NO313260B1 - Pakning, spesielt en elastisk EMI-skjermet pakning - Google Patents
Pakning, spesielt en elastisk EMI-skjermet pakning Download PDFInfo
- Publication number
- NO313260B1 NO313260B1 NO19942954A NO942954A NO313260B1 NO 313260 B1 NO313260 B1 NO 313260B1 NO 19942954 A NO19942954 A NO 19942954A NO 942954 A NO942954 A NO 942954A NO 313260 B1 NO313260 B1 NO 313260B1
- Authority
- NO
- Norway
- Prior art keywords
- gasket
- substrate
- electrically conductive
- coated
- conductive
- Prior art date
Links
- 239000000463 material Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 52
- 229920001971 elastomer Polymers 0.000 claims description 31
- 239000000806 elastomer Substances 0.000 claims description 29
- 239000011231 conductive filler Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 238000011065 in-situ storage Methods 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 229920001296 polysiloxane Polymers 0.000 claims description 17
- 239000010970 precious metal Substances 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229920002379 silicone rubber Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004005 microsphere Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229920002943 EPDM rubber Polymers 0.000 claims description 2
- 229920006311 Urethane elastomer Polymers 0.000 claims description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000007771 core particle Substances 0.000 claims description 2
- 229920005560 fluorosilicone rubber Polymers 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 229920001944 Plastisol Polymers 0.000 claims 1
- 229920005549 butyl rubber Polymers 0.000 claims 1
- 239000002650 laminated plastic Substances 0.000 claims 1
- 230000013011 mating Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000004999 plastisol Substances 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000012856 packing Methods 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000499 gel Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002633 Kraton (polymer) Polymers 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000013536 elastomeric material Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000386 donor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920002631 room-temperature vulcanizate silicone Polymers 0.000 description 1
- 229920003031 santoprene Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/14—Sealings between relatively-stationary surfaces by means of granular or plastic material, or fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Packages (AREA)
- Closures For Containers (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11940393A | 1993-09-10 | 1993-09-10 |
Publications (3)
Publication Number | Publication Date |
---|---|
NO942954D0 NO942954D0 (no) | 1994-08-09 |
NO942954L NO942954L (no) | 1995-03-13 |
NO313260B1 true NO313260B1 (no) | 2002-09-02 |
Family
ID=22384234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO19942954A NO313260B1 (no) | 1993-09-10 | 1994-08-09 | Pakning, spesielt en elastisk EMI-skjermet pakning |
Country Status (9)
Country | Link |
---|---|
US (4) | US6096413A (fi) |
EP (2) | EP0643551B1 (fi) |
JP (1) | JPH0796962A (fi) |
CA (1) | CA2129073C (fi) |
DE (1) | DE69423833T2 (fi) |
ES (1) | ES2145103T3 (fi) |
FI (1) | FI944154A (fi) |
NO (1) | NO313260B1 (fi) |
WO (1) | WO1995007603A1 (fi) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4319965C3 (de) | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
