NO20011464L - Optisk modul - Google Patents
Optisk modulInfo
- Publication number
- NO20011464L NO20011464L NO20011464A NO20011464A NO20011464L NO 20011464 L NO20011464 L NO 20011464L NO 20011464 A NO20011464 A NO 20011464A NO 20011464 A NO20011464 A NO 20011464A NO 20011464 L NO20011464 L NO 20011464L
- Authority
- NO
- Norway
- Prior art keywords
- optical module
- module
- optical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000079596A JP2001264593A (ja) | 2000-03-22 | 2000-03-22 | 光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20011464D0 NO20011464D0 (no) | 2001-03-22 |
NO20011464L true NO20011464L (no) | 2001-09-24 |
Family
ID=18596827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20011464A NO20011464L (no) | 2000-03-22 | 2001-03-22 | Optisk modul |
Country Status (5)
Country | Link |
---|---|
US (1) | US6655856B2 (de) |
EP (1) | EP1136864A3 (de) |
JP (1) | JP2001264593A (de) |
CA (1) | CA2341150A1 (de) |
NO (1) | NO20011464L (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4221896B2 (ja) * | 2000-11-30 | 2009-02-12 | ヤマハ株式会社 | 光ファイバーセンサ |
JP2002341193A (ja) * | 2001-05-15 | 2002-11-27 | Oki Electric Ind Co Ltd | 光学レンズ素子組立体 |
JP2003124500A (ja) * | 2001-10-15 | 2003-04-25 | Sharp Corp | 光結合素子 |
JP2003149479A (ja) * | 2001-11-14 | 2003-05-21 | Hitachi Cable Ltd | 石英系ガラス光導波路及びそれを用いた光モジュール |
JP3750649B2 (ja) * | 2001-12-25 | 2006-03-01 | 住友電気工業株式会社 | 光通信装置 |
JP3950694B2 (ja) * | 2002-01-29 | 2007-08-01 | 株式会社ルネサステクノロジ | 光送信モジュール |
JP3986840B2 (ja) * | 2002-02-01 | 2007-10-03 | 三菱電機株式会社 | 光スイッチの製造方法 |
JP3838164B2 (ja) * | 2002-06-18 | 2006-10-25 | 住友電気工業株式会社 | 光通信用素子と光通信用素子の製造方法 |
JP2004198719A (ja) * | 2002-12-18 | 2004-07-15 | Tdk Corp | 光モジュール及びその製造方法 |
US7308174B2 (en) * | 2002-12-20 | 2007-12-11 | Ngk Insulators, Ltd. | Optical device including a filter member for dividing a portion of signal light |
US7321703B2 (en) * | 2002-12-20 | 2008-01-22 | Ngk Insulators, Ltd. | Optical device |
JP4361300B2 (ja) * | 2003-03-20 | 2009-11-11 | セイコーエプソン株式会社 | 光モジュール及びその製造方法並びに電子機器 |
JP3804632B2 (ja) * | 2003-05-21 | 2006-08-02 | 住友電気工業株式会社 | 光データリンク |
JP4031804B2 (ja) * | 2003-06-02 | 2008-01-09 | 日本碍子株式会社 | 光デバイス |
US7452140B2 (en) * | 2003-07-16 | 2008-11-18 | Ibiden Co., Ltd. | Protective sealing of optoelectronic modules |
JP3929968B2 (ja) * | 2003-12-09 | 2007-06-13 | 株式会社フジクラ | 光コネクタ |
TWI303491B (en) * | 2004-02-20 | 2008-11-21 | Toshiba Kk | Semiconductor relay apparatus and wiring board fabrication method |
JP2006208951A (ja) * | 2005-01-31 | 2006-08-10 | Mitsumi Electric Co Ltd | 光学素子の保持方法及び光学素子の保持機構並びに光通信用モジュール |
JP4654074B2 (ja) * | 2005-06-15 | 2011-03-16 | キヤノン株式会社 | 光学ユニット及び画像形成装置 |
DE102006034175B4 (de) * | 2006-07-24 | 2008-11-13 | Continental Automotive Gmbh | Dichtes Hohlraumgehäuse für ein elektronisches Bauelement |
JP5029193B2 (ja) * | 2007-07-31 | 2012-09-19 | 日本電気株式会社 | 光送受信サブアセンブリ、及び光送受信モジュール |
CN101821915B (zh) * | 2008-03-26 | 2013-10-23 | 住友电气工业株式会社 | 光电转换组件、其组装方法及使用该组件的光电信息处理器 |
JP2010237641A (ja) * | 2009-03-13 | 2010-10-21 | Fujikura Ltd | 光モジュールおよびモジュール付きケーブル |
JP5214532B2 (ja) * | 2009-05-15 | 2013-06-19 | ヒロセ電機株式会社 | 光電気複合型コネクタ |
DE102015114292A1 (de) | 2015-08-27 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Laserbauelement und Verfahren zu seiner Herstellung |
KR101978913B1 (ko) * | 2015-11-16 | 2019-05-16 | 한국전자통신연구원 | 다채널 광 수신기 및 그의 제조 방법 |
JP2019117061A (ja) * | 2017-12-26 | 2019-07-18 | ファナック株式会社 | ロータリエンコーダおよびロータリエンコーダの製造方法 |
WO2020162564A1 (ja) * | 2019-02-08 | 2020-08-13 | 古河電気工業株式会社 | 光モジュール |
CN110854087B (zh) * | 2019-11-27 | 2021-10-01 | 南通优睿半导体有限公司 | 一种具有调节结构的可散热式双基岛dsop芯片用封装机构 |
CN113451233B (zh) * | 2021-05-14 | 2022-10-28 | 上海维攀微电子有限公司 | 一种tvs二极管封装结构 |
DE102022106941A1 (de) | 2022-03-24 | 2023-09-28 | Ams-Osram International Gmbh | Optoelektronisches halbleiterlaserbauelement |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH079441B2 (ja) * | 1991-03-20 | 1995-02-01 | 日本碍子株式会社 | 光応用センサおよびその製造方法 |
US5717533A (en) * | 1995-01-13 | 1998-02-10 | Methode Electronics Inc. | Removable optoelectronic module |
JP3087676B2 (ja) * | 1997-02-13 | 2000-09-11 | 日本電気株式会社 | ゲル状樹脂を用いた光結合系及び実装構造 |
DE19714170C1 (de) * | 1997-03-21 | 1998-07-30 | Siemens Ag | Elektrooptisches Modul |
WO1998045741A1 (en) * | 1997-04-08 | 1998-10-15 | Hitachi, Ltd. | Optical module, method for manufacturing optical module, and optical transmission device |
JPH10303508A (ja) | 1997-04-28 | 1998-11-13 | Hitachi Ltd | パッケージケースと半導体モジュール |
JP3191729B2 (ja) * | 1997-07-03 | 2001-07-23 | 日本電気株式会社 | 光半導体モジュールとその製造方法 |
JP2907203B1 (ja) * | 1998-02-20 | 1999-06-21 | 住友電気工業株式会社 | 光モジュール |
DE19823691A1 (de) * | 1998-05-27 | 1999-12-02 | Siemens Ag | Gehäuseanordnung für Lasermodul |
JP2000110176A (ja) * | 1998-10-02 | 2000-04-18 | Fujitsu Ltd | 光モジュール及びその製造方法 |
JP3637228B2 (ja) * | 1999-02-09 | 2005-04-13 | 住友電気工業株式会社 | 光送受信モジュール |
-
2000
- 2000-03-22 JP JP2000079596A patent/JP2001264593A/ja active Pending
-
2001
- 2001-03-21 CA CA002341150A patent/CA2341150A1/en not_active Abandoned
- 2001-03-21 US US09/812,693 patent/US6655856B2/en not_active Expired - Lifetime
- 2001-03-22 NO NO20011464A patent/NO20011464L/no not_active Application Discontinuation
- 2001-03-22 EP EP01107206A patent/EP1136864A3/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2001264593A (ja) | 2001-09-26 |
EP1136864A2 (de) | 2001-09-26 |
US20010024553A1 (en) | 2001-09-27 |
EP1136864A3 (de) | 2004-12-01 |
US6655856B2 (en) | 2003-12-02 |
CA2341150A1 (en) | 2001-09-22 |
NO20011464D0 (no) | 2001-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |