GB1486308A - Ceramic capacitors and circuit boards - Google Patents
Ceramic capacitors and circuit boardsInfo
- Publication number
- GB1486308A GB1486308A GB41564/74A GB4156474A GB1486308A GB 1486308 A GB1486308 A GB 1486308A GB 41564/74 A GB41564/74 A GB 41564/74A GB 4156474 A GB4156474 A GB 4156474A GB 1486308 A GB1486308 A GB 1486308A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layers
- ceramic
- stacked
- spaces
- volatile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003985 ceramic capacitor Substances 0.000 title abstract 2
- 239000010410 layer Substances 0.000 abstract 7
- 239000000919 ceramic Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 4
- 239000003990 capacitor Substances 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 3
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 238000010304 firing Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- 239000001856 Ethyl cellulose Substances 0.000 abstract 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 238000010923 batch production Methods 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 229920001249 ethyl cellulose Polymers 0.000 abstract 1
- 235000019325 ethyl cellulose Nutrition 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- 239000011236 particulate material Substances 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
1486308 Capacitors; printed circuits NL INDUSTRIES Inc 24 Sept 1974 [24 Sept 1973] 41564/74 Headings H1M and H1R An intermediate in the manufacture of multilayer ceramic capacitors or circuit assemblies comprises stacked layers of ceramic material sintered to provide a dense monolithic body, the layers being separated by spaces corresponding to the eventual electrodes or circuit conductors, which spaces extend to an outside surface of the body directly or via another such space. The spaces are then filled with conductive material in a similar manner to that disclosed in Specification 1,373,575 or the modification thereof in Specification 1,424,879 and electrical connection is made to the electrodes or conductors at the edges of the ceramic body. To manufacture the intermediate body, layers of green ceramic are stacked with intervening layers of material which will volatilize completely on firing, these layers in the case of a multilayer capacitor extending alternately to opposite side faces of the stack but otherwise lying within the area of the ceramic layers. The volatile material may be a phenol modified rosin ester, ethyl cellulose, acrylic resin or polyvinyl alcohol, optionally containing volatile particulate material. It may be applied as a preformed film or by painting or printing. In a batch process, a repeating pattern of deposits of the volatile material is applied to a green ceramic sheet or strip, a plurality of these are stacked with deposits overlapping and alternate ones in register and the assembly is severed into individual capacitor precursors before or after firing. In the case of circuit assemblies, the volatile material is deposited in thin strips and also occupies holes in the ceramic layers for eventual interlayer connections.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40024273A | 1973-09-24 | 1973-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1486308A true GB1486308A (en) | 1977-09-21 |
Family
ID=23582798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB41564/74A Expired GB1486308A (en) | 1973-09-24 | 1974-09-24 | Ceramic capacitors and circuit boards |
Country Status (18)
| Country | Link |
|---|---|
| JP (1) | JPS6258124B2 (en) |
| AR (1) | AR216889A1 (en) |
| AU (1) | AU500529B2 (en) |
| BE (1) | BE820287A (en) |
| BR (1) | BR7407820D0 (en) |
| CH (1) | CH586994A5 (en) |
| DE (4) | DE2461997C2 (en) |
| ES (3) | ES430301A1 (en) |
| FR (1) | FR2245063B1 (en) |
| GB (1) | GB1486308A (en) |
| IE (1) | IE40174B1 (en) |
| IL (1) | IL45512A (en) |
