas Instruments Incorporated Method for removing inorganic contamination by chemical derivitization and extraction
KR19980018262A (ko) * 1996-08-01 1998-06-05 윌리엄 비.켐플러 입출력포트 및 램 메모리 어드레스 지정기술
US5881577A (en) * 1996-09-09 1999-03-16 Air Liquide America Corporation Pressure-swing absorption based cleaning methods and systems
US5908510A (en) * 1996-10-16 1999-06-01 International Business Machines Corporation Residue removal by supercritical fluids
JPH10203234A (ja) 1997-01-20 1998-08-04 Tokai Rika Co Ltd ターンシグナルキャンセル機構
US5766368A (en) * 1997-02-14 1998-06-16 Eco-Snow Systems, Inc. Integrated circuit chip module cleaning using a carbon dioxide jet spray
US6500267B1 (en) * 1998-10-06 2002-12-31 Net Zero, Inc. Reduction of energy consumption in a cooling or heating system through UVC irradiation
JPH10261687A (ja) * 1997-03-18 1998-09-29 Furontetsuku:Kk 半導体等製造装置
US5822818A (en) * 1997-04-15 1998-10-20 Hughes Electronics Solvent resupply method for use with a carbon dioxide cleaning system
US6306564B1 (en) 1997-05-27 2001-10-23 Tokyo Electron Limited Removal of resist or residue from semiconductors using supercritical carbon dioxide
US6500605B1 (en) 1997-05-27 2002-12-31 Tokyo Electron Limited Removal of photoresist and residue from substrate using supercritical carbon dioxide process
TW539918B (en) 1997-05-27 2003-07-01 Tokyo Electron Ltd Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US5971368A (en) 1997-10-29 1999-10-26 Fsi International, Inc. System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized
WO1999026277A1 (en) 1997-11-17 1999-05-27 Mattson Technology, Inc. Systems and methods for plasma enhanced processing of semiconductor wafers
FR2771661B1 (fr) * 1997-11-28 2000-02-25 Incam Solutions Procede et dispositif de nettoyage par voie des fluides supercritiques d'objets en matiere plastique de formes complexes
US6080531A (en) * 1998-03-30 2000-06-27 Fsi International, Inc. Organic removal process
US6113708A (en) * 1998-05-26 2000-09-05 Candescent Technologies Corporation Cleaning of flat-panel display
US6048369A (en) * 1998-06-03 2000-04-11 North Carolina State University Method of dyeing hydrophobic textile fibers with colorant materials in supercritical fluid carbon dioxide
US5996155A (en) * 1998-07-24 1999-12-07 Raytheon Company Process for cleaning, disinfecting, and sterilizing materials using the combination of dense phase gas and ultraviolet radiation
JP4239310B2 (ja) * 1998-09-01 2009-03-18 ソニー株式会社 半導体装置の製造方法
US7064070B2 (en) * 1998-09-28 2006-06-20 Tokyo Electron Limited Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
US6235641B1 (en) 1998-10-30 2001-05-22 Fsi International Inc. Method and system to control the concentration of dissolved gas in a liquid
US6407385B1 (en) * 1998-12-18 2002-06-18 Nikon Corporation Methods and apparatus for removing particulate foreign matter from the surface of a sample
US6734120B1 (en) * 1999-02-19 2004-05-11 Axcelis Technologies, Inc. Method of photoresist ash residue removal
US6254689B1 (en) * 1999-03-09 2001-07-03 Lucent Technologies Inc. System and method for flash photolysis cleaning of a semiconductor processing chamber
US6558622B1 (en) * 1999-05-04 2003-05-06 Steris Corporation Sub-critical fluid cleaning and antimicrobial decontamination system and process
US6406551B1 (en) 1999-05-14 2002-06-18 Fsi International, Inc. Method for treating a substrate with heat sensitive agents
US6790783B1 (en) * 1999-05-27 2004-09-14 Micron Technology, Inc. Semiconductor fabrication apparatus
US6631726B1 (en) * 1999-08-05 2003-10-14 Hitachi Electronics Engineering Co., Ltd. Apparatus and method for processing a substrate
US6881331B1 (en) * 1999-09-10 2005-04-19 Ronald L. Barnes Assembly for purifying water
US6228563B1 (en) 1999-09-17 2001-05-08 Gasonics International Corporation Method and apparatus for removing post-etch residues and other adherent matrices
JP2001158827A (ja) * 1999-09-21 2001-06-12 Daicel Chem Ind Ltd プラスチック成形品の表面改質方法及び表面改質プラスチック成形品
US6589355B1 (en) * 1999-10-29 2003-07-08 Alliedsignal Inc. Cleaning processes using hydrofluorocarbon and/or hydrochlorofluorocarbon compounds
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
CA2387341A1 (en) 1999-11-02 2001-05-10 Tokyo Electron Limited Method and apparatus for supercritical processing of multiple workpieces
US6261326B1 (en) 2000-01-13 2001-07-17 North Carolina State University Method for introducing dyes and other chemicals into a textile treatment system
US6558475B1 (en) * 2000-04-10 2003-05-06 International Business Machines Corporation Process for cleaning a workpiece using supercritical carbon dioxide
CN1216415C (zh) 2000-04-25 2005-08-24 东京毅力科创株式会社 沉积金属薄膜的方法和包括超临界干燥/清洁组件的金属沉积组合工具
US6921456B2 (en) 2000-07-26 2005-07-26 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
AU2001279136A1 (en) * 2000-07-31 2002-02-13 The Deflex Corporation Near critical and supercritical ozone substrate treatment and apparatus for same
AU2001288402A1 (en) * 2000-08-23 2002-03-04 Deflex Llc Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays
US20040011378A1 (en) 2001-08-23 2004-01-22 Jackson David P Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays
US6676710B2 (en) 2000-10-18 2004-01-13 North Carolina State University Process for treating textile substrates
JP4047727B2 (ja) * 2001-04-10 2008-02-13 東京エレクトロン株式会社 流体流れを強化した半導体基板用高圧プロセスチャンバ
JP3883929B2 (ja) 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
US20030062071A1 (en) * 2001-09-28 2003-04-03 Sorbo Nelson W. Dense-phase fluid cleaning system utilizing ultrasonic transducers
TW497494U (en) * 2001-12-28 2002-08-01 Metal Ind Redearch & Amp Dev C Fluid driven stirring device for compressing gas cleaning system
WO2003064065A1 (en) * 2002-01-25 2003-08-07 Supercritical Systems Inc. Method for reducing the formation of contaminants during supercritical carbon dioxide processes
US6924086B1 (en) 2002-02-15 2005-08-02 Tokyo Electron Limited Developing photoresist with supercritical fluid and developer
JP2006508521A (ja) * 2002-02-15 2006-03-09 東京エレクトロン株式会社 溶剤浴と超臨界ｃｏ２を用いたレジストの乾燥
US7108781B2 (en) * 2002-02-26 2006-09-19 Usfilter Corporation Enhanced air and water purification using continuous breakpoint halogenation with free oxygen radicals
US6991735B2 (en) * 2002-02-26 2006-01-31 Usfilter Corporation Free radical generator and method
US20050227187A1 (en) * 2002-03-04 2005-10-13 Supercritical Systems Inc. Ionic fluid in supercritical fluid for semiconductor processing
US7387868B2 (en) 2002-03-04 2008-06-17 Tokyo Electron Limited Treatment of a dielectric layer using supercritical CO2
US7270941B2 (en) * 2002-03-04 2007-09-18 Tokyo Electron Limited Method of passivating of low dielectric materials in wafer processing
US6953654B2 (en) 2002-03-14 2005-10-11 Tokyo Electron Limited Process and apparatus for removing a contaminant from a substrate
US20040003828A1 (en) 2002-03-21 2004-01-08 Jackson David P. Precision surface treatments using dense fluids and a plasma
JP4031440B2 (ja) * 2002-03-22 2008-01-09 東京エレクトロン株式会社 超臨界処理を用いる汚染物の除去
US7169540B2 (en) * 2002-04-12 2007-01-30 Tokyo Electron Limited Method of treatment of porous dielectric films to reduce damage during cleaning
US6764552B1 (en) 2002-04-18 2004-07-20 Novellus Systems, Inc. Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
US20040154641A1 (en) * 2002-05-17 2004-08-12 P.C.T. Systems, Inc. Substrate processing apparatus and method
US20040011386A1 (en) * 2002-07-17 2004-01-22 Scp Global Technologies Inc. Composition and method for removing photoresist and/or resist residue using supercritical fluids
US20040050406A1 (en) * 2002-07-17 2004-03-18 Akshey Sehgal Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical
US6715498B1 (en) 2002-09-06 2004-04-06 Novellus Systems, Inc. Method and apparatus for radiation enhanced supercritical fluid processing
US20080004194A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US7267727B2 (en) * 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
