NO20060246L - Kontakttrykksensor og fremgangsmate for a produsere denne - Google Patents
Kontakttrykksensor og fremgangsmate for a produsere denneInfo
- Publication number
- NO20060246L NO20060246L NO20060246A NO20060246A NO20060246L NO 20060246 L NO20060246 L NO 20060246L NO 20060246 A NO20060246 A NO 20060246A NO 20060246 A NO20060246 A NO 20060246A NO 20060246 L NO20060246 L NO 20060246L
- Authority
- NO
- Norway
- Prior art keywords
- contact pressure
- pressure sensor
- producing
- carrier substrate
- contact
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
- G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Manufacture Of Switches (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/615,413 US7127949B2 (en) | 2003-07-08 | 2003-07-08 | Contact pressure sensor and method for manufacturing the same |
PCT/SG2004/000197 WO2005003708A1 (en) | 2003-07-08 | 2004-07-06 | Contact pressure sensor and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20060246L true NO20060246L (no) | 2006-01-17 |
Family
ID=33564551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20060246A NO20060246L (no) | 2003-07-08 | 2006-01-17 | Kontakttrykksensor og fremgangsmate for a produsere denne |
Country Status (12)
Country | Link |
---|---|
US (1) | US7127949B2 (zh) |
EP (1) | EP1651935B1 (zh) |
JP (1) | JP5214879B2 (zh) |
KR (1) | KR101177543B1 (zh) |
CN (1) | CN100494933C (zh) |
AU (1) | AU2004254545B2 (zh) |
CA (1) | CA2531659A1 (zh) |
MX (1) | MXPA06000265A (zh) |
NO (1) | NO20060246L (zh) |
NZ (1) | NZ545064A (zh) |
TW (1) | TWI348776B (zh) |
WO (1) | WO2005003708A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8525222B2 (en) * | 2005-03-25 | 2013-09-03 | Vishay General Semiconductor Llc | Process for forming a planar diode using one mask |
JP5742415B2 (ja) * | 2011-04-14 | 2015-07-01 | セイコーエプソン株式会社 | センサーデバイス、力検出装置およびロボット |
EP2801739A3 (en) | 2013-05-10 | 2015-04-29 | FOCE Technology International B.V. | Gasket pressure sensor |
KR20150033415A (ko) * | 2013-09-24 | 2015-04-01 | 삼성전기주식회사 | 터치센서 모듈 |
TWI556204B (zh) | 2013-09-30 | 2016-11-01 | 友達光電股份有限公司 | 可撓式顯示器 |
CN103942509A (zh) * | 2014-04-11 | 2014-07-23 | 立德高科(北京)数码科技有限责任公司 | 带有自毁性防护组件的防伪识别设备以及自毁性防护方法 |
KR101811214B1 (ko) | 2015-05-29 | 2017-12-22 | 고려대학교 세종산학협력단 | 비정질 금속을 이용한 유연한 압력 센서와, 압력 및 온도를 동시에 감지하는 유연한 이중모드 센서 |
CN107560766A (zh) * | 2016-07-01 | 2018-01-09 | 南昌欧菲光科技有限公司 | 压阻传感器和用于压阻传感器的压敏元件 |
GB2559338A (en) * | 2017-01-31 | 2018-08-08 | Philip Sperring Christopher | Contact pressure sensor manufacture |
EP3431948A1 (de) * | 2017-07-17 | 2019-01-23 | Planet GDZ AG | Teststreifen für dichtungen |
KR102071145B1 (ko) | 2017-09-18 | 2020-01-29 | 고려대학교 세종산학협력단 | 스트레쳐블 다중모드 센서 및 그 제조 방법 |
KR102659612B1 (ko) * | 2018-10-30 | 2024-04-23 | 삼성디스플레이 주식회사 | 압력 센서 및 이를 포함한 표시 장치 |
KR102263568B1 (ko) * | 2021-02-15 | 2021-06-11 | 한국표준과학연구원 | 양자 저항 표준을 위한 캡슐화된 구조체 |
KR20230137635A (ko) * | 2022-03-22 | 2023-10-05 | 동우 화인켐 주식회사 | 온도 및 압력 측정용 복합 센서 |
CN115200729B (zh) * | 2022-08-02 | 2024-05-17 | 清华大学 | 阵列式薄膜温差传感器及其制备方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US465775A (en) * | 1891-12-22 | Mechanism for doubling up the purchase of hoist-ropes | ||
US3585415A (en) * | 1969-10-06 | 1971-06-15 | Univ California | Stress-strain transducer charge coupled to a piezoelectric material |
DE3403042A1 (de) * | 1984-01-30 | 1985-08-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Duennfilm-dehnungsmessstreifen-system und verfahren zu seiner herstellung |
JPH0670969B2 (ja) * | 1984-09-13 | 1994-09-07 | 株式会社長野計器製作所 | シリコン薄膜ピエゾ抵抗素子の製造法 |
US4758896A (en) * | 1985-12-10 | 1988-07-19 | Citizen Watch Co., Ltd. | 3-Dimensional integrated circuit for liquid crystal display TV receiver |
FR2622008B1 (fr) | 1987-10-15 | 1990-01-19 | Commissariat Energie Atomique | Jauges de contrainte a fluage reglable et procede d'obtention de telles jauges |
US4906840A (en) * | 1988-01-27 | 1990-03-06 | The Board Of Trustees Of Leland Stanford Jr., University | Integrated scanning tunneling microscope |
