NO743408L - - Google Patents
Info
- Publication number
- NO743408L NO743408L NO743408A NO743408A NO743408L NO 743408 L NO743408 L NO 743408L NO 743408 A NO743408 A NO 743408A NO 743408 A NO743408 A NO 743408A NO 743408 L NO743408 L NO 743408L
- Authority
- NO
- Norway
- Prior art keywords
- layers
- ceramic
- dielectric
- thin
- stack
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 claims description 88
- 238000000576 coating method Methods 0.000 claims description 84
- 239000000463 material Substances 0.000 claims description 63
- 239000000203 mixture Substances 0.000 claims description 55
- 239000003990 capacitor Substances 0.000 claims description 54
- 239000004020 conductor Substances 0.000 claims description 47
- 238000004519 manufacturing process Methods 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 45
- 239000011248 coating agent Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000003989 dielectric material Substances 0.000 claims description 25
- 239000011159 matrix material Substances 0.000 claims description 19
- 238000005245 sintering Methods 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 16
- 238000010304 firing Methods 0.000 claims description 14
- 229910010293 ceramic material Inorganic materials 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000012777 electrically insulating material Substances 0.000 claims description 5
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000007639 printing Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 10
- 239000002003 electrode paste Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 238000007596 consolidation process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WGIMXKDCVCTHGW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOCCO WGIMXKDCVCTHGW-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- VLTOSDJJTWPWLS-UHFFFAOYSA-N pent-2-ynal Chemical compound CCC#CC=O VLTOSDJJTWPWLS-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- DKDQMLPMKQLBHQ-UHFFFAOYSA-N strontium;barium(2+);oxido(dioxo)niobium Chemical compound [Sr+2].[Ba+2].[O-][Nb](=O)=O.[O-][Nb](=O)=O.[O-][Nb](=O)=O.[O-][Nb](=O)=O DKDQMLPMKQLBHQ-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40024273A | 1973-09-24 | 1973-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO743408L true NO743408L (OSRAM) | 1975-04-21 |
Family
ID=23582798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO743408A NO743408L (OSRAM) | 1973-09-24 | 1974-09-23 |
Country Status (18)
| Country | Link |
|---|---|
| JP (1) | JPS6258124B2 (OSRAM) |
| AR (1) | AR216889A1 (OSRAM) |
| AU (1) | AU500529B2 (OSRAM) |
| BE (1) | BE820287A (OSRAM) |
| BR (1) | BR7407820D0 (OSRAM) |
| CH (1) | CH586994A5 (OSRAM) |
| DE (4) | DE2461996A1 (OSRAM) |
| ES (3) | ES430301A1 (OSRAM) |
| FR (1) | FR2245063B1 (OSRAM) |
| GB (1) | GB1486308A (OSRAM) |
| IE (1) | IE40174B1 (OSRAM) |
| IL (1) | IL45512A (OSRAM) |
| IN (1) | IN143579B (OSRAM) |
| IT (1) | IT1022218B (OSRAM) |
| NL (1) | NL162504C (OSRAM) |
| NO (1) | NO743408L (OSRAM) |
| SE (4) | SE7411924L (OSRAM) |
| ZA (1) | ZA745838B (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53210A (en) * | 1976-06-23 | 1978-01-05 | Mitsubishi Electric Corp | Ceramic multiilayer structures and manufacture |
| JPS6057212B2 (ja) * | 1976-07-29 | 1985-12-13 | タム セラミツクス インコ−ポレイテツド | 単一焼結セラミック体およびその製造方法 |
| US4289719A (en) * | 1976-12-10 | 1981-09-15 | International Business Machines Corporation | Method of making a multi-layer ceramic substrate |
| JPS5441426A (en) * | 1977-07-01 | 1979-04-02 | Lucas Industries Ltd | Battery charging state indicator |
| DE3015356A1 (de) * | 1980-04-22 | 1981-10-29 | Robert Bosch Gmbh, 7000 Stuttgart | Freitragende schichten sowie verfahren zur herstellung freitragender schichten, insbesondere fuer sensoren fuer brennkraftmaschinen |
| GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
| US4771520A (en) * | 1985-04-25 | 1988-09-20 | Murata Manufacturing Co., Ltd. | Method of producing laminated ceramic capacitors |
