NO20073122L - Ikke-vandige, ikke-korrosive mikroelektronikk-renseformuleringer - Google Patents

Ikke-vandige, ikke-korrosive mikroelektronikk-renseformuleringer

Info

Publication number
NO20073122L
NO20073122L NO20073122A NO20073122A NO20073122L NO 20073122 L NO20073122 L NO 20073122L NO 20073122 A NO20073122 A NO 20073122A NO 20073122 A NO20073122 A NO 20073122A NO 20073122 L NO20073122 L NO 20073122L
Authority
NO
Norway
Prior art keywords
alkyl
alkoxy
integer
compound
corrosive
Prior art date
Application number
NO20073122A
Other languages
English (en)
Norwegian (no)
Inventor
Seiji Inaoka
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of NO20073122L publication Critical patent/NO20073122L/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
NO20073122A 2004-12-08 2007-06-18 Ikke-vandige, ikke-korrosive mikroelektronikk-renseformuleringer NO20073122L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63414104P 2004-12-08 2004-12-08
PCT/US2005/006247 WO2006062534A1 (en) 2004-12-08 2005-02-25 Non-aqueous, non-corrosive microelectronic cleaning compositions

Publications (1)

Publication Number Publication Date
NO20073122L true NO20073122L (no) 2007-08-28

Family

ID=34961521

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20073122A NO20073122L (no) 2004-12-08 2007-06-18 Ikke-vandige, ikke-korrosive mikroelektronikk-renseformuleringer

Country Status (13)

Country Link
US (1) US7951764B2 (ja)
EP (1) EP1836535A1 (ja)
JP (1) JP4208924B2 (ja)
KR (1) KR20060064441A (ja)
CN (1) CN1784487B (ja)
BR (1) BRPI0515810A (ja)
CA (1) CA2591483A1 (ja)
IL (1) IL183648A (ja)
MY (1) MY141293A (ja)
NO (1) NO20073122L (ja)
TW (1) TWI353381B (ja)
WO (1) WO2006062534A1 (ja)
ZA (1) ZA200704029B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
KR101403515B1 (ko) * 2006-06-22 2014-06-09 주식회사 동진쎄미켐 포토레지스트 제거용 조성물
US20080125342A1 (en) * 2006-11-07 2008-05-29 Advanced Technology Materials, Inc. Formulations for cleaning memory device structures
CN101187788A (zh) * 2006-11-17 2008-05-28 安集微电子（上海）有限公司 低蚀刻性较厚光刻胶清洗液
FR2912151B1 (fr) * 2007-02-05 2009-05-08 Arkema France Formulation de dimethylsulfoxyde en melange avec un additif permettant d'abaisser le point de cristallisation de ce dernier, et applications de ce melange
US8404022B2 (en) 2008-07-23 2013-03-26 Iwatani Corporation Method of concentrating ozone gas and apparatus therefor
JP4903242B2 (ja) * 2008-10-28 2012-03-28 アバントール パフォーマンス マテリアルズ， インコーポレイテッド 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物
KR101579846B1 (ko) * 2008-12-24 2015-12-24 주식회사 이엔에프테크놀로지 포토레지스트 패턴 제거용 조성물 및 이를 이용한 금속 패턴의 형성 방법
WO2010098899A1 (en) * 2009-02-25 2010-09-02 Mallinckrodt Baker, Inc. Multipurpose acidic, organic solvent based microelectronic cleaning composition
US9081291B2 (en) 2009-08-11 2015-07-14 Dongwoo Fine-Chem Co., Ltd. Resist stripping solution composition, and method for stripping resist by using same
SG179379A1 (en) 2010-09-21 2012-04-27 Rohm & Haas Elect Mat Improved method of stripping hot melt etch resists from semiconductors
MY172099A (en) 2011-10-05 2019-11-13 Avantor Performance Mat Llc Microelectronic substrate cleaning compositions having copper/azole polymer inhibition
CN104169801B (zh) 2012-03-16 2019-12-17 巴斯夫欧洲公司 光致抗蚀剂剥离和清洁组合物、其制备方法及其用途
ES2549579B1 (es) * 2014-04-28 2016-10-05 Universidad De Granada Composición para eliminar cementos y morteros a base de cemento
KR101586453B1 (ko) * 2014-08-20 2016-01-21 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 이용한 포토레지스트의 박리방법
TWI818893B (zh) * 2015-07-14 2023-10-21 美商富士軟片電子材料美國股份有限公司 清潔組成物及其使用方法
KR102209389B1 (ko) * 2016-09-26 2021-01-28 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 폐액의 정제 방법
TWI824299B (zh) * 2020-09-22 2023-12-01 美商恩特葛瑞斯股份有限公司 蝕刻劑組合物
CN113921383B (zh) 2021-09-14 2022-06-03 浙江奥首材料科技有限公司 一种铜表面钝化组合物、其用途及包含其的光刻胶剥离液

