NO316665B1 - Fremgangsmate for rengjoring og resirkulering av opplosningsmiddel i et lukket resirkuleringssystem samt rengjoringsutstyr hvor det anvendes en komprimert flytende gass med hoy tetthet - Google Patents

Fremgangsmate for rengjoring og resirkulering av opplosningsmiddel i et lukket resirkuleringssystem samt rengjoringsutstyr hvor det anvendes en komprimert flytende gass med hoy tetthet Download PDF

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Publication number
NO316665B1
NO316665B1 NO19981308A NO981308A NO316665B1 NO 316665 B1 NO316665 B1 NO 316665B1 NO 19981308 A NO19981308 A NO 19981308A NO 981308 A NO981308 A NO 981308A NO 316665 B1 NO316665 B1 NO 316665B1
Authority
NO
Norway
Prior art keywords
cleaning
vessel
pressure
compressed
liquefied gas
Prior art date
Application number
NO19981308A
Other languages
English (en)
Norwegian (no)
Other versions
NO981308D0 (no
NO981308L (no
Inventor
Kunio Arai
Hiroshi Inomata
Richard Lee Smith
Original Assignee
Shuzurifuresher Kaihatsu Kyodo
Kunio Arai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP08252962A external-priority patent/JP3074290B2/ja
Priority to JP08252962A priority Critical patent/JP3074290B2/ja
Priority to JP8322719A priority patent/JP3066400B2/ja
Priority claimed from JP8322719A external-priority patent/JP3066400B2/ja
Priority to US09/043,413 priority patent/US6092538A/en
Priority to PCT/JP1997/003409 priority patent/WO1998013149A1/fr
Priority to EP97941235A priority patent/EP0893166A4/fr
Priority to CA002232768A priority patent/CA2232768C/fr
Publication of NO981308D0 publication Critical patent/NO981308D0/no
Priority to NO19981308A priority patent/NO316665B1/no
Application filed by Shuzurifuresher Kaihatsu Kyodo, Kunio Arai filed Critical Shuzurifuresher Kaihatsu Kyodo
Priority to CN98108789A priority patent/CN1107554C/zh
Publication of NO981308L publication Critical patent/NO981308L/no
Publication of NO316665B1 publication Critical patent/NO316665B1/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • B08B3/104—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid using propellers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
NO19981308A 1996-09-25 1998-03-23 Fremgangsmate for rengjoring og resirkulering av opplosningsmiddel i et lukket resirkuleringssystem samt rengjoringsutstyr hvor det anvendes en komprimert flytende gass med hoy tetthet NO316665B1 (no)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP08252962A JP3074290B2 (ja) 1996-09-25 1996-09-25 高密度液化ガスを使用の洗浄装置
JP8322719A JP3066400B2 (ja) 1996-12-03 1996-12-03 超臨界流体洗浄装置における洗浄機構
US09/043,413 US6092538A (en) 1996-09-25 1997-09-25 Method for using high density compressed liquefied gases in cleaning applications
PCT/JP1997/003409 WO1998013149A1 (fr) 1996-09-25 1997-09-25 Systeme de lavage utilisant un gaz liquefie de haute densite
EP97941235A EP0893166A4 (fr) 1996-09-25 1997-09-25 Systeme de lavage utilisant un gaz liquefie de haute densite
CA002232768A CA2232768C (fr) 1996-09-25 1998-03-20 Methode d'utilisation de gaz a haute densite liquifies et comprimes dans des applications reliees au nettoyage
NO19981308A NO316665B1 (no) 1996-09-25 1998-03-23 Fremgangsmate for rengjoring og resirkulering av opplosningsmiddel i et lukket resirkuleringssystem samt rengjoringsutstyr hvor det anvendes en komprimert flytende gass med hoy tetthet
CN98108789A CN1107554C (zh) 1996-09-25 1998-03-27 利用高密度压缩液化气的清洗机构、清洗设备及清洗方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP08252962A JP3074290B2 (ja) 1996-09-25 1996-09-25 高密度液化ガスを使用の洗浄装置
JP8322719A JP3066400B2 (ja) 1996-12-03 1996-12-03 超臨界流体洗浄装置における洗浄機構
CA002232768A CA2232768C (fr) 1996-09-25 1998-03-20 Methode d'utilisation de gaz a haute densite liquifies et comprimes dans des applications reliees au nettoyage
NO19981308A NO316665B1 (no) 1996-09-25 1998-03-23 Fremgangsmate for rengjoring og resirkulering av opplosningsmiddel i et lukket resirkuleringssystem samt rengjoringsutstyr hvor det anvendes en komprimert flytende gass med hoy tetthet
CN98108789A CN1107554C (zh) 1996-09-25 1998-03-27 利用高密度压缩液化气的清洗机构、清洗设备及清洗方法

Publications (3)

Publication Number Publication Date
NO981308D0 NO981308D0 (no) 1998-03-23
NO981308L NO981308L (no) 1999-09-24
NO316665B1 true NO316665B1 (no) 2004-03-29

Family

ID=31982608

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19981308A NO316665B1 (no) 1996-09-25 1998-03-23 Fremgangsmate for rengjoring og resirkulering av opplosningsmiddel i et lukket resirkuleringssystem samt rengjoringsutstyr hvor det anvendes en komprimert flytende gass med hoy tetthet

Country Status (6)

Country Link
US (1) US6092538A (fr)
EP (1) EP0893166A4 (fr)
CN (1) CN1107554C (fr)
CA (1) CA2232768C (fr)
NO (1) NO316665B1 (fr)
WO (1) WO1998013149A1 (fr)

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CN103801526A (zh) * 2012-11-07 2014-05-21 爱阔特(上海)清洗设备制造有限公司 蒸汽清洗设备及其清洗方法
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Also Published As

Publication number Publication date
CN1107554C (zh) 2003-05-07
CA2232768C (fr) 2004-09-28
CA2232768A1 (fr) 1999-09-20
NO981308D0 (no) 1998-03-23
EP0893166A1 (fr) 1999-01-27
EP0893166A4 (fr) 2004-11-10
US6092538A (en) 2000-07-25
CN1230471A (zh) 1999-10-06
WO1998013149A1 (fr) 1998-04-02
NO981308L (no) 1999-09-24

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