| DE4121390C2 (de) * | 1991-06-28 | 1994-10-20 | Bosch Gmbh Robert | Verfahren zum Herstellen einer freitragenden Dickschichtstruktur |
| JP3980801B2 (ja) * | 1999-09-16 | 2007-09-26 | 株式会社東芝 | 三次元構造体およびその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2939059A (en) * | 1955-03-21 | 1960-05-31 | Clevite Corp | Capacitor of high permittivity ceramic |
| DE1141719B (de) * | 1955-03-21 | 1962-12-27 | Clevite Corp | Keramischer Kondensator und Verfahren zu seiner Herstellung |
| NL294447A (OSRAM) * | 1964-06-22 |
-
1974
- 1974-08-21 IL IL45512A patent/IL45512A/en unknown
- 1974-09-13 ZA ZA00745838A patent/ZA745838B/xx unknown
- 1974-09-16 IN IN2052/CAL/74A patent/IN143579B/en unknown
- 1974-09-17 IE IE1929/74A patent/IE40174B1/xx unknown
- 1974-09-17 AU AU73375/74A patent/AU500529B2/en not_active Expired
- 1974-09-20 DE DE19742461996 patent/DE2461996A1/de active Pending
- 1974-09-20 DE DE2461995A patent/DE2461995C3/de not_active Expired
- 1974-09-20 DE DE2461997A patent/DE2461997C2/de not_active Expired
- 1974-09-20 DE DE2445086A patent/DE2445086C2/de not_active Expired
- 1974-09-20 BR BR7820/74A patent/BR7407820D0/pt unknown
- 1974-09-21 JP JP49109444A patent/JPS6258124B2/ja not_active Expired
- 1974-09-23 CH CH1282774A patent/CH586994A5/xx not_active IP Right Cessation
- 1974-09-23 FR FR7432066A patent/FR2245063B1/fr not_active Expired
- 1974-09-23 SE SE7411924A patent/SE7411924L/xx unknown
- 1974-09-23 IT IT27592/74A patent/IT1022218B/it active
- 1974-09-23 NO NO743408A patent/NO743408L/no unknown
- 1974-09-23 ES ES430301A patent/ES430301A1/es not_active Expired
- 1974-09-24 GB GB41564/74A patent/GB1486308A/en not_active Expired
- 1974-09-24 NL NL7412599.A patent/NL162504C/xx not_active IP Right Cessation
- 1974-09-24 BE BE148847A patent/BE820287A/xx unknown
- 1974-09-24 AR AR255732A patent/AR216889A1/es active
-
1976
- 1976-06-30 ES ES449379A patent/ES449379A1/es not_active Expired
- 1976-06-30 ES ES449378A patent/ES449378A1/es not_active Expired
-
1978
- 1978-01-02 SE SE7800028A patent/SE7800028L/xx unknown
- 1978-01-02 SE SE7800026A patent/SE7800026L/xx unknown
- 1978-01-02 SE SE7800027A patent/SE7800027L/xx unknown
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4353957A (en) | Ceramic matrices for electronic devices and process for forming same | |
| US4030004A (en) | Dielectric ceramic matrices with end barriers | |
| US3965552A (en) | Process for forming internal conductors and electrodes | |
| US4071880A (en) | Ceramic bodies with end termination electrodes | |
| KR100649580B1 (ko) | 스핀코팅에 의한 적층세라믹 커패시터의 제조방법 및적층세라믹 커패시터 | |
| DE2264943A1 (de) | Verfahren zum ausbilden von elektroden und leitern und danach hergestellte gegenstaende | |
| NO743423L (OSRAM) | ||
| US4189760A (en) | Monolithic capacitor with non-noble metal electrodes and method of making the same | |
| JPH04221801A (ja) | バリスタ構造 | |
| US4071878A (en) | Method for producing capacitors and ceramic body therefore | |
| US3293077A (en) | Microelectronic capacitor material and method of fabrication | |
| CN100466120C (zh) | 堆积陶瓷电容器 | |
| JPH11510963A (ja) | セラミック多層基板の製造方法 | |
| IL45512A (en) | Ceramic capacitors and circuit boards and matrices therefor | |
| JPH0543335A (ja) | セラミツク成形体の焼成方法及び焼成装置 | |
| US3824127A (en) | Disc capacitor silver compositions | |
| CA1049107A (en) | Ceramic capacitors, circuit boards and matrices therefor | |
| JP3166953B2 (ja) | セラミック電子部品の製造方法 | |
| GB2118366A (en) | Terminals for multilayer ceramic dielectric capacitors | |
| JP3089922B2 (ja) | セラミック積層電子部品の製造方法 | |
| DE2462008B2 (de) | Mehrschichtige Schaltkreisstruktur und Verfahren zu ihrer Herstellung | |
| DE2462007C2 (de) | Einstückiger Schichtkondensator und Verfahren zu seiner Herstellung | |
| CA1039371A (en) | Articles with internal conductors and method of making such articles | |
| JPH07114174B2 (ja) | 積層型半導体磁器電子部品の製造方法 | |
| DE2462006A1 (de) | Mehrschichtige schaltkreisstrukturmatrix und verfahren zu ihrer herstellung |