CA2129073C (en) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
US6303180B1 (en) | 1993-09-10 | 2001-10-16 | Parker-Hannifin Corporation | Form-in-place EMI gaskets |
DE4340108C3 (de) * | 1993-11-22 | 2003-08-14 | Emi Tec Elektronische Material | Abschirmelement und Verfahren zu dessen Herstellung |
US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
US6635354B2 (en) | 1995-01-20 | 2003-10-21 | Parker-Hannifin Corporation | Form-in place EMI gaskets |
US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
ATE411732T1 (de) * | 1996-08-01 | 2008-10-15 | Helmut Kahl | Verfahren zum herstellen einer elektromagnetisch abschirmenden dichtung |
TW486238U (en) | 1996-08-18 | 2002-05-01 | Helmut Kahl | Shielding cap |
US6051779A (en) * | 1996-11-21 | 2000-04-18 | Ericsson Inc. | Shield can with integrally molded gasket |
TW355163B (en) * | 1997-01-23 | 1999-04-01 | Shiyouritsu Plast Kogyo Kk | Sheet-like laminate and preparation thereof |
US6312550B1 (en) | 1997-03-05 | 2001-11-06 | Bernd Tiburtius | Method for producing a shielding case |
EP1055356B1 (de) * | 1998-02-09 | 2002-01-16 | Helmut Kahl | Gehäuse |
DE19833063A1 (de) * | 1998-07-22 | 2000-02-03 | Reinz Dichtungs Gmbh | Lösemittelfreier applizierbarer wärmehärtender Beschichtungsstoff |
FR2783588B1 (fr) * | 1998-09-18 | 2000-11-24 | Axo Scintex Cie Equip Automobi | Procede de realisation de joints le long d'une arete |
US20070137653A1 (en) * | 2000-03-13 | 2007-06-21 | Wood Thomas J | Ventilation interface for sleep apnea therapy |
NL1011718C2 (nl) * | 1999-04-01 | 2000-10-03 | Beele Eng Bv | Elektrisch geleidende pasta. |
US6223603B1 (en) * | 1999-05-18 | 2001-05-01 | Texas Instruments Incorporated | Capacitive pressure transducer having reduced output error |
KR200182519Y1 (ko) * | 1999-12-24 | 2000-05-15 | 익스팬전자주식회사 | 클립형 도전성 개스킷 |
US6483023B1 (en) * | 2000-01-04 | 2002-11-19 | Fujitsu Network Communications, Inc. | Fabric wrapped over spring EMI gasket |
AU2001229736A1 (en) * | 2000-01-24 | 2001-07-31 | Amesbury Group, Inc. | Methods for producing emi shielding gasket |
US6475933B1 (en) * | 2000-01-27 | 2002-11-05 | Northrop Grumman Corporation | Highly conductive elastomeric sheet |
KR100743531B1 (ko) | 2000-02-18 | 2007-07-27 | 파커-한니핀 코포레이션 | 낮은 밀폐력의 가스켓을 현장 성형하는 방법 |
EP1266549A2 (en) * | 2000-02-28 | 2002-12-18 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
CA2401168A1 (en) | 2000-02-28 | 2001-09-07 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
SE517978C2 (sv) * | 2000-03-03 | 2002-08-13 | Ericsson Telefon Ab L M | Elektriskt ledande beläggningsarrangemang |
US6787221B2 (en) | 2000-03-24 | 2004-09-07 | Chemque Incorporated | Co-dispensed compositions for gaskets and other objects |
US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
US6625025B1 (en) * | 2000-07-10 | 2003-09-23 | Nortel Networks Limited | Component cooling in electronic devices |
US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
US6348654B1 (en) | 2000-10-12 | 2002-02-19 | Parker-Hannifin Corporation | Compound waveform gasket for low closure force EMI shielding applications |
US6670017B2 (en) | 2000-12-14 | 2003-12-30 | 3M Innovative Properties Company | Photocurable form-in-place gasket for electronic applications |
US6346330B1 (en) | 2000-12-14 | 2002-02-12 | 3M Innovative Properties Company | Form-in-place gasket for electronic applications |
