NO854790L - Dielektriske materialer med lave dielektriske konstanter og fremgangsmaate for deres fremstilling. - Google Patents

Dielektriske materialer med lave dielektriske konstanter og fremgangsmaate for deres fremstilling.

Info

Publication number
NO854790L
NO854790L NO854790A NO854790A NO854790L NO 854790 L NO854790 L NO 854790L NO 854790 A NO854790 A NO 854790A NO 854790 A NO854790 A NO 854790A NO 854790 L NO854790 L NO 854790L
Authority
NO
Norway
Prior art keywords
procedure
manufacturing
dielectric materials
materials
dielectric
Prior art date
Application number
NO854790A
Other languages
English (en)
Other versions
NO164950B (no
NO164950C (no
Inventor
Daniel David Johnson
Original Assignee
Gore & Ass
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gore & Ass filed Critical Gore & Ass
Publication of NO854790L publication Critical patent/NO854790L/no
Publication of NO164950B publication Critical patent/NO164950B/no
Publication of NO164950C publication Critical patent/NO164950C/no

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022Non-woven fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024Woven fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • B32B2260/023Two or more layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02Synthetic macromolecular fibres
    • B32B2262/0261Polyamide fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08Glass
    • B32B2315/085Glass fiber cloth or fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00Epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00Polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08Polyimides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0278Polymeric fibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31529Next to metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/3154Of fluorinated addition polymer from unsaturated monomers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/3154Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544Addition polymer is perhalogenated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382Including a free metal or alloy constituent
    • Y10T442/3415Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382Including a free metal or alloy constituent
    • Y10T442/3415Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y10T442/3423Plural metallic films or foils or sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Glass Compositions (AREA)
  • Ceramic Capacitors (AREA)
  • Reinforced Plastic Materials (AREA)
  • Artificial Filaments (AREA)
  • Organic Insulating Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Paper (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
NO854790A 1985-02-26 1985-11-28 Dielektriske materialer med lave dielektriske konstanter og fremgangsmaate for deres fremstilling. NO164950C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/705,538 US4680220A (en) 1985-02-26 1985-02-26 Dielectric materials

Publications (3)

Publication Number Publication Date
NO854790L true NO854790L (no) 1986-08-27
NO164950B NO164950B (no) 1990-08-20
NO164950C NO164950C (no) 1990-12-05

Family

ID=24833928

Family Applications (1)

Application Number Title Priority Date Filing Date
NO854790A NO164950C (no) 1985-02-26 1985-11-28 Dielektriske materialer med lave dielektriske konstanter og fremgangsmaate for deres fremstilling.

Country Status (20)