| IN (1) | IN143579B (en) |
| IT (1) | IT1022218B (en) |
| NL (1) | NL162504C (en) |
| NO (1) | NO743408L (en) |
| SE (4) | SE7411924L (en) |
| ZA (1) | ZA745838B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4482933A (en) * | 1981-07-30 | 1984-11-13 | Itt Industries, Inc. | Multilayer doped ceramic capacitor |
| EP1085352A2 (en) * | 1999-09-16 | 2001-03-21 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53210A (en) * | 1976-06-23 | 1978-01-05 | Mitsubishi Electric Corp | Ceramic multiilayer structures and manufacture |
| JPS6057212B2 (en) * | 1976-07-29 | 1985-12-13 | タム セラミツクス インコ−ポレイテツド | Single sintered ceramic body and its manufacturing method |
| US4289719A (en) * | 1976-12-10 | 1981-09-15 | International Business Machines Corporation | Method of making a multi-layer ceramic substrate |
| JPS5441426A (en) * | 1977-07-01 | 1979-04-02 | Lucas Industries Ltd | Battery charging state indicator |
| DE3015356A1 (en) * | 1980-04-22 | 1981-10-29 | Robert Bosch Gmbh, 7000 Stuttgart | SUPPORTING LAYERS AND METHOD FOR PRODUCING SUPPORTING LAYERS, ESPECIALLY FOR SENSORS FOR INTERNAL COMBUSTION ENGINES |
| US4771520A (en) * | 1985-04-25 | 1988-09-20 | Murata Manufacturing Co., Ltd. | Method of producing laminated ceramic capacitors |
| DE4121390C2 (en) * | 1991-06-28 | 1994-10-20 | Bosch Gmbh Robert | Method for producing a self-supporting thick-film structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2939059A (en) * | 1955-03-21 | 1960-05-31 | Clevite Corp | Capacitor of high permittivity ceramic |
| DE1141719B (en) * | 1955-03-21 | 1962-12-27 | Clevite Corp | Ceramic capacitor and method for its manufacture |
| NL294447A (en) * | 1964-06-22 |
-
1974
- 1974-08-21 IL IL45512A patent/IL45512A/en unknown
- 1974-09-13 ZA ZA00745838A patent/ZA745838B/en unknown
- 1974-09-16 IN IN2052/CAL/74A patent/IN143579B/en unknown
- 1974-09-17 AU AU73375/74A patent/AU500529B2/en not_active Expired
- 1974-09-17 IE IE1929/74A patent/IE40174B1/en unknown
- 1974-09-20 DE DE2461997A patent/DE2461997C2/en not_active Expired
- 1974-09-20 DE DE19742461996 patent/DE2461996A1/en active Pending
- 1974-09-20 DE DE2461995A patent/DE2461995C3/en not_active Expired
- 1974-09-20 DE DE2445086A patent/DE2445086C2/en not_active Expired
- 1974-09-20 BR BR7820/74A patent/BR7407820D0/en unknown
- 1974-09-21 JP JP49109444A patent/JPS6258124B2/ja not_active Expired
- 1974-09-23 IT IT27592/74A patent/IT1022218B/en active
- 1974-09-23 SE SE7411924A patent/SE7411924L/xx unknown
- 1974-09-23 FR FR7432066A patent/FR2245063B1/fr not_active Expired
- 1974-09-23 CH CH1282774A patent/CH586994A5/xx not_active IP Right Cessation
- 1974-09-23 NO NO743408A patent/NO743408L/no unknown
- 1974-09-23 ES ES430301A patent/ES430301A1/en not_active Expired
- 1974-09-24 BE BE148847A patent/BE820287A/en unknown
- 1974-09-24 AR AR255732A patent/AR216889A1/en active
- 1974-09-24 NL NL7412599.A patent/NL162504C/en not_active IP Right Cessation
- 1974-09-24 GB GB41564/74A patent/GB1486308A/en not_active Expired
-
1976
- 1976-06-30 ES ES449378A patent/ES449378A1/en not_active Expired
- 1976-06-30 ES ES449379A patent/ES449379A1/en not_active Expired
-
1978
- 1978-01-02 SE SE7800027A patent/SE7800027L/en unknown
- 1978-01-02 SE SE7800028A patent/SE7800028L/en unknown
- 1978-01-02 SE SE7800026A patent/SE7800026L/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4482933A (en) * | 1981-07-30 | 1984-11-13 | Itt Industries, Inc. | Multilayer doped ceramic capacitor |
| EP1085352A2 (en) * | 1999-09-16 | 2001-03-21 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
| EP1085352A3 (en) * | 1999-09-16 | 2003-01-08 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
| EP1632797A1 (en) * | 1999-09-16 | 2006-03-08 | Kabushi Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
Also Published As
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 19940923 |