US20060119046A1 (en) * | 2000-12-23 | 2006-06-08 | Helmut Kahl | Method for producing a shielding gasket |
DE10064968B4 (de) * | 2000-12-23 | 2006-01-19 | Helmut Kahl | Verfahren zur Herstellung einer Abschirmdichtung |
JP2002198678A (ja) * | 2000-12-26 | 2002-07-12 | Inoac Corp | 電磁波シールド用筐体およびその製造方法 |
US6850387B2 (en) * | 2001-01-17 | 2005-02-01 | Seagate Technology Llc | Form-in-place gasket height variability control for a disc drive |
US6595525B2 (en) | 2001-01-25 | 2003-07-22 | Glen D. Schmidt | Attachable sealant bead and strip for use with a vehicle part |
CN1273994C (zh) | 2001-04-06 | 2006-09-06 | 世界财产股份有限公司 | 导电性有机硅及其制造方法 |
BR0208927A (pt) | 2001-05-10 | 2004-04-27 | Parker Hannifin Corp | Fabricação de invólucro de componentes eletrônicos que possuem uma camada de blindagem metalizada |
WO2002093997A1 (en) | 2001-05-11 | 2002-11-21 | Parker Hannifin Corporation | Notched gasket for low closure force emi shielding applications |
US6836409B1 (en) * | 2001-07-10 | 2004-12-28 | Nortel Networks Limited | Component cooling in electronic devices |
US6809254B2 (en) | 2001-07-20 | 2004-10-26 | Parker-Hannifin Corporation | Electronics enclosure having an interior EMI shielding and cosmetic coating |
US20030091777A1 (en) * | 2001-08-14 | 2003-05-15 | Peter Jones | Clean release tape for EMI shielding |
WO2003030610A1 (en) | 2001-10-02 | 2003-04-10 | Parker Hannifin Corporation | Emi shielding gasket construction |
CN1444439A (zh) * | 2002-03-11 | 2003-09-24 | 赫尔穆特·卡尔 | 带有导电涂覆的屏蔽密封层或屏蔽壁的设备罩 |
US20040057198A1 (en) * | 2002-03-11 | 2004-03-25 | Helmut Kahl | Device housing comprising an electromagnetically shielded region |
US6723916B2 (en) | 2002-03-15 | 2004-04-20 | Parker-Hannifin Corporation | Combination EMI shielding and environmental seal gasket construction |
US7208192B2 (en) | 2002-05-31 | 2007-04-24 | Parker-Hannifin Corporation | Thermally or electrically-conductive form-in-place gap filter |
US6663431B1 (en) * | 2002-08-30 | 2003-12-16 | International Business Machines Corporation | Shielding in a power connector |
US8119191B2 (en) | 2003-01-16 | 2012-02-21 | Parker-Hannifin Corporation | Dispensable cured resin |
WO2005020228A1 (en) * | 2003-08-14 | 2005-03-03 | Seagate Technology Llc | Base deck with formed-in-place gaskets and impact dissipation members for a data storage device |
US7372662B2 (en) * | 2003-08-14 | 2008-05-13 | Seagate Technology Llc | Base deck with formed-in-place gaskets and impact dissipation members for a data storage device |
US7294919B2 (en) * | 2003-11-26 | 2007-11-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Device having a complaint element pressed between substrates |
JP2005187793A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | 改良された接着剤 |
US20050236171A1 (en) * | 2004-04-23 | 2005-10-27 | Garcia Jorge L | Shield frame for a radio frequency shielding assembly |
US20060012070A1 (en) * | 2004-07-13 | 2006-01-19 | Nordson Corporation | Gasket assembly |
US7087835B2 (en) * | 2004-10-19 | 2006-08-08 | Bi-Link Metal Specialties Inc. | Apparatus and method for shielding printed circuit boards |
TWI381399B (zh) * | 2005-07-12 | 2013-01-01 | Sulzer Metco Canada Inc | 性能增進之導電性填料及由該填料製成的聚合物 |
US7968012B2 (en) | 2005-11-23 | 2011-06-28 | Laird Technologies, Inc. | Method and apparatus for EMI shielding |
US7518880B1 (en) | 2006-02-08 | 2009-04-14 | Bi-Link | Shielding arrangement for electronic device |
EP1999529B1 (en) * | 2006-03-28 | 2014-07-16 | Parker-Hannifin Corporation | Dispensable cured resin |