Country Link
US (1) US4680220A (no)
EP (1) EP0194381B1 (no)
JP (1) JP2578097B2 (no)
KR (1) KR900005893B1 (no)
AT (1) ATE47267T1 (no)
AU (1) AU574518B2 (no)
DE (1) DE3573702D1 (no)
DK (1) DK569085A (no)
EG (1) EG17361A (no)
ES (2) ES8800497A1 (no)
FI (1) FI854846A (no)
GB (1) GB2171356B (no)
GR (1) GR852947B (no)
HK (1) HK103491A (no)
IL (1) IL76975A (no)
IN (1) IN166493B (no)
NO (1) NO164950C (no)
NZ (1) NZ214011A (no)
SG (1) SG83291G (no)
ZA (1) ZA861438B (no)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975505A (en) * 1981-08-20 1990-12-04 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4985308A (en) * 1981-08-20 1991-01-15 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5000547A (en) * 1981-08-20 1991-03-19 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4999248A (en) * 1981-08-20 1991-03-12 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977026A (en) * 1981-08-20 1990-12-11 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4982056A (en) * 1981-08-20 1991-01-01 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxide
US4977025A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4973142A (en) * 1981-08-20 1990-11-27 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977008A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5006382A (en) * 1981-08-20 1991-04-09 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977297A (en) * 1981-08-20 1990-12-11 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4857400A (en) * 1984-02-22 1989-08-15 Gila River Products, Inc. Stratiform press pads and methods for use thereof in laminating flexible printed circuits
US4680220A (en) * 1985-02-26 1987-07-14 W. L. Gore & Associates, Inc. Dielectric materials
USRE32759E (en) * 1986-02-14 1988-10-04 Control Data Corporation Backup material for small bore drilling
US4784893A (en) * 1986-02-17 1988-11-15 Mitsubishi Denki Kabushiki Kaisha Heat conductive circuit board and method for manufacturing the same
JPH0246061Y2 (no) * 1986-03-17 1990-12-05
JPH07105577B2 (ja) * 1986-06-02 1995-11-13 ジヤパンゴアテツクス株式会社 プリント配線基板の製造法
DE3641342A1 (de) * 1986-12-03 1988-06-09 Huels Troisdorf Schichtpressstoff aus faserverstaerktem, vernetztem polypropylen
US4772509A (en) * 1987-04-13 1988-09-20 Japan Gore-Tex, Inc. Printed circuit board base material
US4755911A (en) * 1987-04-28 1988-07-05 Junkosha Co., Ltd. Multilayer printed circuit board
US4774127A (en) * 1987-06-15 1988-09-27 Tektronix, Inc. Fabrication of a multilayer conductive pattern on a dielectric substrate
EP0321977B1 (en) * 1987-12-23 1992-08-19 Mitsubishi Gas Chemical Company, Inc. Laminating material for printed circuit board of low dielectric constant
JP2661123B2 (ja) * 1988-04-11 1997-10-08 三菱瓦斯化学株式会社 複合撚糸織布を基材とする低誘電率積層板
JP2661137B2 (ja) * 1988-05-24 1997-10-08 三菱瓦斯化学株式会社 複合撚糸織布を基材とする低誘電率積層板
JPH01225539A (ja) * 1988-03-04 1989-09-08 Junkosha Co Ltd 積層板
US4868350A (en) * 1988-03-07 1989-09-19 International Business Machines Corporation High performance circuit boards
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits
US4847136A (en) * 1988-03-21 1989-07-11 Hughes Aircraft Company Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier
US4847146A (en) * 1988-03-21 1989-07-11 Hughes Aircraft Company Process for fabricating compliant layer board with selectively isolated solder pads
JPH0343217Y2 (no) * 1988-03-25 1991-09-10
US4985297A (en) * 1988-04-30 1991-01-15 Daikin Industries, Inc. Composite materials
JP2762544B2 (ja) * 1989-04-11 1998-06-04 三菱瓦斯化学株式会社 低誘電率プリント配線板材料
US5387495A (en) * 1989-06-28 1995-02-07 Digital Equipment Corporation Sequential multilayer process for using fluorinated hydrocarbons as a dielectric
US5034801A (en) * 1989-07-31 1991-07-23 W. L. Gore & Associates, Inc. Intergrated circuit element having a planar, solvent-free dielectric layer
US5126192A (en) * 1990-01-26 1992-06-30 International Business Machines Corporation Flame retardant, low dielectric constant microsphere filled laminate
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
DE4010694A1 (de) * 1990-04-03 1991-10-10 Hoechst Ag Faserverstaerkter werkstoff, verfahren zu seiner herstellung und seine verwendung
JPH05509116A (ja) * 1990-06-29 1993-12-16 ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティド 強化軟質複合材
US5880043A (en) * 1991-04-03 1999-03-09 Hoechst Aktiengesellschaft Fiber-reinforced material and production and use thereof
DE69226183T2 (de) * 1991-06-04 1998-12-10 Donaldson Co Inc Mit fluessigkeiten behandelte polytetrafluroaethylenprodukte und ihre herstellung
US5262234A (en) * 1991-10-17 1993-11-16 W. L. Gore & Associates, Inc. Polyetrafluoroethylene fiber containing conductive filler
GB2264296B (en) * 1992-02-07 1995-06-28 Zortech Int Microporous thermal insulation material
US5217797A (en) * 1992-02-19 1993-06-08 W. L. Gore & Associates, Inc. Chemically resistant diaphragm
US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
US5534337A (en) * 1993-04-05 1996-07-09 Cobale Company, L.L.C. Thermoset reinforced corrosion resistant laminates
CN1044762C (zh) 1993-09-22 1999-08-18 松下电器产业株式会社 印刷电路板及其制造方法
US5766750A (en) * 1994-08-25 1998-06-16 W. L. Gore & Associates, Inc. Process for making an adhesive-filler polymer film composite
US5753358A (en) * 1994-08-25 1998-05-19 W. L. Gore & Associates, Inc. Adhisive-filler polymer film composite
US5879794A (en) * 1994-08-25 1999-03-09 W. L. Gore & Associates, Inc. Adhesive-filler film composite
US5512360A (en) * 1994-09-20 1996-04-30 W. L. Gore & Associates, Inc. PTFE reinforced compliant adhesive and method of fabricating same
US5538756A (en) * 1994-09-23 1996-07-23 W. L. Gore & Associates High capacitance sheet adhesives and process for making the same
US5670250A (en) * 1995-02-24 1997-09-23 Polyclad Laminates, Inc. Circuit board prepreg with reduced dielectric constant
DE69605068T3 (de) * 1995-03-03 2005-12-15 W.L. Gore & Associates, Inc., Newark Klebezusammensetzung und Herstellungsverfahren
JPH10107391A (ja) * 1996-09-30 1998-04-24 O K Print:Kk 配線基板および配線基板用基材
US5847327A (en) * 1996-11-08 1998-12-08 W.L. Gore & Associates, Inc. Dimensionally stable core for use in high density chip packages
US5888631A (en) * 1996-11-08 1999-03-30 W. L. Gore & Associates, Inc. Method for minimizing warp in the production of electronic assemblies
US5879787A (en) * 1996-11-08 1999-03-09 W. L. Gore & Associates, Inc. Method and apparatus for improving wireability in chip modules
AU4902897A (en) 1996-11-08 1998-05-29 W.L. Gore & Associates, Inc. Method for improving reliability of thin circuit substrates by increasing the T of the substrate
EP1583407B1 (en) * 1998-02-26 2007-05-30 Ibiden Co., Ltd. Multilayer printed wiring board with filled viaholes
US6146484A (en) * 1998-05-21 2000-11-14 Northrop Grumman Corporation Continuous honeycomb lay-up process
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6132546A (en) * 1999-01-07 2000-10-17 Northrop Grumman Corporation Method for manufacturing honeycomb material
KR100406341B1 (ko) 1999-02-03 2004-01-31 가부시키가이샤 도모에가와 세이시쇼 열경화성 저유전수지조성물, 그것을 이용한 프리프레그,적층판 및 회로용 적층재
EP2086300A1 (en) 1999-06-02 2009-08-05 Ibiden Co., Ltd. Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
EP1194020A3 (en) * 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
WO2002098638A1 (en) * 2001-06-04 2002-12-12 Polymer Group, Inc. Three-dimensional nonwoven substrate for circuit board
US6783841B2 (en) 2001-09-14 2004-08-31 Tonoga, Inc. Low signal loss bonding ply for multilayer circuit boards
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
US20030118836A1 (en) * 2001-10-24 2003-06-26 Lee Jeong Chang Fluoropolymer laminates and a process for manufacture thereof
US7056571B2 (en) * 2002-12-24 2006-06-06 Matsushita Electric Industrial Co., Ltd. Wiring board and its production process
US20050121226A1 (en) * 2003-10-21 2005-06-09 Park Electrochemical Corporation Laminates having a low dielectric constant, low disapation factor bond core and method of making same
GB2410416A (en) * 2004-01-28 2005-08-03 David Richard Bloom Dentist's apron
JP4178241B2 (ja) * 2004-02-12 2008-11-12 富士通マイクロエレクトロニクス株式会社 配線容量抽出用の容量値ルールテーブルを生成する方法および容量値ルールファイル生成プログラム
JP4977600B2 (ja) 2004-04-20 2012-07-18 ジェンザイム・コーポレーション 外科手術用のメッシュ状インプラント
WO2007016642A2 (en) * 2005-07-29 2007-02-08 Foster-Miller, Inc. Dual function composite system and method of making same
JPWO2012161162A1 (ja) * 2011-05-23 2014-07-31 住友電工ファインポリマー株式会社 高周波回路基板
CN105392272B (zh) * 2015-10-16 2018-06-05 京东方科技集团股份有限公司 柔性电路板、覆晶薄膜、使用其的绑定方法和显示器件
CN111376547B (zh) * 2020-04-15 2021-06-15 燕山大学 一种纤维增强金属复合板的制备工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1399268A (en) * 1972-08-29 1975-07-02 Cosid Kautasit Werke Veb Packing elements
US4241132A (en) * 1978-08-17 1980-12-23 Castall Incorporated Insulating boards
GB2061989B (en) * 1979-10-26 1984-01-11 Castall Inc Insulating boards for printed circuits
JPS5774149A (en) * 1980-10-27 1982-05-10 Hitachi Chemical Co Ltd Laminated board
JPS57176132A (en) * 1981-04-24 1982-10-29 Junkosha Co Ltd Sheet-shaped resin material
US4680220A (en) * 1985-02-26 1987-07-14 W. L. Gore & Associates, Inc. Dielectric materials
EP0248617B1 (en) * 1986-06-02 1993-04-21 Japan Gore-Tex, Inc. Process for making substrates for printed circuit boards

