NL8503487A - Verpakking voor geintegreerde schakelingen met verbeterde warmteafvoermogelijkheden, en werkwijze ter verbetering van de warmteafvoer. - Google Patents

Verpakking voor geintegreerde schakelingen met verbeterde warmteafvoermogelijkheden, en werkwijze ter verbetering van de warmteafvoer. Download PDF

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Publication number
NL8503487A
NL8503487A NL8503487A NL8503487A NL8503487A NL 8503487 A NL8503487 A NL 8503487A NL 8503487 A NL8503487 A NL 8503487A NL 8503487 A NL8503487 A NL 8503487A NL 8503487 A NL8503487 A NL 8503487A
Authority
NL
Netherlands
Prior art keywords
frame
flag
enlarged
packaging
semiconductor wafer
Prior art date
Application number
NL8503487A
Other languages
English (en)
Dutch (nl)
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Publication of NL8503487A publication Critical patent/NL8503487A/nl

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
NL8503487A 1984-12-18 1985-12-18 Verpakking voor geintegreerde schakelingen met verbeterde warmteafvoermogelijkheden, en werkwijze ter verbetering van de warmteafvoer. NL8503487A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2412584 1984-12-18
IT8424125A IT1213259B (it) 1984-12-18 1984-12-18 Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento.

Publications (1)

Publication Number Publication Date
NL8503487A true NL8503487A (nl) 1986-07-16

Family

ID=11212097

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8503487A NL8503487A (nl) 1984-12-18 1985-12-18 Verpakking voor geintegreerde schakelingen met verbeterde warmteafvoermogelijkheden, en werkwijze ter verbetering van de warmteafvoer.

Country Status (7)

Country Link
US (1) US4947237A (ja)
JP (1) JPS61144855A (ja)
DE (1) DE8535408U1 (ja)
FR (1) FR2574991B3 (ja)
GB (1) GB2168533B (ja)
IT (1) IT1213259B (ja)
NL (1) NL8503487A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
JP2567961B2 (ja) * 1989-12-01 1996-12-25 株式会社日立製作所 半導体装置及びリ−ドフレ−ム
DE4021871C2 (de) * 1990-07-09 1994-07-28 Lsi Logic Products Gmbh Hochintegriertes elektronisches Bauteil
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
US5289032A (en) * 1991-08-16 1994-02-22 Motorola, Inc. Tape automated bonding(tab)semiconductor device and method for making the same
US5471077A (en) * 1991-10-10 1995-11-28 Hughes Aircraft Company High electron mobility transistor and methode of making
DE4137112A1 (de) * 1991-11-12 1993-05-13 Bayerische Motoren Werke Ag Lokale abschirmung von elektronischen bauteilen eines elektronischen steuergeraetes in einem kraftfahrzeug
US5457340A (en) * 1992-12-07 1995-10-10 Integrated Device Technology, Inc. Leadframe with power and ground planes
US7038305B1 (en) 2003-07-15 2006-05-02 Altera Corp. Package for integrated circuit die

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator
SE437900B (sv) * 1976-10-21 1985-03-18 Ates Componenti Elettron Halvledaranordning innefattande en vermeavledare eller kylkropp
JPS53135574A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Lead frame
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
JPS58190051A (ja) * 1982-02-16 1983-11-05 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン 放熱効果を改善した集積回路用リ−ドフレ−ム

Also Published As

Publication number Publication date
IT1213259B (it) 1989-12-14
US4947237A (en) 1990-08-07
IT8424125A0 (it) 1984-12-18
FR2574991A3 (fr) 1986-06-20
FR2574991B3 (fr) 1987-01-09
GB8530654D0 (en) 1986-01-22
DE8535408U1 (de) 1986-10-09
GB2168533A (en) 1986-06-18
JPS61144855A (ja) 1986-07-02
GB2168533B (en) 1989-01-11

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BV The patent application has lapsed