NL8501992A - Werkwijze voor het vervaardigen van een halfgeleiderinrichting. - Google Patents

Werkwijze voor het vervaardigen van een halfgeleiderinrichting. Download PDF

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Publication number
NL8501992A
NL8501992A NL8501992A NL8501992A NL8501992A NL 8501992 A NL8501992 A NL 8501992A NL 8501992 A NL8501992 A NL 8501992A NL 8501992 A NL8501992 A NL 8501992A NL 8501992 A NL8501992 A NL 8501992A
Authority
NL
Netherlands
Prior art keywords
layer
masking
semiconductor
openings
semiconductor body
Prior art date
Application number
NL8501992A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8501992A priority Critical patent/NL8501992A/nl
Priority to US06/880,480 priority patent/US4732869A/en
Priority to DE8686201198T priority patent/DE3671324D1/de
Priority to EP86201198A priority patent/EP0209939B1/en
Priority to CA000513396A priority patent/CA1330648C/en
Priority to JP61160964A priority patent/JPH0793409B2/ja
Publication of NL8501992A publication Critical patent/NL8501992A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
NL8501992A 1985-07-11 1985-07-11 Werkwijze voor het vervaardigen van een halfgeleiderinrichting. NL8501992A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL8501992A NL8501992A (nl) 1985-07-11 1985-07-11 Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
US06/880,480 US4732869A (en) 1985-07-11 1986-06-30 Method of forming implanted regions in a semiconductor device by use of a three layer masking structure
DE8686201198T DE3671324D1 (de) 1985-07-11 1986-07-08 Verfahren zum herstellen einer halbleiteranordnung.
EP86201198A EP0209939B1 (en) 1985-07-11 1986-07-08 Method of manufacturing a semiconductor device
CA000513396A CA1330648C (en) 1985-07-11 1986-07-09 Method of manufacturing a semiconductor device
JP61160964A JPH0793409B2 (ja) 1985-07-11 1986-07-10 半導体装置の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8501992A NL8501992A (nl) 1985-07-11 1985-07-11 Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
NL8501992 1985-07-11

Publications (1)

Publication Number Publication Date
NL8501992A true NL8501992A (nl) 1987-02-02

Family

ID=19846284

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8501992A NL8501992A (nl) 1985-07-11 1985-07-11 Werkwijze voor het vervaardigen van een halfgeleiderinrichting.

Country Status (6)

Country Link
US (1) US4732869A (ja)
EP (1) EP0209939B1 (ja)
JP (1) JPH0793409B2 (ja)
CA (1) CA1330648C (ja)
DE (1) DE3671324D1 (ja)
NL (1) NL8501992A (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292671A (en) * 1987-10-08 1994-03-08 Matsushita Electric Industrial, Co., Ltd. Method of manufacture for semiconductor device by forming deep and shallow regions
EP0794575A3 (en) * 1987-10-08 1998-04-01 Matsushita Electric Industrial Co., Ltd. Structure and method of manufacture for CMOS semiconductor device against latch-up effect
JP2727552B2 (ja) * 1988-02-29 1998-03-11 ソニー株式会社 半導体装置の製造方法
US4925806A (en) * 1988-03-17 1990-05-15 Northern Telecom Limited Method for making a doped well in a semiconductor substrate
JP2897215B2 (ja) * 1988-07-15 1999-05-31 ソニー株式会社 半導体装置の製造方法
JPH0770629B2 (ja) * 1990-03-20 1995-07-31 株式会社東芝 不揮発性半導体記憶装置の製造方法
JP2851753B2 (ja) * 1991-10-22 1999-01-27 三菱電機株式会社 半導体装置およびその製造方法
JPH0689871A (ja) * 1992-09-08 1994-03-29 Matsushita Electron Corp 半導体装置の製造方法
JP2978345B2 (ja) * 1992-11-26 1999-11-15 三菱電機株式会社 半導体装置の製造方法
US5573963A (en) * 1995-05-03 1996-11-12 Vanguard International Semiconductor Corporation Method of forming self-aligned twin tub CMOS devices
US5661069A (en) * 1995-06-06 1997-08-26 Lsi Logic Corporation Method of forming an MOS-type integrated circuit structure with a diode formed in the substrate under a polysilicon gate electrode to conserve space
JPH09120965A (ja) * 1995-10-25 1997-05-06 Toshiba Corp 半導体装置の製造方法
US5573962A (en) * 1995-12-15 1996-11-12 Vanguard International Semiconductor Corporation Low cycle time CMOS process
US5858828A (en) * 1997-02-18 1999-01-12 Symbios, Inc. Use of MEV implantation to form vertically modulated N+ buried layer in an NPN bipolar transistor
US6005253A (en) * 1998-05-04 1999-12-21 Chartered Semiconductor Manufacturing, Ltd. Scanning energy implantation
DE10056261A1 (de) * 2000-11-14 2002-05-29 Infineon Technologies Ag Verfahren zur Herstellung eines integrierten Halbleiter-Bauelements
JP2002217123A (ja) * 2001-01-18 2002-08-02 Sony Corp イオン注入方法
CN111430307B (zh) * 2019-12-17 2021-06-25 合肥晶合集成电路股份有限公司 半导体集成器件的阱制备方法和阱注入光罩组

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506437A (en) * 1978-05-26 1985-03-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
FR2454698A1 (fr) * 1979-04-20 1980-11-14 Radiotechnique Compelec Procede de realisation de circuits integres a l'aide d'un masque multicouche et dispositifs obtenus par ce procede
NL187328C (nl) * 1980-12-23 1991-08-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting.
DE3133468A1 (de) * 1981-08-25 1983-03-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen in siliziumgate-technologie
US4411058A (en) * 1981-08-31 1983-10-25 Hughes Aircraft Company Process for fabricating CMOS devices with self-aligned channel stops
DE3205858A1 (de) * 1982-02-18 1983-08-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von dynamischen halbleiter-speicherzellen mit wahlfreiem zugriff (ram) nach der doppel-polysilizium-gate-technologie
US4716451A (en) * 1982-12-10 1987-12-29 Rca Corporation Semiconductor device with internal gettering region
DE3314450A1 (de) * 1983-04-21 1984-10-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen
WO1985000694A1 (en) * 1983-07-25 1985-02-14 American Telephone & Telegraph Company Shallow-junction semiconductor devices
US4535532A (en) * 1984-04-09 1985-08-20 At&T Bell Laboratories Integrated circuit contact technique
US4554726A (en) * 1984-04-17 1985-11-26 At&T Bell Laboratories CMOS Integrated circuit technology utilizing dual implantation of slow and fast diffusing donor ions to form the n-well
US4646425A (en) * 1984-12-10 1987-03-03 Solid State Scientific, Inc. Method for making a self-aligned CMOS EPROM wherein the EPROM floating gate and CMOS gates are made from one polysilicon layer

Also Published As

Publication number Publication date
US4732869A (en) 1988-03-22
EP0209939A1 (en) 1987-01-28
EP0209939B1 (en) 1990-05-16
JPH0793409B2 (ja) 1995-10-09
JPS6214459A (ja) 1987-01-23
CA1330648C (en) 1994-07-12
DE3671324D1 (de) 1990-06-21

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