Also Published As

Publication number Publication date
DK569085A (da) 1986-08-27
FI854846A0 (fi) 1985-12-09
IN166493B (no) 1990-05-19
ES557583A0 (es) 1987-11-16
NO164950B (no) 1990-08-20
KR900005893B1 (ko) 1990-08-13
HK103491A (en) 1991-12-27
EG17361A (en) 1989-09-30
EP0194381B1 (en) 1989-10-11
AU4832285A (en) 1986-09-04
AU574518B2 (en) 1988-07-07
DK569085D0 (da) 1985-12-09
JPS6290808A (ja) 1987-04-25
US4680220A (en) 1987-07-14
GB8530534D0 (en) 1986-01-22
ES549654A0 (es) 1987-11-01
NO164950C (no) 1990-12-05
NZ214011A (en) 1988-07-28
ZA861438B (en) 1986-10-29
SG83291G (en) 1992-02-14
ES8800781A1 (es) 1987-11-16
ES8800497A1 (es) 1987-11-01
ATE47267T1 (de) 1989-10-15
DE3573702D1 (en) 1989-11-16
IL76975A (en) 1990-07-12
EP0194381A3 (en) 1987-06-24
GB2171356A (en) 1986-08-28
KR860006912A (ko) 1986-09-15
FI854846A (fi) 1986-08-27
EP0194381A2 (en) 1986-09-17
JP2578097B2 (ja) 1997-02-05
GB2171356B (en) 1989-08-23
GR852947B (no) 1986-04-10

Similar Documents

Publication Publication Date Title
NO164950C (no) Dielektriske materialer med lave dielektriske konstanter og fremgangsmaate for deres fremstilling.
DE68928150T2 (de) Herstellungsverfahren von einer mehrschichtigen Leiterplatte
DE69215192T2 (de) Leiterplatte mit abgeschirmten bereichen sowie herstellungsverfahren einer solchen leiterplatte
DE68907089T2 (de) Leiterplatten mit niedriger Dielektrizitätskonstante.
EP0236999A3 (en) Lightweight insulating boards and process for manufacturing same.
KR890016886A (ko) 인쇄 회로판의 제조방법
DE3586532D1 (de) Mehrschichtleiterplatte mit hoher dichte.
FR2624654B1 (fr) Circuit integre monolithique micro-ondes et procede de fabrication
FR2625368B1 (fr) Circuit integre monolithique micro-onde et procede de fabrication correspondant
DE3787024T2 (de) Herstellungsverfahren eines Mikrowellenüberganges zwischen zwei orthogonalen Leitungsstrukturen und Mikrowellenschaltung mit diesem Übergang.
DE69112119T2 (de) Verbundplatte und Herstellungsverfahren von einer keramischen Leiterplatte unter Verwendung ersterer.
ES8701453A1 (es) Procedimiento para la fabricacion de placas de circuito impreso de capas multiples.
DE3373775D1 (en) Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards
FR2566612B1 (fr) Procede de fabrication de plaquettes a circuits imprimes, et plaquette ainsi obtenue
SE8505725L (sv) Invarfolie
FR2617667B1 (fr) Procede de fabrication d'une plaquette a circuit imprime et cette plaquette
KR890700263A (ko) 다층 레지스트 구조를 가진 부품 및 이의 제조방법
Hsiue et al. Advanced Printed Wiring Boards for Surface Mount Technology
KR860700085A (ko) 도전회로 기판 및 그 제조법
FR2628569B1 (fr) Circuit integre hyperfrequence et son procede de fabrication