NL8204403A - Werkwijze voor het met behulp van plasma neerslaan van silicium. - Google Patents

Werkwijze voor het met behulp van plasma neerslaan van silicium. Download PDF

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Publication number
NL8204403A
NL8204403A NL8204403A NL8204403A NL8204403A NL 8204403 A NL8204403 A NL 8204403A NL 8204403 A NL8204403 A NL 8204403A NL 8204403 A NL8204403 A NL 8204403A NL 8204403 A NL8204403 A NL 8204403A
Authority
NL
Netherlands
Prior art keywords
plasma
silicon
precipitation
vapor
gaseous substance
Prior art date
Application number
NL8204403A
Other languages
English (en)
Dutch (nl)
Original Assignee
Advanced Semiconductor Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Mat filed Critical Advanced Semiconductor Mat
Publication of NL8204403A publication Critical patent/NL8204403A/nl

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
NL8204403A 1981-11-12 1982-11-12 Werkwijze voor het met behulp van plasma neerslaan van silicium. NL8204403A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/320,451 US4401687A (en) 1981-11-12 1981-11-12 Plasma deposition of silicon
US32045181 1981-11-12

Publications (1)

Publication Number Publication Date
NL8204403A true NL8204403A (nl) 1983-06-01

Family

ID=23246492

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8204403A NL8204403A (nl) 1981-11-12 1982-11-12 Werkwijze voor het met behulp van plasma neerslaan van silicium.

Country Status (6)

Country Link
US (1) US4401687A (de)
JP (1) JPS5884111A (de)
DE (1) DE3235503C2 (de)
FR (1) FR2516097B1 (de)
GB (1) GB2109414B (de)
NL (1) NL8204403A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106572A (ja) * 1982-12-06 1984-06-20 信越化学工業株式会社 炭素繊維の表面処理方法
JPS60200523A (ja) * 1984-03-26 1985-10-11 Agency Of Ind Science & Technol シリコン薄膜の製造法
US4681653A (en) * 1984-06-01 1987-07-21 Texas Instruments Incorporated Planarized dielectric deposited using plasma enhanced chemical vapor deposition
DE3514094A1 (de) * 1985-04-16 1986-10-23 Schering AG, Berlin und Bergkamen, 1000 Berlin Herstellung metallischer strukturen auf anorganischen nichtleitern
EP0241317B1 (de) * 1986-04-11 1993-03-10 Canon Kabushiki Kaisha Herstellungsverfahren einer niedergeschlagenen Schicht
JPS6347920A (ja) * 1986-08-18 1988-02-29 Hitachi Ltd 結晶性半導体装置の製造方法
US4910163A (en) * 1988-06-09 1990-03-20 University Of Connecticut Method for low temperature growth of silicon epitaxial layers using chemical vapor deposition system
KR100210261B1 (ko) * 1997-03-13 1999-07-15 이서봉 발열반응을 이용한 다결정 실리콘의 제조 방법
JP2002525841A (ja) * 1998-09-16 2002-08-13 トーレックス・イクイップメント・コーポレーション 低圧における高速シリコン堆積法
US7115489B2 (en) * 2004-07-16 2006-10-03 Micron Technology, Inc. Methods of growing epitaxial silicon
US8133801B1 (en) 2005-07-27 2012-03-13 Spansion Llc Method for forming a semiconducting layer with improved gap filling properties

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE561214A (de) * 1956-10-01
US3900597A (en) * 1973-12-19 1975-08-19 Motorola Inc System and process for deposition of polycrystalline silicon with silane in vacuum
US4196438A (en) * 1976-09-29 1980-04-01 Rca Corporation Article and device having an amorphous silicon containing a halogen and method of fabrication
US4226898A (en) * 1978-03-16 1980-10-07 Energy Conversion Devices, Inc. Amorphous semiconductors equivalent to crystalline semiconductors produced by a glow discharge process
US4223048A (en) * 1978-08-07 1980-09-16 Pacific Western Systems Plasma enhanced chemical vapor processing of semiconductive wafers
DE2904171A1 (de) * 1979-02-05 1980-08-14 Siemens Ag Verfahren zum herstellen von aus amorphem silizium bestehenden halbleiterkoerpern durch glimmentladung
FR2453182A1 (fr) * 1979-04-03 1980-10-31 Arkodex Laboratoires Procede de preparation d'un acide ursodesoxycholique de grande purete

Also Published As

Publication number Publication date
GB2109414B (en) 1986-04-09
FR2516097B1 (fr) 1987-04-24
DE3235503C2 (de) 1986-09-18
FR2516097A1 (fr) 1983-05-13
JPS621565B2 (de) 1987-01-14
JPS5884111A (ja) 1983-05-20
GB2109414A (en) 1983-06-02
US4401687A (en) 1983-08-30
DE3235503A1 (de) 1983-05-19

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
A85 Still pending on 85-01-01
BC A request for examination has been filed
BV The patent application has lapsed