DE68901571D1 (de) * | 1988-03-30 | 1992-06-25 | Schlumberger Ind Sa | Halbleiter-druckwandler. |
JP3064354B2 (ja) * | 1990-08-22 | 2000-07-12 | コーリン電子株式会社 | 接触圧センサ |
US5195365A (en) * | 1990-08-24 | 1993-03-23 | Toyota Jidosha Kabushiki Kaisha | Device for detecting combustion pressure of an internal combustion engine |
JP3116409B2 (ja) * | 1991-05-07 | 2000-12-11 | 株式会社デンソー | 半導体歪みセンサ |
DE69218611T2 (de) * | 1991-06-12 | 1997-07-03 | Harris Corp | Verfahren zur herstellung eines halbleiter-beschleunigungsmessers |
JP3315730B2 (ja) * | 1991-08-26 | 2002-08-19 | マイクロリス、コーパレイシャン | ピエゾ抵抗半導体センサ・ゲージ及びこれを作る方法 |
US5406852A (en) | 1992-03-18 | 1995-04-18 | Matsushita Electric Industrial Co., Ltd. | Pressure sensor having a resistor element on a glass dryer with electrodes connected thereto |
JPH06213613A (ja) | 1993-01-14 | 1994-08-05 | Sumitomo Electric Ind Ltd | 歪抵抗材料およびその製造方法および薄膜歪センサ |
JPH07253364A (ja) * | 1994-03-14 | 1995-10-03 | Nippondenso Co Ltd | 応力検出装置 |
DE19509188B4 (de) * | 1994-03-14 | 2004-04-29 | Denso Corp., Kariya | Druckdetektor |
JPH07297412A (ja) * | 1994-04-28 | 1995-11-10 | Masaki Esashi | ピエゾ抵抗素子 |
JP3317084B2 (ja) * | 1995-03-31 | 2002-08-19 | 株式会社豊田中央研究所 | 力検知素子およびその製造方法 |
US5695859A (en) * | 1995-04-27 | 1997-12-09 | Burgess; Lester E. | Pressure activated switching device |
JPH08320342A (ja) * | 1995-05-24 | 1996-12-03 | Mitsubishi Electric Corp | 慣性力センサおよびその製造方法 |
GB2310288B (en) | 1996-02-17 | 1999-09-29 | John Karl Atkinson | A force sensitive device |
US5935641A (en) * | 1996-10-23 | 1999-08-10 | Texas Instruments Incorporated | Method of forming a piezoelectric layer with improved texture |
US5894161A (en) * | 1997-02-24 | 1999-04-13 | Micron Technology, Inc. | Interconnect with pressure sensing mechanism for testing semiconductor wafers |
JP3494022B2 (ja) * | 1997-08-29 | 2004-02-03 | 松下電工株式会社 | 半導体加速度センサの製造方法 |
US6022756A (en) * | 1998-07-31 | 2000-02-08 | Delco Electronics Corp. | Metal diaphragm sensor with polysilicon sensing elements and methods therefor |
JP3546151B2 (ja) | 1999-04-28 | 2004-07-21 | 長野計器株式会社 | 歪み検出素子及び歪み検出素子製造方法 |
US6555946B1 (en) * | 2000-07-24 | 2003-04-29 | Motorola, Inc. | Acoustic wave device and process for forming the same |
JP2002170962A (ja) * | 2000-09-25 | 2002-06-14 | Fuji Photo Film Co Ltd | 半導体圧力センサ |
JP2002257645A (ja) * | 2001-03-01 | 2002-09-11 | Toyota Central Res & Dev Lab Inc | 高感度力検知センサ |
-
2003
- 2003-07-08 US US10/615,413 patent/US7127949B2/en not_active Expired - Fee Related
-
2004
- 2004-07-06 AU AU2004254545A patent/AU2004254545B2/en not_active Ceased
- 2004-07-06 WO PCT/SG2004/000197 patent/WO2005003708A1/en active Search and Examination
- 2004-07-06 MX MXPA06000265A patent/MXPA06000265A/es active IP Right Grant
- 2004-07-06 CA CA002531659A patent/CA2531659A1/en not_active Abandoned
- 2004-07-06 CN CNB2004800238230A patent/CN100494933C/zh not_active Expired - Fee Related
- 2004-07-06 EP EP04749219.4A patent/EP1651935B1/en not_active Expired - Lifetime
- 2004-07-06 KR KR1020067000531A patent/KR101177543B1/ko not_active IP Right Cessation
- 2004-07-06 JP JP2006518601A patent/JP5214879B2/ja not_active Expired - Fee Related
- 2004-07-06 NZ NZ545064A patent/NZ545064A/en not_active IP Right Cessation
- 2004-07-08 TW TW093120446A patent/TWI348776B/zh not_active IP Right Cessation
-
2006
- 2006-01-17 NO NO20060246A patent/NO20060246L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CA2531659A1 (en) | 2005-01-13 |
TWI348776B (en) | 2011-09-11 |
US7127949B2 (en) | 2006-10-31 |
AU2004254545A1 (en) | 2005-01-13 |
JP2007527515A (ja) | 2007-09-27 |
AU2004254545B2 (en) | 2009-03-26 |
JP5214879B2 (ja) | 2013-06-19 |
US20050007721A1 (en) | 2005-01-13 |
MXPA06000265A (es) | 2006-07-03 |
TW200509424A (en) | 2005-03-01 |
CN1839298A (zh) | 2006-09-27 |
KR20060108275A (ko) | 2006-10-17 |
EP1651935B1 (en) | 2014-03-05 |
EP1651935A1 (en) | 2006-05-03 |
KR101177543B1 (ko) | 2012-08-28 |
NZ545064A (en) | 2008-05-30 |
EP1651935A4 (en) | 2007-03-07 |
CN100494933C (zh) | 2009-06-03 |
WO2005003708A1 (en) | 2005-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |