NL8001999A - Bad voor het platteren met zilver en een legering van goud en zilver en een werkwijze voor het platteren daarmede. - Google Patents

Bad voor het platteren met zilver en een legering van goud en zilver en een werkwijze voor het platteren daarmede. Download PDF

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Publication number
NL8001999A
NL8001999A NL8001999A NL8001999A NL8001999A NL 8001999 A NL8001999 A NL 8001999A NL 8001999 A NL8001999 A NL 8001999A NL 8001999 A NL8001999 A NL 8001999A NL 8001999 A NL8001999 A NL 8001999A
Authority
NL
Netherlands
Prior art keywords
bath
silver
water
cyanide
potassium
Prior art date
Application number
NL8001999A
Other languages
English (en)
Dutch (nl)
Original Assignee
Engelhard Min & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Min & Chem filed Critical Engelhard Min & Chem
Publication of NL8001999A publication Critical patent/NL8001999A/nl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/64Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL8001999A 1979-04-04 1980-04-03 Bad voor het platteren met zilver en een legering van goud en zilver en een werkwijze voor het platteren daarmede. NL8001999A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2717779A 1979-04-04 1979-04-04
US2717779 1979-04-04

Publications (1)

Publication Number Publication Date
NL8001999A true NL8001999A (nl) 1980-10-07

Family

ID=21836140

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8001999A NL8001999A (nl) 1979-04-04 1980-04-03 Bad voor het platteren met zilver en een legering van goud en zilver en een werkwijze voor het platteren daarmede.

Country Status (11)

Country Link
JP (1) JPS55134191A (da)
AR (1) AR225759A1 (da)
AU (1) AU5717880A (da)
BR (1) BR8001854A (da)
DE (1) DE3013191A1 (da)
DK (1) DK146980A (da)
FR (1) FR2453226A1 (da)
GB (1) GB2046794A (da)
IT (1) IT1127414B (da)
NL (1) NL8001999A (da)
SE (1) SE8002598L (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609309A1 (de) * 1986-03-20 1987-09-24 Duerrwaechter E Dr Doduco Bad zum elektrolytischen abscheiden von silber-palladium-legierungen
JPH051393A (ja) * 1990-07-19 1993-01-08 Electroplating Eng Of Japan Co 銀銅合金メツキ浴及び銀銅合金ロウ材
EP0666342B1 (de) * 1994-02-05 1998-05-06 W.C. Heraeus GmbH Bad zum galvanischen Abscheiden von Silber-Zinn-Legierungen
DE4406419C1 (de) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen
JP2000212763A (ja) * 1999-01-19 2000-08-02 Shipley Far East Ltd 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法
JP4919430B2 (ja) * 1999-12-02 2012-04-18 株式会社日本キャリア工業 食肉の細断装置
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
CN102560571B (zh) * 2012-02-22 2015-08-05 江苏大学 无氰镀银稳定电镀液、制备方法及其镀银的方法
CN103741178B (zh) * 2014-01-20 2017-06-16 厦门大学 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
JP7353249B2 (ja) * 2020-08-19 2023-09-29 Eeja株式会社 シアン系電解銀合金めっき液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2410441C2 (de) * 1974-03-01 1982-11-11 Schering Ag, 1000 Berlin Und 4619 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Silber
JPS52105540A (en) * 1976-03-01 1977-09-05 Tech Inc Silver bath for lusterous plating of nonncyanide
US4088549A (en) * 1976-04-13 1978-05-09 Oxy Metal Industries Corporation Bright low karat silver gold electroplating
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method

Also Published As

Publication number Publication date
AU5717880A (en) 1980-10-09
JPS55134191A (en) 1980-10-18
IT1127414B (it) 1986-05-21
BR8001854A (pt) 1980-11-18
SE8002598L (sv) 1980-10-05
FR2453226A1 (fr) 1980-10-31
DK146980A (da) 1980-10-05
IT8048317A0 (it) 1980-04-02
GB2046794A (en) 1980-11-19
DE3013191A1 (de) 1980-10-23
AR225759A1 (es) 1982-04-30

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Legal Events

Date Code Title Description
DNT Communications of changes of names of applicants whose applications have been laid open to public inspection

Free format text: PHIBRO CORPORATION

CNR Transfer of rights (patent application after its laying open for public inspection)

Free format text: ENGELHARD CORPORATION

BV The patent application has lapsed