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091103A (en) 1990-05-01 1992-02-25 Alicia Dean Photoresist stripper
US5300628A (en) 1992-06-29 1994-04-05 Ocg Microelectronic Materials, Inc. Selected chelate resins and their use to remove multivalent metal impurities from resist components
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US5561105A (en) 1995-05-08 1996-10-01 Ocg Microelectronic Materials, Inc. Chelating reagent containing photoresist stripper composition
US5612304A (en) 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
JP3236220B2 (ja) 1995-11-13 2001-12-10 東京応化工業株式会社 レジスト用剥離液組成物
JP3929518B2 (ja) 1995-11-30 2007-06-13 東京応化工業株式会社 レジスト用剥離液組成物
US5665688A (en) * 1996-01-23 1997-09-09 Olin Microelectronics Chemicals, Inc. Photoresist stripping composition
US5962197A (en) 1998-03-27 1999-10-05 Analyze Inc. Alkaline organic photoresist stripper
MXPA00011391A (es) 1998-05-18 2005-06-20 Mallinckrodt Inc Composiciones alcalinas que contienen silicato para limpiar substratos microelectronicos.
US7135445B2 (en) * 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
US6440326B1 (en) * 1998-08-13 2002-08-27 Mitsubishi Gas Chemical Company, Inc. Photoresist removing composition
KR100286860B1 (ko) 1998-12-31 2001-07-12 주식회사 동진쎄미켐 포토레지스트 리무버 조성물
JP4224651B2 (ja) 1999-02-25 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離剤およびそれを用いた半導体素子の製造方法
KR100360985B1 (ko) 2000-04-26 2002-11-18 주식회사 동진쎄미켐 레지스트 스트리퍼 조성물
US6455479B1 (en) 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
US20040185370A1 (en) * 2001-05-21 2004-09-23 Ji-Hum Baik Resist remover composition
MY143399A (en) * 2001-07-09 2011-05-13 Avantor Performance Mat Inc Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
MY131912A (en) 2001-07-09 2007-09-28 Avantor Performance Mat Inc Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
KR20040032855A (ko) 2001-07-13 2004-04-17 이케이씨 테크놀로지, 인코포레이티드 술폭시드 피롤리드(인)온 알칸올아민 박리 및 세정 조성물
JP4252758B2 (ja) 2002-03-22 2009-04-08 関東化学株式会社 フォトレジスト残渣除去液組成物
WO2004100245A1 (en) * 2003-05-02 2004-11-18 Ekc Technology, Inc. Removal of post-etch residues in semiconductor processing
JP4202859B2 (ja) * 2003-08-05 2008-12-24 花王株式会社 レジスト用剥離剤組成物
US20050032657A1 (en) * 2003-08-06 2005-02-10 Kane Sean Michael Stripping and cleaning compositions for microelectronics
DE602005021890D1 (de) * 2004-07-15 2010-07-29 Mallinckrodt Baker Inc Nichtwässrige mikroelektronische reinigungszusammensetzungen mit fructose
US7947639B2 (en) * 2004-12-10 2011-05-24 Avantor Performance Materials, Inc. Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors

Also Published As

Publication number Publication date
US20080103078A1 (en) 2008-05-01
KR20060064441A (ko) 2006-06-13
JP4208924B2 (ja) 2009-01-14
BRPI0515810A (pt) 2008-08-05
CA2591483A1 (en) 2006-06-15
IL183648A (en) 2013-02-28
CN1784487B (zh) 2012-10-03
WO2006062534A1 (en) 2006-06-15
JP2007514983A (ja) 2007-06-07
MY141293A (en) 2010-04-16
US7951764B2 (en) 2011-05-31
CN1784487A (zh) 2006-06-07
ZA200704029B (en) 2008-05-28
TW200619380A (en) 2006-06-16
IL183648A0 (en) 2007-09-20
TWI353381B (en) 2011-12-01
EP1836535A1 (en) 2007-09-26

Similar Documents

Publication Publication Date Title
NO20073122L (no) Ikke-vandige, ikke-korrosive mikroelektronikk-renseformuleringer
JP2008509554A5 (ja)
BRPI0518420A2 (pt) composiÇÕes de limpeza de microeletrânicos nço-aquosas, nço-corrosivas, contendo inibidores de corrosço polimÉricos
TW200736857A (en) Chemical rinse composition for removing resist stripper
WO2005043250B1 (en) Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
WO2009020199A1 (ja) 鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法
JP2008537182A5 (ja)
DK1385926T3 (da) Smöreoliesammensætning der omfatter en tilsætningsstofkombination af en carboxylsyre og en amin som antirustmiddel
DK1404797T3 (da) Ammoniakfrie præparater med forbedret substrat-kompaktibiletet til rensning af mikroelektroniske substrater
BRPI0513315A (pt) composições de limpeza microeletrÈnicas não-aquosas contendo frutose
EA200870321A1 (ru) Способ получения 4-оксохинолинового соединения
TW200600971A (en) Calixresorcinarene compounds, photoresist base materials, and compositions thereof
TW200707107A (en) Positive resist composition and method for forming resist pattern
JP2013084680A (ja) 透明導電性薄膜積層体のエッチング液
JP6497668B2 (ja) フォトレジスト除去用ストリッパー組成物およびこれを用いたフォトレジストの剥離方法
TW200619368A (en) Polishing composition for silicon wafer
RU2003112460A (ru) Способ получения циклических полиаминов, содержащих в кольце n атомов азота, защищенных по принципу "все, кроме одного" (n-1), и продукты
CA2452884A1 (en) Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
EA200800884A1 (ru) Способ стереоселективного получения (-)-галофената и его интермедиатов
WO2009073589A1 (en) Fluoride-free photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction
TH74877B (th) สารผสมนอนแอคเควียสแบบไม่จำกัดกร่อนเพื่อทำการความสะอาดวัสดุไมโครอิเล็กทรอนิกส์
KR102228536B1 (ko) 포토레지스트 제거용 스트리퍼 조성물 및 이를 이용한 포토레지스트의 박리방법
FR3067716B1 (fr) Encre a base de polymere fluore et d'un compose silane
KR20160022837A (ko) 포토레지스트 제거용 스트리퍼 조성물 및 이를 이용한 포토레지스트의 박리방법
TH74877A (th) สารผสมนอนแอคเควียสแบบไม่กัดกร่อนเพื่อการทำความสะอาดวัสดุไมโครอิเล็กทรอนิกส์

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application