NL9200898A - Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. - Google Patents
Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. Download PDFInfo
- Publication number
- NL9200898A NL9200898A NL9200898A NL9200898A NL9200898A NL 9200898 A NL9200898 A NL 9200898A NL 9200898 A NL9200898 A NL 9200898A NL 9200898 A NL9200898 A NL 9200898A NL 9200898 A NL9200898 A NL 9200898A
- Authority
- NL
- Netherlands
- Prior art keywords
- solution
- plastic
- salt
- process according
- added
- Prior art date
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000000203 mixture Substances 0.000 title claims abstract description 10
- 238000005868 electrolysis reaction Methods 0.000 title claims description 4
- 230000000740 bleeding effect Effects 0.000 title description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 150000003839 salts Chemical class 0.000 claims abstract description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000000080 wetting agent Substances 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 29
- -1 alkyl lactate Chemical compound 0.000 claims description 10
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 229910052700 potassium Inorganic materials 0.000 claims description 7
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011591 potassium Substances 0.000 claims description 5
- 239000011734 sodium Substances 0.000 claims description 5
- 150000003863 ammonium salts Chemical class 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 150000007522 mineralic acids Chemical class 0.000 claims description 2
- 229940001447 lactate Drugs 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 150000003893 lactate salts Chemical class 0.000 claims 2
- CYDQOEWLBCCFJZ-UHFFFAOYSA-N 4-(4-fluorophenyl)oxane-4-carboxylic acid Chemical compound C=1C=C(F)C=CC=1C1(C(=O)O)CCOCC1 CYDQOEWLBCCFJZ-UHFFFAOYSA-N 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims 1
- 239000005695 Ammonium acetate Substances 0.000 claims 1
- 239000004251 Ammonium lactate Substances 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 235000019257 ammonium acetate Nutrition 0.000 claims 1
- 229940043376 ammonium acetate Drugs 0.000 claims 1
- 229940059265 ammonium lactate Drugs 0.000 claims 1
- 235000019286 ammonium lactate Nutrition 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Substances [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims 1
- 235000011056 potassium acetate Nutrition 0.000 claims 1
- 239000001521 potassium lactate Substances 0.000 claims 1
- 235000011085 potassium lactate Nutrition 0.000 claims 1
- 229960001304 potassium lactate Drugs 0.000 claims 1
- 239000001632 sodium acetate Substances 0.000 claims 1
- 235000017281 sodium acetate Nutrition 0.000 claims 1
- 239000001540 sodium lactate Substances 0.000 claims 1
- 229940005581 sodium lactate Drugs 0.000 claims 1
- 235000011088 sodium lactate Nutrition 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 14
- 208000032843 Hemorrhage Diseases 0.000 description 11
- 208000034158 bleeding Diseases 0.000 description 11
- 231100000319 bleeding Toxicity 0.000 description 11
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 8
- 229940116333 ethyl lactate Drugs 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 238000006460 hydrolysis reaction Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005422 blasting Methods 0.000 description 4
- 239000004310 lactic acid Substances 0.000 description 4
- 235000014655 lactic acid Nutrition 0.000 description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 150000003903 lactic acid esters Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- 241000167854 Bourreria succulenta Species 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 235000019693 cherries Nutrition 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical class OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 229940093916 potassium phosphate Drugs 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 229940083608 sodium hydroxide Drugs 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4864—Cleaning, e.g. removing of solder
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Lead Frames For Integrated Circuits (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL9200898A NL9200898A (nl) | 1992-05-21 | 1992-05-21 | Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. |
| DE69322686T DE69322686D1 (de) | 1992-05-21 | 1993-05-07 | Elektrolytisches Reinigungsverfahren für Metalloberfläche von elektronischen Bauelementen |
| SG1996009029A SG52756A1 (en) | 1992-05-21 | 1993-05-07 | Method for the electrolytic removal of plastic mold flash or blled from the metal surfaces of semiconductor devices or similar electronic components and the solution composition to be used |
| EP93201321A EP0571015B1 (en) | 1992-05-21 | 1993-05-07 | Electrolytic cleaning method for metal surfaces of electronic components |
| AT93201321T ATE175054T1 (de) | 1992-05-21 | 1993-05-07 | Elektrolytisches reinigungsverfahren für metalloberfläche von elektronischen bauelementen |
| KR1019930008398A KR930024125A (ko) | 1992-05-21 | 1993-05-17 | 반도체 장치 또는 유사한 전자 부품의 금속 표면으로부터 가소제 성형 주물귀 또는 추기의 전해적 제거방법 및 그 방법에 사용되는 용액 조성물 |
| JP5117163A JPH0653262A (ja) | 1992-05-21 | 1993-05-19 | 半導体デバイス等の金属表面からプラスチックのばり等を電解除去する方法及びその方法に使用する溶液組成物 |
| MX9302969A MX9302969A (es) | 1992-05-21 | 1993-05-20 | Metodo para la separacion electrolitica de rebaba o escurrimiento en molde de plastico desde superficies metalicas de semiconductores y componentes electronicos similares y la composicion en solucion que se emplea con es metodo. |
| MYPI93000978A MY109058A (en) | 1992-05-21 | 1993-05-21 | Method for the electrolytic removal of plastic mold flash or bleed from the surfaces of semiconductor devices or similar electronic components and the solution composition to be used with this method |
| US08/064,665 US5362370A (en) | 1992-05-21 | 1993-05-21 | Method for the electrolytic removal of plastic mold flash or bleed from the metal surfaces of semiconductor devices or similar electronic components |
| TW082104496A TW219408B (es) | 1992-05-21 | 1993-06-05 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL9200898A NL9200898A (nl) | 1992-05-21 | 1992-05-21 | Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. |
| NL9200898 | 1992-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL9200898A true NL9200898A (nl) | 1993-12-16 |
Family
ID=19860826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL9200898A NL9200898A (nl) | 1992-05-21 | 1992-05-21 | Werkwijze voor het middels elektrolyse verwijderen van kunststofuitbloedingen afgezet op metalen aansluitbenen van halfgeleidercomponenten en dergelijke en de bij deze werkwijze gebruikte samenstelling. |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5362370A (es) |
| EP (1) | EP0571015B1 (es) |
| JP (1) | JPH0653262A (es) |
| KR (1) | KR930024125A (es) |
| AT (1) | ATE175054T1 (es) |
| DE (1) | DE69322686D1 (es) |
| MX (1) | MX9302969A (es) |
| MY (1) | MY109058A (es) |
| NL (1) | NL9200898A (es) |
| SG (1) | SG52756A1 (es) |
| TW (1) | TW219408B (es) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5384155A (en) * | 1992-06-04 | 1995-01-24 | Texas Instruments Incorporated | Silver spot/palladium plate lead frame finish |
| KR100206910B1 (ko) * | 1996-06-14 | 1999-07-01 | 구본준 | 반도체 패키지의 디플래쉬 방법 |
| US6001672A (en) * | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
| US6230719B1 (en) | 1998-02-27 | 2001-05-15 | Micron Technology, Inc. | Apparatus for removing contaminants on electronic devices |
| US6203691B1 (en) | 1998-09-18 | 2001-03-20 | Hoffman Industries International, Ltd. | Electrolytic cleaning of conductive bodies |
| US6607605B2 (en) | 2000-08-31 | 2003-08-19 | Chemtrace Corporation | Cleaning of semiconductor process equipment chamber parts using organic solvents |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
| US8125060B2 (en) * | 2006-12-08 | 2012-02-28 | Infineon Technologies Ag | Electronic component with layered frame |
| JP5793991B2 (ja) * | 2011-06-24 | 2015-10-14 | 日立化成株式会社 | 半導体パッケージの開封方法、及び半導体パッケージの検査方法 |
| JP5793990B2 (ja) * | 2011-06-24 | 2015-10-14 | 日立化成株式会社 | 半導体パッケージの開封方法、及び半導体パッケージの検査方法 |
| JP6348821B2 (ja) * | 2014-10-24 | 2018-06-27 | 化研テック株式会社 | バリ除去用電解液組成物およびバリの除去方法 |
| US10351966B2 (en) * | 2015-09-25 | 2019-07-16 | Apple Inc. | Process for cleaning anodic oxide pore structures |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3732177C2 (de) * | 1987-09-24 | 1996-01-18 | Mr Metall Recycling Gmbh | Verfahren zur Rückgewinnung von Metallen aus Metall-Kunststoffabfällen und dergleichen |
| US4781804A (en) * | 1988-03-02 | 1988-11-01 | Delco Electronics Corporation | Electrolytic organic mold flash removal |
| JPH02104699A (ja) * | 1988-10-11 | 1990-04-17 | C Uyemura & Co Ltd | 銀の電解剥離剤及び電解剥離方法 |
| US4968397A (en) * | 1989-11-27 | 1990-11-06 | Asher Reginald K | Non-cyanide electrode cleaning process |
| US5174870A (en) * | 1991-08-09 | 1992-12-29 | Pct Technology, Inc. | Electrocleaning method |
| US5232563A (en) * | 1992-07-27 | 1993-08-03 | Motorola, Inc. | Method of cleaning a semiconductor wafer |
-
1992
- 1992-05-21 NL NL9200898A patent/NL9200898A/nl not_active Application Discontinuation
-
1993
- 1993-05-07 AT AT93201321T patent/ATE175054T1/de not_active IP Right Cessation
- 1993-05-07 EP EP93201321A patent/EP0571015B1/en not_active Expired - Lifetime
- 1993-05-07 SG SG1996009029A patent/SG52756A1/en unknown
- 1993-05-07 DE DE69322686T patent/DE69322686D1/de not_active Expired - Lifetime
- 1993-05-17 KR KR1019930008398A patent/KR930024125A/ko not_active Application Discontinuation
- 1993-05-19 JP JP5117163A patent/JPH0653262A/ja active Pending
- 1993-05-20 MX MX9302969A patent/MX9302969A/es unknown
- 1993-05-21 MY MYPI93000978A patent/MY109058A/en unknown
- 1993-05-21 US US08/064,665 patent/US5362370A/en not_active Expired - Fee Related
- 1993-06-05 TW TW082104496A patent/TW219408B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR930024125A (ko) | 1993-12-22 |
| DE69322686D1 (de) | 1999-02-04 |
| US5362370A (en) | 1994-11-08 |
| EP0571015B1 (en) | 1998-12-23 |
| JPH0653262A (ja) | 1994-02-25 |
| TW219408B (es) | 1994-01-21 |
| MX9302969A (es) | 1994-04-29 |
| MY109058A (en) | 1996-11-30 |
| EP0571015A1 (en) | 1993-11-24 |
| ATE175054T1 (de) | 1999-01-15 |
| SG52756A1 (en) | 1998-09-28 |
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