MX9302969A - Metodo para la separacion electrolitica de rebaba o escurrimiento en molde de plastico desde superficies metalicas de semiconductores y componentes electronicos similares y la composicion en solucion que se emplea con es metodo. - Google Patents

Metodo para la separacion electrolitica de rebaba o escurrimiento en molde de plastico desde superficies metalicas de semiconductores y componentes electronicos similares y la composicion en solucion que se emplea con es metodo.

Info

Publication number
MX9302969A
MX9302969A MX9302969A MX9302969A MX9302969A MX 9302969 A MX9302969 A MX 9302969A MX 9302969 A MX9302969 A MX 9302969A MX 9302969 A MX9302969 A MX 9302969A MX 9302969 A MX9302969 A MX 9302969A
Authority
MX
Mexico
Prior art keywords
plastic mold
bleed
electronic components
similar electronic
metal surfaces
Prior art date
Application number
MX9302969A
Other languages
English (en)
Inventor
Henricus Johannes Van Heijden
Original Assignee
Meco Equip Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng filed Critical Meco Equip Eng
Publication of MX9302969A publication Critical patent/MX9302969A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4864—Cleaning, e.g. removing of solder
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

1.- Método para la separación electrolítica de recorte o rebaba de molde de plástico desde las superficies metálicas de aparatos semiconductores y componentes electrónicos similares al sumergir estos componentes en una solución basada en agua de uno o más solventes orgánicos, sales conductoras y un agente humectante y conectar los componentes que se limpian en el polo negativo de una fuente de corriente directa de la cual el polo positivo se conecta a un contraelectrodo en la misma solución, caracterizado porque durante el paso de una corriente a través de una solución, el valor pH de la película líquida directamente adyacente a la superficie metálica catódica, se eleva a un valor en el cual el solvente en la solución provoca una acción de ablandamiento en el recorte de plástico, que es suficiente para permitir que gas hidrógeno, generado simultáneamente en el cátodo, retire la rebaba o recorte de molde de plástico de la superficie de metal.
MX9302969A 1992-05-21 1993-05-20 Metodo para la separacion electrolitica de rebaba o escurrimiento en molde de plastico desde superficies metalicas de semiconductores y componentes electronicos similares y la composicion en solucion que se emplea con es metodo. MX9302969A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9200898A NL9200898A (nl) 1992-05-21 1992-05-21 Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling.

Publications (1)

Publication Number Publication Date
MX9302969A true MX9302969A (es) 1994-04-29

Family

ID=19860826

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9302969A MX9302969A (es) 1992-05-21 1993-05-20 Metodo para la separacion electrolitica de rebaba o escurrimiento en molde de plastico desde superficies metalicas de semiconductores y componentes electronicos similares y la composicion en solucion que se emplea con es metodo.

Country Status (11)

Country Link
US (1) US5362370A (es)
EP (1) EP0571015B1 (es)
JP (1) JPH0653262A (es)
KR (1) KR930024125A (es)
AT (1) ATE175054T1 (es)
DE (1) DE69322686D1 (es)
MX (1) MX9302969A (es)
MY (1) MY109058A (es)
NL (1) NL9200898A (es)
SG (1) SG52756A1 (es)
TW (1) TW219408B (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384155A (en) * 1992-06-04 1995-01-24 Texas Instruments Incorporated Silver spot/palladium plate lead frame finish
KR100206910B1 (ko) * 1996-06-14 1999-07-01 구본준 반도체 패키지의 디플래쉬 방법
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US6230719B1 (en) 1998-02-27 2001-05-15 Micron Technology, Inc. Apparatus for removing contaminants on electronic devices
US6203691B1 (en) 1998-09-18 2001-03-20 Hoffman Industries International, Ltd. Electrolytic cleaning of conductive bodies
US6607605B2 (en) 2000-08-31 2003-08-19 Chemtrace Corporation Cleaning of semiconductor process equipment chamber parts using organic solvents
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US8125060B2 (en) * 2006-12-08 2012-02-28 Infineon Technologies Ag Electronic component with layered frame
JP5793991B2 (ja) * 2011-06-24 2015-10-14 日立化成株式会社 半導体パッケージの開封方法、及び半導体パッケージの検査方法
JP5793990B2 (ja) * 2011-06-24 2015-10-14 日立化成株式会社 半導体パッケージの開封方法、及び半導体パッケージの検査方法
JP6348821B2 (ja) * 2014-10-24 2018-06-27 化研テック株式会社 バリ除去用電解液組成物およびバリの除去方法
US10351966B2 (en) * 2015-09-25 2019-07-16 Apple Inc. Process for cleaning anodic oxide pore structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3732177C2 (de) * 1987-09-24 1996-01-18 Mr Metall Recycling Gmbh Verfahren zur Rückgewinnung von Metallen aus Metall-Kunststoffabfällen und dergleichen
US4781804A (en) * 1988-03-02 1988-11-01 Delco Electronics Corporation Electrolytic organic mold flash removal
JPH02104699A (ja) * 1988-10-11 1990-04-17 C Uyemura & Co Ltd 銀の電解剥離剤及び電解剥離方法
US4968397A (en) * 1989-11-27 1990-11-06 Asher Reginald K Non-cyanide electrode cleaning process
US5174870A (en) * 1991-08-09 1992-12-29 Pct Technology, Inc. Electrocleaning method
US5232563A (en) * 1992-07-27 1993-08-03 Motorola, Inc. Method of cleaning a semiconductor wafer

Also Published As

Publication number Publication date
KR930024125A (ko) 1993-12-22
DE69322686D1 (de) 1999-02-04
US5362370A (en) 1994-11-08
EP0571015B1 (en) 1998-12-23
JPH0653262A (ja) 1994-02-25
TW219408B (es) 1994-01-21
NL9200898A (nl) 1993-12-16
MY109058A (en) 1996-11-30
EP0571015A1 (en) 1993-11-24
ATE175054T1 (de) 1999-01-15
SG52756A1 (en) 1998-09-28

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