JP4397390B2 (ja) * | 2006-10-20 | 2010-01-13 | 行雄 土屋 | パッキン付き製造蓋の製造方法及び製造装置 |
DE112008000327T5 (de) * | 2007-02-06 | 2009-12-31 | World Properties, Inc., Lincolnwood | Leitfähige Polymerschäume, Herstellungsverfahren und Anwendungen derselben |
US20080280040A1 (en) * | 2007-03-28 | 2008-11-13 | Jeffery Barrall | Gasket Formed From Various Materials And Methods Of Making Same |
US8216418B2 (en) * | 2007-06-13 | 2012-07-10 | Lam Research Corporation | Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings |
KR101399920B1 (ko) | 2007-09-13 | 2014-05-28 | 헨켈 아게 운트 코. 카게아아 | 전기 전도성 조성물 |
JP2010541286A (ja) * | 2007-10-02 | 2010-12-24 | パーカー.ハニフィン.コーポレイション | Emiガスケット用ナノコーティング |
US8152954B2 (en) * | 2007-10-12 | 2012-04-10 | Lam Research Corporation | Showerhead electrode assemblies and plasma processing chambers incorporating the same |
US8187414B2 (en) * | 2007-10-12 | 2012-05-29 | Lam Research Corporation | Anchoring inserts, electrode assemblies, and plasma processing chambers |
US8187413B2 (en) * | 2008-03-18 | 2012-05-29 | Lam Research Corporation | Electrode assembly and plasma processing chamber utilizing thermally conductive gasket |
US8679288B2 (en) * | 2008-06-09 | 2014-03-25 | Lam Research Corporation | Showerhead electrode assemblies for plasma processing apparatuses |
DE102008028259A1 (de) * | 2008-06-13 | 2009-12-17 | Bmdsys Gmbh | Verfahren zur Verbindung hochpermeabler Teile einer magnetischen Abschirmung |
US8449679B2 (en) | 2008-08-15 | 2013-05-28 | Lam Research Corporation | Temperature controlled hot edge ring assembly |
US20100257732A1 (en) * | 2009-04-14 | 2010-10-14 | Ziberna Frank J | Shielding Arrangement for Electronic Device |
CN102803406B (zh) * | 2009-06-12 | 2015-10-14 | 洛德公司 | 防止基底被雷击的方法 |
CA2770719C (en) | 2009-08-12 | 2017-12-12 | Jonathan Bergin | Fully-cured thermally or electrically-conductive form-in-place gap filler |
WO2011041379A1 (en) * | 2009-09-29 | 2011-04-07 | Hyperion Catalysis International, Inc. | Gasket containing carbon nanotubes |
SG179014A1 (en) * | 2009-10-02 | 2012-04-27 | Saint Gobain Performance Plast | Modular polymeric emi/rfi seal |
JP5532948B2 (ja) * | 2010-01-19 | 2014-06-25 | 株式会社島津製作所 | X線検出器 |
CN103535123B (zh) * | 2011-05-23 | 2017-05-24 | 3M创新有限公司 | 电磁屏蔽衬垫及其制备方法 |
DE102011054759A1 (de) * | 2011-10-24 | 2013-04-25 | Boris Lutterbach | Radiofrequenz-Abschirmungsanordnung für eine elektrodenlose Plasma-Beleuchtungsvorrichtung sowie elektrodenlose Plasma-Beleuchtungsvorrichtung und Herstellungsverfahren dafür |
WO2013087112A1 (de) | 2011-12-15 | 2013-06-20 | Siemens Aktiengesellschaft | Verfahren zur herstellung eines glimmschutzes, schnellhärtendes glimmschutzsystem und elektrische maschine |
DE102012202225B4 (de) * | 2012-02-14 | 2015-10-22 | Te Connectivity Germany Gmbh | Steckergehäuse mit Dichtung |
EP2645540A1 (de) * | 2012-03-28 | 2013-10-02 | Siemens Aktiengesellschaft | Glimmschutzwerkstoff für eine elektrische Maschine |
FR2993894B1 (fr) * | 2012-07-25 | 2014-08-01 | Hutchinson | Composition de caoutchouc a base d'un elastomere silicone et d'un mcp, son procede de preparation, element souple et systeme de controle/regulation thermique l'incorporant. |
KR101266390B1 (ko) * | 2012-10-05 | 2013-05-22 | 주식회사 엘엠에스 | 열전도 조성물 및 시트 |
KR101266391B1 (ko) * | 2012-10-17 | 2013-05-22 | 주식회사 엘엠에스 | 피복 입자, 이를 포함하는 조성물 및 열전달 시트 |
US9662258B2 (en) * | 2013-05-21 | 2017-05-30 | N.M. Beale Company, Inc. | Patient colonoscopy abdominal compression device and method |