US20080000505A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US6880560B2 (en) * 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
US7081208B2 (en) * 2002-12-16 2006-07-25 International Business Machines Corporation Method to build a microfilter
US20040112409A1 (en) * 2002-12-16 2004-06-17 Supercritical Sysems, Inc. Fluoride in supercritical fluid for photoresist and residue removal
US20040177867A1 (en) * 2002-12-16 2004-09-16 Supercritical Systems, Inc. Tetra-organic ammonium fluoride and HF in supercritical fluid for photoresist and residue removal
US20040154647A1 (en) * 2003-02-07 2004-08-12 Supercritical Systems, Inc. Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
US8017568B2 (en) * 2003-02-28 2011-09-13 Intel Corporation Cleaning residues from semiconductor structures
US20040198066A1 (en) * 2003-03-21 2004-10-07 Applied Materials, Inc. Using supercritical fluids and/or dense fluids in semiconductor applications
US20040231707A1 (en) * 2003-05-20 2004-11-25 Paul Schilling Decontamination of supercritical wafer processing equipment
US8589311B2 (en) * 2003-06-13 2013-11-19 Sap Aktiengesellschaft Designing business content for reporting
US6905958B2 (en) * 2003-07-25 2005-06-14 Intel Corporation Protecting metal conductors with sacrificial organic monolayers
US7163380B2 (en) * 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US20050029492A1 (en) * 2003-08-05 2005-02-10 Hoshang Subawalla Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols
US20050039775A1 (en) * 2003-08-19 2005-02-24 Whitlock Walter H. Process and system for cleaning surfaces of semiconductor wafers
TWI233168B (en) * 2003-09-01 2005-05-21 Macronix Int Co Ltd Method of cleaning surface of wafer by hydroxyl radical of deionized water
US7416370B2 (en) * 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US7553803B2 (en) * 2004-03-01 2009-06-30 Advanced Technology Materials, Inc. Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions
US20050279453A1 (en) * 2004-06-17 2005-12-22 Uvtech Systems, Inc. System and methods for surface cleaning
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7195676B2 (en) * 2004-07-13 2007-03-27 Air Products And Chemicals, Inc. Method for removal of flux and other residue in dense fluid systems
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US20060065189A1 (en) * 2004-09-30 2006-03-30 Darko Babic Method and system for homogenization of supercritical fluid in a high pressure processing system
US20060065288A1 (en) * 2004-09-30 2006-03-30 Darko Babic Supercritical fluid processing system having a coating on internal members and a method of using
US20060081273A1 (en) * 2004-10-20 2006-04-20 Mcdermott Wayne T Dense fluid compositions and processes using same for article treatment and residue removal
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US20060135047A1 (en) * 2004-12-22 2006-06-22 Alexei Sheydayi Method and apparatus for clamping a substrate in a high pressure processing system
US20060134332A1 (en) * 2004-12-22 2006-06-22 Darko Babic Precompressed coating of internal members in a supercritical fluid processing system
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7140393B2 (en) 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7291565B2 (en) 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US20060185694A1 (en) * 2005-02-23 2006-08-24 Richard Brown Rinsing step in supercritical processing
US20060186088A1 (en) * 2005-02-23 2006-08-24 Gunilla Jacobson Etching and cleaning BPSG material using supercritical processing
US20060185693A1 (en) * 2005-02-23 2006-08-24 Richard Brown Cleaning step in supercritical processing
US7550075B2 (en) 2005-03-23 2009-06-23 Tokyo Electron Ltd. Removal of contaminants from a fluid
US20060223899A1 (en) * 2005-03-30 2006-10-05 Hillman Joseph T Removal of porogens and porogen residues using supercritical CO2
US7399708B2 (en) * 2005-03-30 2008-07-15 Tokyo Electron Limited Method of treating a composite spin-on glass/anti-reflective material prior to cleaning
US20060219268A1 (en) * 2005-03-30 2006-10-05 Gunilla Jacobson Neutralization of systemic poisoning in wafer processing
US7442636B2 (en) * 2005-03-30 2008-10-28 Tokyo Electron Limited Method of inhibiting copper corrosion during supercritical CO2 cleaning
US7407554B2 (en) * 2005-04-12 2008-08-05 International Business Machines Corporation Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US7524383B2 (en) 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
US20070000519A1 (en) * 2005-06-30 2007-01-04 Gunilla Jacobson Removal of residues for low-k dielectric materials in wafer processing
US20070084793A1 (en) * 2005-10-18 2007-04-19 Nigel Wenden Method and apparatus for producing ultra-high purity water
US8652336B2 (en) 2006-06-06 2014-02-18 Siemens Water Technologies Llc Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US12103874B2 (en) 2006-06-06 2024-10-01 Evoqua Water Technologies Llc Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US10343939B2 (en) 2006-06-06 2019-07-09 Evoqua Water Technologies Llc Ultraviolet light activated oxidation process for the reduction of organic carbon in semiconductor process water
US7518128B2 (en) * 2006-06-30 2009-04-14 Asml Netherlands B.V. Lithographic apparatus comprising a cleaning arrangement, cleaning arrangement and method for cleaning a surface to be cleaned
US20080296258A1 (en) * 2007-02-08 2008-12-04 Elliott David J Plenum reactor system
US20080245737A1 (en) * 2007-04-03 2008-10-09 Siemens Water Technologies Corp. Method and system for providing ultrapure water
US8753522B2 (en) * 2007-04-03 2014-06-17 Evoqua Water Technologies Llc System for controlling introduction of a reducing agent to a liquid stream
US9365436B2 (en) * 2007-04-03 2016-06-14 Evoqua Water Technologies Llc Method of irradiating a liquid
US8961798B2 (en) * 2007-04-03 2015-02-24 Evoqua Water Technologies Llc Method for measuring a concentration of a compound in a liquid stream
US9725343B2 (en) 2007-04-03 2017-08-08 Evoqua Water Technologies Llc System and method for measuring and treating a liquid stream
US8741155B2 (en) * 2007-04-03 2014-06-03 Evoqua Water Technologies Llc Method and system for providing ultrapure water
US9365435B2 (en) * 2007-04-03 2016-06-14 Evoqua Water Technologies Llc Actinic radiation reactor
US20110309032A1 (en) * 2009-02-25 2011-12-22 Maeki Markus System and method for photochemical treatment of liquid substances with ultraviolet light inside liquid conveying tubings
US8591730B2 (en) * 2009-07-30 2013-11-26 Siemens Pte. Ltd. Baffle plates for an ultraviolet reactor
DE102009058962B4 (de) * 2009-11-03 2012-12-27 Suss Microtec Photomask Equipment Gmbh & Co. Kg Verfahren und Vorrichtung zum Behandeln von Substraten
US20110136057A1 (en) * 2009-12-08 2011-06-09 Kazumi Ohtaki Method for treating electrophotographic carrier, method for producing electrophotographic carrier, core material and carrier
US9196497B2 (en) * 2010-06-08 2015-11-24 Amethyst Research, Inc. Photolytic processing of materials with hydrogen
EP2527301B1 (en) 2011-05-26 2016-04-27 Evoqua Water Technologies GmbH Method and arrangement for a water treatment
US9079227B2 (en) 2013-04-08 2015-07-14 Ronald L. Barnes Sanitizing and cleaning process and apparatus
CN105340067B (zh) * 2013-04-30 2018-07-06 奥加诺株式会社 铜露出基板的清洗方法和清洗系统
US11161762B2 (en) 2015-01-21 2021-11-02 Evoqua Water Technologies Llc Advanced oxidation process for ex-situ groundwater remediation
CA2918564C (en) 2015-01-21 2023-09-19 Evoqua Water Technologies Llc Advanced oxidation process for ex-situ groundwater remediation
IT202000032690A1 (it) * 2020-12-29 2022-06-29 Findex Distribuzione S R L Metodo e sistema di depurazione di condensa

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT992983B (it) * 1972-08-18 1975-09-30 Gen Electric Metodo per asportare materiale fotoresistente da un supporto
US4124528A (en) * 1974-10-04 1978-11-07 Arthur D. Little, Inc. Process for regenerating adsorbents with supercritical fluids
US4012321A (en) * 1975-03-25 1977-03-15 The United States Of America As Represented By The Secretary Of The Navy Oxidation of refractory organics in aqueous waste streams by hydrogen peroxide and ultraviolet light
US4028135A (en) * 1976-04-22 1977-06-07 The United States Of America As Represented By The Secretary Of The Army Method of cleaning surfaces by irradiation with ultraviolet light
US4179616A (en) * 1978-02-21 1979-12-18 Thetford Corporation Apparatus for sanitizing liquids with ultra-violet radiation and ozone
US4260484A (en) * 1979-03-29 1981-04-07 Standard Oil Company (Indiana) Process for renewing the adsorptive capacity of a bed of active carbon
US4274970A (en) * 1979-10-29 1981-06-23 Beitzel Stuart W Method and apparatus for treating water
US4543190A (en) * 1980-05-08 1985-09-24 Modar, Inc. Processing methods for the oxidation of organics in supercritical water
US4289594A (en) * 1980-05-09 1981-09-15 International Business Machines Corporation Treatment of waste compositions
DE3042193A1 (de) * 1980-11-08 1982-06-24 Hoechst Ag, 6000 Frankfurt Verfahren zur reinigung von abwasser
US4437999A (en) * 1981-08-31 1984-03-20 Gram Research & Development Co. Method of treating contaminated insoluble organic solid material
US4541913A (en) * 1981-10-16 1985-09-17 Coal Industry (Patents) Limited Process for hydrocracking supercritical gas extracts of carbonaceous material
EP0127643A1 (en) * 1982-12-06 1984-12-12 Hughes Aircraft Company Method of cleaning articles using super-critical gases
JPS60192333A (ja) * 1984-03-13 1985-09-30 Hitachi Ltd 有機塗布硬化膜の除去方法
US4640782A (en) * 1985-03-13 1987-02-03 Ozo-Tek, Inc. Method and apparatus for the generation and utilization of ozone and singlet oxygen
US4568447A (en) * 1985-07-29 1986-02-04 Uop Inc. Process for the removal of trace quantities of hydrocarbonaceous compounds from an aqueous stream
US4735728A (en) * 1985-08-29 1988-04-05 Environmental Tech America, Inc. Method for pollution control in photographic processing
US4654144A (en) * 1986-02-03 1987-03-31 National Distillers And Chemical Corporation Process for the destruction of noxious gases with ozone
US4675101A (en) * 1986-05-15 1987-06-23 The United States Of America As Represented By The United States Department Of Energy Step-wise supercritical extraction of carbonaceous residua
US4885047A (en) * 1986-08-11 1989-12-05 Fusion Systems Corporation Apparatus for photoresist stripping
US4751005A (en) * 1986-08-22 1988-06-14 Nippon Shokubai Kagaku Kogyo Co., Ltd. Method for treatment of waste water
JP2564538B2 (ja) * 1987-03-27 1996-12-18 株式会社 半導体エネルギ−研究所 半導体処理装置
JPS6445125A (en) * 1987-08-14 1989-02-17 Hitachi Ltd Method and apparatus for cleaning semiconductor wafer
JPS6445131A (en) * 1987-08-14 1989-02-17 Hitachi Ltd Cleaning and oxidation of semiconductor wafer
US4793931A (en) * 1987-09-10 1988-12-27 Solarchem Research, A Division Of Brolor Investments Limited Process for treatment of organic contaminants in solid or liquid phase wastes
US4849114A (en) * 1988-02-18 1989-07-18 Ultrox International Oxidation of toxic compounds in water
US4956098A (en) * 1988-08-19 1990-09-11 Solarchem Enterprises Inc. Oxidation and photoxidation process
US5013366A (en) * 1988-12-07 1991-05-07 Hughes Aircraft Company Cleaning process using phase shifting of dense phase gases

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CA2009748A1 (en) 1990-10-03
JP2770883B2 (ja) 1998-07-02
ATE108224T1 (de) 1994-07-15
US5068040A (en) 1991-11-26
NO901480L (no) 1990-10-04
US5236602A (en) 1993-08-17
DE69010368D1 (de) 1994-08-11
EP0391035B1 (en) 1994-07-06
DK0391035T3 (da) 1994-08-01
JPH0368139A (ja) 1991-03-25
EP0391035A3 (en) 1991-07-31
EP0391035A2 (en) 1990-10-10
DE69010368T2 (de) 1994-11-03
US5215592A (en) 1993-06-01

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