NL8702593A - Werkwijze voor het elektrodeloos neerslaan van koper met goede kwaliteit. - Google Patents

Werkwijze voor het elektrodeloos neerslaan van koper met goede kwaliteit. Download PDF

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Publication number
NL8702593A
NL8702593A NL8702593A NL8702593A NL8702593A NL 8702593 A NL8702593 A NL 8702593A NL 8702593 A NL8702593 A NL 8702593A NL 8702593 A NL8702593 A NL 8702593A NL 8702593 A NL8702593 A NL 8702593A
Authority
NL
Netherlands
Prior art keywords
copper
solution
intrinsic
ratio
reaction rate
Prior art date
Application number
NL8702593A
Other languages
English (en)
Dutch (nl)
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of NL8702593A publication Critical patent/NL8702593A/nl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1683Control of electrolyte composition, e.g. measurement, adjustment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
NL8702593A 1986-10-31 1987-10-30 Werkwijze voor het elektrodeloos neerslaan van koper met goede kwaliteit. NL8702593A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92636386A 1986-10-31 1986-10-31
US92636386 1986-10-31

Publications (1)

Publication Number Publication Date
NL8702593A true NL8702593A (nl) 1988-05-16

Family

ID=25453111

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8702593A NL8702593A (nl) 1986-10-31 1987-10-30 Werkwijze voor het elektrodeloos neerslaan van koper met goede kwaliteit.

Country Status (13)

Country Link
EP (1) EP0265895B1 (fr)
JP (1) JPH01501326A (fr)
KR (1) KR880701791A (fr)
AU (1) AU604284B2 (fr)
BR (1) BR8707516A (fr)
CA (1) CA1269573A (fr)
CH (1) CH674020A5 (fr)
DE (1) DE3736465A1 (fr)
ES (1) ES2039403T3 (fr)
FR (1) FR2607152B1 (fr)
GB (1) GB2198750B (fr)
NL (1) NL8702593A (fr)
WO (1) WO1988003181A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
DE19932749B4 (de) 1998-07-23 2006-05-04 Robert Bosch Gmbh Schichtsystem und Verfahren zu dessen Herstellung sowie dessen Verwendung
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP6344269B2 (ja) * 2015-03-06 2018-06-20 豊田合成株式会社 めっき方法
CN113966090B (zh) * 2021-10-27 2024-01-23 中国联合网络通信集团有限公司 沉铜厚度控制方法、装置、生产系统、设备及介质

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
FR1551275A (fr) * 1966-12-19 1968-12-27
US3645749A (en) * 1970-06-04 1972-02-29 Kollmorgen Corp Electroless plating baths with improved deposition rates
JPS5627594B2 (fr) * 1975-03-14 1981-06-25
GB1585057A (en) * 1976-06-28 1981-02-25 Ici Ltd Sensing concentration of coating solution
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
CA1135903A (fr) * 1978-09-13 1982-11-23 John F. Mccormack Procede de cuivrage rapide, sans galvanisation sans electricite
US4336111A (en) * 1978-11-02 1982-06-22 The Boeing Company Method for determining the strength of a metal processing solution
JPS5926660B2 (ja) * 1979-03-07 1984-06-29 株式会社東芝 無電解メツキ反応の測定方法
GB2064377B (en) * 1979-10-12 1984-03-21 Imperial College Magnetic separators
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
US4499852A (en) * 1980-07-15 1985-02-19 Shipley Company Inc. Apparatus for regulating plating solution in a plating bath
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
US4479980A (en) * 1983-12-16 1984-10-30 International Business Machines Corporation Plating rate monitor
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン 金属めつき槽の制御装置
US4565575A (en) * 1984-11-02 1986-01-21 Shiplay Company Inc. Apparatus and method for automatically maintaining an electroless plating bath
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4626446A (en) * 1985-06-03 1986-12-02 International Business Machines Corporation Electroless plating bath monitor
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths

Also Published As

Publication number Publication date
WO1988003181A1 (fr) 1988-05-05
KR880701791A (ko) 1988-11-05
DE3736465C2 (fr) 1990-02-08
FR2607152A1 (fr) 1988-05-27
AU8322087A (en) 1988-05-25
GB2198750A (en) 1988-06-22
EP0265895B1 (fr) 1993-02-10
BR8707516A (pt) 1989-02-21
GB8725398D0 (en) 1987-12-02
AU604284B2 (en) 1990-12-13
GB2198750B (en) 1991-01-02
CA1269573A (fr) 1990-05-29
CH674020A5 (fr) 1990-04-30
FR2607152B1 (fr) 1990-03-02
ES2039403T3 (es) 1993-10-01
DE3736465A1 (de) 1988-05-19
EP0265895A3 (en) 1989-04-05
EP0265895A2 (fr) 1988-05-04
JPH01501326A (ja) 1989-05-11

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