CN104324866B (zh) * | 2013-07-22 | 2016-05-11 | 泰科电子(上海)有限公司 | 在工件的凹槽中注入密封胶的方法 |
JP2017521163A (ja) * | 2014-07-11 | 2017-08-03 | カーディアック ペースメイカーズ, インコーポレイテッド | 長期植込み型デバイス用高分子フィードスル |
WO2016182643A1 (en) * | 2015-05-08 | 2016-11-17 | Laird Technologies, Inc. | Soft and/or flexible board level shields and related methods |
CN105400204A (zh) * | 2015-12-24 | 2016-03-16 | 平湖阿莱德实业有限公司 | 一种电磁屏蔽体及其制备方法 |
US10965333B2 (en) | 2016-07-26 | 2021-03-30 | Laird Technologies, Inc. | Thermal management assemblies suitable for use with transceivers and other devices |
US10389397B2 (en) | 2016-07-26 | 2019-08-20 | Laird Technologies, Inc. | Small form-factor pluggable (SFP) transceivers |
WO2020060532A1 (en) * | 2018-09-17 | 2020-03-26 | Halliburton Energy Services, Inc. | Two part bonded seal for static downhole tool applications |
US11437328B2 (en) | 2019-05-16 | 2022-09-06 | Qualcomm Incorporated | Device thermal management |
US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
US11276436B1 (en) | 2021-01-05 | 2022-03-15 | Seagate Technology Llc | Corrosive gas reduction for electronic devices |
WO2022187569A1 (en) | 2021-03-04 | 2022-09-09 | Momentive Performance Materials Inc. | Thermal gel composition |
DE102022207527A1 (de) | 2022-07-22 | 2024-01-25 | Volkswagen Aktiengesellschaft | Dichtungsanordnung in einem Elektronikgehäuse |
US12060930B1 (en) | 2023-04-26 | 2024-08-13 | Deere & Company | Sealing system for multiple fluids |
Family Cites Families (90)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3126440A (en) * | 1964-03-24 | Shielding and sealing gasket material | ||
US2796457A (en) * | 1952-06-23 | 1957-06-18 | Walter E Stinger | R-f gasket for radio interference attenuation |
DE1047439B (de) | 1953-12-21 | 1958-12-24 | Dow Corning | Verfahren zur Herstellung neuer fluorhaltiger Organopolysiloxane |
US3032528A (en) * | 1959-02-20 | 1962-05-01 | Wacker Chemie Gmbh | Silicone elastomers |
US3140342A (en) * | 1963-07-05 | 1964-07-07 | Chomerics Inc | Electrical shielding and sealing gasket |
US3752899A (en) * | 1970-05-25 | 1973-08-14 | Metex Corp | Shielding and gasketing material |
FR2188910A5 (fi) * | 1972-06-09 | 1974-01-18 | Ducros Emile | |
US3880627A (en) * | 1973-07-02 | 1975-04-29 | Donaldson Co Inc | Filter with integral housing |
US4011360A (en) * | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
US4037009A (en) * | 1976-08-11 | 1977-07-19 | Metex Corporation | Conductive elastomeric elements |
GB1600710A (en) * | 1977-06-30 | 1981-10-21 | Chomerics Inc | Corrosion resistant electromagnetic energy shielding gasket |
US4227037A (en) * | 1979-05-29 | 1980-10-07 | Gulf & Western Manufacturing Company | Shielded non-metallic container |
US4295573A (en) * | 1979-12-21 | 1981-10-20 | Nordson Corporation | Method of obtaining a seal upon the interior surface of a container closure and resulting product |
FR2480488A1 (fr) * | 1980-04-15 | 1981-10-16 | Eaton Manford | Liant thermiquement conducteur et isolant electriquement pour composants electriques et electroniques, et son procede de fabrication |
US4769280A (en) * | 1980-12-22 | 1988-09-06 | Chomerics, Inc. | Electromagnetic shielding |
US4434541A (en) * | 1980-12-22 | 1984-03-06 | Chomerics, Inc. | Electromagnetic shielding |
US4507359A (en) * | 1980-12-22 | 1985-03-26 | Chomerics, Inc. | Electromagnetic shielding |
GB2115084A (en) * | 1981-12-23 | 1983-09-01 | Plessey Co Plc | A method of sealing a joint |
US4596669A (en) * | 1981-12-24 | 1986-06-24 | Mitech Corporation | Flame retardant thermoplastic molding compositions of high electroconductivity |
NL193609C (nl) * | 1981-12-30 | 2000-04-04 | Bekaert Sa Nv | Samengestelde streng voor verwerking als granulaat in kunststofproducten en werkwijze voor het vervaardigen van een kunststofmenggranulaat. |
US4882089A (en) * | 1982-03-16 | 1989-11-21 | American Cyanamid Company | Compositions convertible to reinforced conductive components and articles incorporating same |
US4662967A (en) * | 1983-01-05 | 1987-05-05 | Bogan John J | Method of making a gasket for an electronics enclosure to help keep out electrical interference |
US4643924A (en) * | 1985-03-25 | 1987-02-17 | Raychem Corporation | Protective article comprising an elastic gel |
US4690831A (en) * | 1983-06-23 | 1987-09-01 | Raychem Corp. | Protective article |
US4865905A (en) * | 1983-06-23 | 1989-09-12 | Raychem Corporation | Article for protection of a substrate |
US4779762A (en) * | 1984-05-30 | 1988-10-25 | Nordson Corporation | Method and apparatus for controlling the gas content of dispensed hot melt thermoplastic adhesive foam |
IT1182305B (it) * | 1984-10-01 | 1987-10-05 | Tako Spa | Procedimento di fabbricazione di guarnizioni di tenuta e prodotto ottenuto col procedimento |
IT1180102B (it) * | 1984-10-22 | 1987-09-23 | Tako Spa | Procedimento per la fabbricazione di guarnizioni di tenuta rinforzate e prodotto ottenuto col procedimento |
EP0200296A3 (en) * | 1985-02-22 | 1987-01-14 | LOCTITE (IRELAND) Ltd. | Method and apparatus for applying a two-part curing composition to a substrate surface |
DE3507720C2 (de) * | 1985-03-05 | 1997-08-14 | Rieter Automotive Int Ag | Verfahren und Vorrichtung zum Herstellen eines Rohlings aus glasfaserverstärktem Kunststoff |
US4678863A (en) * | 1985-06-27 | 1987-07-07 | Rca Corporation | Corrosion resistant conductive elastomers |
US4915985A (en) * | 1985-08-05 | 1990-04-10 | Allied-Signal Inc. | Process for forming articles of filled intrinsically conductive polymers |
US4678716A (en) * | 1985-08-06 | 1987-07-07 | Chomerics, Inc. | Electromagnetic shielding |
US4734140A (en) * | 1985-08-06 | 1988-03-29 | Chomerics, Inc. | Heat treatment of electromagnetic shielding composition |
JPH0718080Y2 (ja) | 1985-12-11 | 1995-04-26 | 信越化学工業株式会社 | 固定ディスク装置用カバ− |
GB8607976D0 (en) * | 1986-04-01 | 1986-05-08 | Dowty Seals Ltd | Seal/gasket |
US4900877A (en) * | 1987-01-13 | 1990-02-13 | Raychem Corporation | Shielding and sealing gaskets |
US5047260A (en) * | 1987-02-06 | 1991-09-10 | Key-Tech, Inc. | Method for producing a shielded plastic enclosure to house electronic equipment |
JPH073086Y2 (ja) | 1987-03-05 | 1995-01-30 | 日産自動車株式会社 | シ−ル構造 |
US4861643A (en) * | 1987-03-13 | 1989-08-29 | The Boeing Company | Aerospace structure having a cast-in-place noncompressible void filler |
US4960612A (en) * | 1987-07-02 | 1990-10-02 | At&T Bell Laboratories | Thermal conductor assembly method |
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
US4857666A (en) | 1987-09-11 | 1989-08-15 | Uop | Alkylation/transalkylation process |
US5250607A (en) * | 1988-01-05 | 1993-10-05 | Norton Company | Moisture cured elastomeric interpenetrating network sealants |
CA1336461C (en) * | 1988-01-05 | 1995-07-25 | Ahmet Comert | Moisture curable hot melt elastomers |
DE3810598A1 (de) * | 1988-03-29 | 1989-10-12 | Bayer Ag | Metallfasern enthaltende verbundstoffe sowie deren verwendung zur herstellung von formteilen zur abschirmung von elektromagnetischer strahlung |
US4857668A (en) * | 1988-04-15 | 1989-08-15 | Schlegel Corporation | Multi-function gasket |
US4931326A (en) * | 1988-04-25 | 1990-06-05 | Davlyn Manufacturing Co., Inc. | Reinforced flexible plastic tubing and methods of manufacture |
US5049332A (en) * | 1988-06-08 | 1991-09-17 | Akzo Nv | Method of making conductive metal-filled substrates without developing agents |
US4948922A (en) * | 1988-09-15 | 1990-08-14 | The Pennsylvania State University | Electromagnetic shielding and absorptive materials |
JPH0817278B2 (ja) * | 1988-10-26 | 1996-02-21 | 北川工業株式会社 | 電磁波シールド用ガスケット |
JPH0787275B2 (ja) * | 1988-10-28 | 1995-09-20 | 北川工業株式会社 | 導電性シール材 |
JPH02124990A (ja) * | 1988-11-02 | 1990-05-14 | Kitagawa Kogyo Kk | 炭素繊維配合シール材組成物 |
US4931479B1 (en) | 1988-11-07 | 2000-10-10 | Parker Intangibles Inc | Foam in place conductive polyurethane foam |
US5107070A (en) * | 1988-11-10 | 1992-04-21 | Vanguard Products Corporation | Dual elastomer gasket for protection against magnetic interference |
US5068493A (en) * | 1988-11-10 | 1991-11-26 | Vanguard Products Corporation | Dual elastomer gasket shield for electronic equipment |
US4964362A (en) * | 1988-12-13 | 1990-10-23 | Gilbert Dominguez | Applicator for motor vehicle glass adhesives and sealants |
US5045625A (en) | 1989-02-21 | 1991-09-03 | Hoechst Celanese Corp. | Thermosetting polyimide prepolymers |
US5045635A (en) * | 1989-06-16 | 1991-09-03 | Schlegel Corporation | Conductive gasket with flame and abrasion resistant conductive coating |
JPH0337482A (ja) | 1989-07-03 | 1991-02-18 | Shin Etsu Chem Co Ltd | ハードディスク装置用カバー・パッキン組立体の製造方法 |
IE892231A1 (en) * | 1989-07-11 | 1991-06-19 | Loctite Ireland Ltd | Method of forming gaskets by injection and compositions for¹use therein |
US4977295A (en) * | 1989-07-28 | 1990-12-11 | Raytheon Company | Gasket impervious to electromagnetic energy |
US5164136A (en) * | 1989-09-08 | 1992-11-17 | Norton Company | Method for forming flexible gaskets |
US5061566A (en) * | 1989-12-28 | 1991-10-29 | Chomerics, Inc. | Corrosion inhibiting emi/rfi shielding coating and method of its use |
JPH0767784B2 (ja) * | 1990-10-11 | 1995-07-26 | 信越化学工業株式会社 | シリコーンゴム積層体及びその製造方法 |
US5115104A (en) * | 1991-03-29 | 1992-05-19 | Chomerics, Inc. | EMI/RFI shielding gasket |
JP2612979B2 (ja) | 1991-07-25 | 1997-05-21 | 信越化学工業株式会社 | ハードディスク装置用カバー・パッキング組立体 |
US5340847A (en) | 1991-10-23 | 1994-08-23 | Three Bond Co., Ltd. | Curable silicon composition |
JPH05125284A (ja) | 1991-10-23 | 1993-05-21 | Three Bond Co Ltd | 硬化性シリコーン組成物 |
CA2080177C (en) * | 1992-01-02 | 1997-02-25 | Edward Allan Highum | Electro-magnetic shield and method for making the same |
US5202536A (en) * | 1992-02-03 | 1993-04-13 | Schlegel Corporation | EMI shielding seal with partial conductive sheath |
US5364574A (en) * | 1992-04-02 | 1994-11-15 | The United States Of America As Represented By The Secretary Of The Navy | Method of forming a corrosion-resistant EMI shielding gasket between graphite and metal components |
JP2538822B2 (ja) | 1992-04-10 | 1996-10-02 | 信越化学工業株式会社 | ハ―ドディスク装置用カバ―パッキン組立体及びその製造方法 |
US5366664A (en) | 1992-05-04 | 1994-11-22 | The Penn State Research Foundation | Electromagnetic shielding materials |
DE4219915A1 (de) * | 1992-06-17 | 1993-12-23 | Linde Ag | Herstellung von Spritzgußteilen aus thermoplastischen Kunststoffen |
