NL9200898A - Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. - Google Patents

Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. Download PDF

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Publication number
NL9200898A
NL9200898A NL9200898A NL9200898A NL9200898A NL 9200898 A NL9200898 A NL 9200898A NL 9200898 A NL9200898 A NL 9200898A NL 9200898 A NL9200898 A NL 9200898A NL 9200898 A NL9200898 A NL 9200898A
Authority
NL
Netherlands
Prior art keywords
solution
plastic
salt
process according
added
Prior art date
Application number
NL9200898A
Other languages
English (en)
Dutch (nl)
Original Assignee
Meco Equip Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng filed Critical Meco Equip Eng
Priority to NL9200898A priority Critical patent/NL9200898A/nl
Priority to EP93201321A priority patent/EP0571015B1/de
Priority to SG1996009029A priority patent/SG52756A1/en
Priority to AT93201321T priority patent/ATE175054T1/de
Priority to DE69322686T priority patent/DE69322686D1/de
Priority to KR1019930008398A priority patent/KR930024125A/ko
Priority to JP5117163A priority patent/JPH0653262A/ja
Priority to MX9302969A priority patent/MX9302969A/es
Priority to MYPI93000978A priority patent/MY109058A/en
Priority to US08/064,665 priority patent/US5362370A/en
Priority to TW082104496A priority patent/TW219408B/zh
Publication of NL9200898A publication Critical patent/NL9200898A/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
NL9200898A 1992-05-21 1992-05-21 Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. NL9200898A (nl)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL9200898A NL9200898A (nl) 1992-05-21 1992-05-21 Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling.
EP93201321A EP0571015B1 (de) 1992-05-21 1993-05-07 Elektrolytisches Reinigungsverfahren für Metalloberfläche von elektronischen Bauelementen
SG1996009029A SG52756A1 (en) 1992-05-21 1993-05-07 Method for the electrolytic removal of plastic mold flash or blled from the metal surfaces of semiconductor devices or similar electronic components and the solution composition to be used
AT93201321T ATE175054T1 (de) 1992-05-21 1993-05-07 Elektrolytisches reinigungsverfahren für metalloberfläche von elektronischen bauelementen
DE69322686T DE69322686D1 (de) 1992-05-21 1993-05-07 Elektrolytisches Reinigungsverfahren für Metalloberfläche von elektronischen Bauelementen
KR1019930008398A KR930024125A (ko) 1992-05-21 1993-05-17 반도체 장치 또는 유사한 전자 부품의 금속 표면으로부터 가소제 성형 주물귀 또는 추기의 전해적 제거방법 및 그 방법에 사용되는 용액 조성물
JP5117163A JPH0653262A (ja) 1992-05-21 1993-05-19 半導体デバイス等の金属表面からプラスチックのばり等を電解除去する方法及びその方法に使用する溶液組成物
MX9302969A MX9302969A (es) 1992-05-21 1993-05-20 Metodo para la separacion electrolitica de rebaba o escurrimiento en molde de plastico desde superficies metalicas de semiconductores y componentes electronicos similares y la composicion en solucion que se emplea con es metodo.
MYPI93000978A MY109058A (en) 1992-05-21 1993-05-21 Method for the electrolytic removal of plastic mold flash or bleed from the surfaces of semiconductor devices or similar electronic components and the solution composition to be used with this method
US08/064,665 US5362370A (en) 1992-05-21 1993-05-21 Method for the electrolytic removal of plastic mold flash or bleed from the metal surfaces of semiconductor devices or similar electronic components
TW082104496A TW219408B (de) 1992-05-21 1993-06-05

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9200898A NL9200898A (nl) 1992-05-21 1992-05-21 Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling.
NL9200898 1992-05-21

Publications (1)

Publication Number Publication Date
NL9200898A true NL9200898A (nl) 1993-12-16

Family

ID=19860826

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9200898A NL9200898A (nl) 1992-05-21 1992-05-21 Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling.

Country Status (11)

Country Link
US (1) US5362370A (de)
EP (1) EP0571015B1 (de)
JP (1) JPH0653262A (de)
KR (1) KR930024125A (de)
AT (1) ATE175054T1 (de)
DE (1) DE69322686D1 (de)
MX (1) MX9302969A (de)
MY (1) MY109058A (de)
NL (1) NL9200898A (de)
SG (1) SG52756A1 (de)
TW (1) TW219408B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384155A (en) * 1992-06-04 1995-01-24 Texas Instruments Incorporated Silver spot/palladium plate lead frame finish
KR100206910B1 (ko) * 1996-06-14 1999-07-01 구본준 반도체 패키지의 디플래쉬 방법
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US6230719B1 (en) 1998-02-27 2001-05-15 Micron Technology, Inc. Apparatus for removing contaminants on electronic devices
US6203691B1 (en) 1998-09-18 2001-03-20 Hoffman Industries International, Ltd. Electrolytic cleaning of conductive bodies
AU2001288629A1 (en) * 2000-08-31 2002-03-13 Chemtrace, Inc. Cleaning of semiconductor process equipment chamber parts using organic solvents
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US8125060B2 (en) * 2006-12-08 2012-02-28 Infineon Technologies Ag Electronic component with layered frame
JP5793991B2 (ja) * 2011-06-24 2015-10-14 日立化成株式会社 半導体パッケージの開封方法、及び半導体パッケージの検査方法
JP5793990B2 (ja) * 2011-06-24 2015-10-14 日立化成株式会社 半導体パッケージの開封方法、及び半導体パッケージの検査方法
JP6348821B2 (ja) * 2014-10-24 2018-06-27 化研テック株式会社 バリ除去用電解液組成物およびバリの除去方法
US10351966B2 (en) * 2015-09-25 2019-07-16 Apple Inc. Process for cleaning anodic oxide pore structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3732177C2 (de) * 1987-09-24 1996-01-18 Mr Metall Recycling Gmbh Verfahren zur Rückgewinnung von Metallen aus Metall-Kunststoffabfällen und dergleichen
US4781804A (en) * 1988-03-02 1988-11-01 Delco Electronics Corporation Electrolytic organic mold flash removal
JPH02104699A (ja) * 1988-10-11 1990-04-17 C Uyemura & Co Ltd 銀の電解剥離剤及び電解剥離方法
US4968397A (en) * 1989-11-27 1990-11-06 Asher Reginald K Non-cyanide electrode cleaning process
US5174870A (en) * 1991-08-09 1992-12-29 Pct Technology, Inc. Electrocleaning method
US5232563A (en) * 1992-07-27 1993-08-03 Motorola, Inc. Method of cleaning a semiconductor wafer

Also Published As

Publication number Publication date
SG52756A1 (en) 1998-09-28
MY109058A (en) 1996-11-30
DE69322686D1 (de) 1999-02-04
MX9302969A (es) 1994-04-29
US5362370A (en) 1994-11-08
ATE175054T1 (de) 1999-01-15
EP0571015B1 (de) 1998-12-23
TW219408B (de) 1994-01-21
EP0571015A1 (de) 1993-11-24
KR930024125A (ko) 1993-12-22
JPH0653262A (ja) 1994-02-25

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