IT1255364B (it) * | 1992-09-15 | 1995-10-31 | Himont Inc | Processo per la preparazione di manufatti in polipropilene espanso mediante produzione di granuli pre-espansi e termoformatura per sinterizzazione degli stessi |
JP2713059B2 (ja) * | 1992-10-07 | 1998-02-16 | 三菱電機株式会社 | 電子部品または電子機器を収納する箱または蓋からなる筺体の製造方法。 |
DE4237217A1 (de) * | 1992-11-04 | 1994-05-05 | Spiess Kunststoff Recycling | Verfahren und Anlage zum Befüllen einer oder mehrerer geschlossener Gießformen durch dosierte Intrusion plastifizierten Kunststoffes |
JP2713093B2 (ja) * | 1993-04-13 | 1998-02-16 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
AU672499B2 (en) * | 1993-06-14 | 1996-10-03 | Emi-Tec Elektronische Materialien Gmbh | A process for producing a casing providing a screen against electromagnetic radiation |
US6303180B1 (en) * | 1993-09-10 | 2001-10-16 | Parker-Hannifin Corporation | Form-in-place EMI gaskets |
CA2129073C (en) * | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
US6261508B1 (en) * | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Method for making a shielding composition |
US5641438A (en) * | 1995-01-24 | 1997-06-24 | Bunyan; Michael H. | Method for forming an EMI shielding gasket |
US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
JPH0912892A (ja) | 1995-07-04 | 1997-01-14 | Toray Dow Corning Silicone Co Ltd | 現場成形ガスケット用シリコーンゴム組成物 |
US5658509A (en) * | 1995-11-06 | 1997-08-19 | Ford Motor Company | Method for forming a recyclable seal on an automotive climate control system door |
TW486238U (en) * | 1996-08-18 | 2002-05-01 | Helmut Kahl | Shielding cap |
US6173970B1 (en) * | 1998-10-02 | 2001-01-16 | Instrument Specialties Co., Inc. | Gasket and method of making a gasket |
-
1994
- 1994-07-28 CA CA002129073A patent/CA2129073C/en not_active Expired - Lifetime
- 1994-08-09 NO NO19942954A patent/NO313260B1/no not_active IP Right Cessation
- 1994-08-25 WO PCT/US1994/009730 patent/WO1995007603A1/en unknown
- 1994-09-05 EP EP94306524A patent/EP0643551B1/en not_active Expired - Lifetime
- 1994-09-05 ES ES94306524T patent/ES2145103T3/es not_active Expired - Lifetime
- 1994-09-05 DE DE69423833T patent/DE69423833T2/de not_active Expired - Lifetime
- 1994-09-06 JP JP6236081A patent/JPH0796962A/ja active Pending
- 1994-09-06 EP EP94306552A patent/EP0643552A1/en not_active Withdrawn
- 1994-09-09 FI FI944154A patent/FI944154A/fi not_active Application Discontinuation
-
1997
- 1997-11-12 US US08/967,986 patent/US6096413A/en not_active Expired - Lifetime
-
2000
- 2000-01-05 US US09/478,017 patent/US6331349B1/en not_active Expired - Lifetime
-
2001
- 2001-10-02 US US09/970,159 patent/US20020076547A1/en not_active Abandoned
-
2006
- 2006-09-27 US US11/528,276 patent/US20070052125A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
NO942954L (no) | 1995-03-13 |
NO942954D0 (no) | 1994-08-09 |
EP0643552A1 (en) | 1995-03-15 |
CA2129073A1 (en) | 1995-03-11 |
US20020076547A1 (en) | 2002-06-20 |
WO1995007603A1 (en) | 1995-03-16 |
DE69423833D1 (de) | 2000-05-11 |
CA2129073C (en) | 2007-06-05 |
EP0643551A1 (en) | 1995-03-15 |
FI944154A0 (fi) | 1994-09-09 |
DE69423833T2 (de) | 2000-10-12 |
US6096413A (en) | 2000-08-01 |
EP0643551B1 (en) | 2000-04-05 |
JPH0796962A (ja) | 1995-04-11 |
ES2145103T3 (es) | 2000-07-01 |
FI944154A (fi) | 1995-03-11 |
US20070052125A1 (en) | 2007-03-08 |
US6331349B1 (en) | 2001-12-18 |
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