IT1127414B - Procedimento per stabilizzare un bagno acquoso per elettrodeposizione e bagno cosi' ottenuto - Google Patents

Procedimento per stabilizzare un bagno acquoso per elettrodeposizione e bagno cosi' ottenuto

Info

Publication number
IT1127414B
IT1127414B IT48317/80A IT4831780A IT1127414B IT 1127414 B IT1127414 B IT 1127414B IT 48317/80 A IT48317/80 A IT 48317/80A IT 4831780 A IT4831780 A IT 4831780A IT 1127414 B IT1127414 B IT 1127414B
Authority
IT
Italy
Prior art keywords
bath
electrodeposition
stabilize
procedure
water bath
Prior art date
Application number
IT48317/80A
Other languages
English (en)
Italian (it)
Other versions
IT8048317A0 (it
Inventor
Kenneth D Baker
Original Assignee
Engelhard Min & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Min & Chem filed Critical Engelhard Min & Chem
Publication of IT8048317A0 publication Critical patent/IT8048317A0/it
Application granted granted Critical
Publication of IT1127414B publication Critical patent/IT1127414B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IT48317/80A 1979-04-04 1980-04-02 Procedimento per stabilizzare un bagno acquoso per elettrodeposizione e bagno cosi' ottenuto IT1127414B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2717779A 1979-04-04 1979-04-04

Publications (2)

Publication Number Publication Date
IT8048317A0 IT8048317A0 (it) 1980-04-02
IT1127414B true IT1127414B (it) 1986-05-21

Family

ID=21836140

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48317/80A IT1127414B (it) 1979-04-04 1980-04-02 Procedimento per stabilizzare un bagno acquoso per elettrodeposizione e bagno cosi' ottenuto

Country Status (11)

Country Link
JP (1) JPS55134191A (da)
AR (1) AR225759A1 (da)
AU (1) AU5717880A (da)
BR (1) BR8001854A (da)
DE (1) DE3013191A1 (da)
DK (1) DK146980A (da)
FR (1) FR2453226A1 (da)
GB (1) GB2046794A (da)
IT (1) IT1127414B (da)
NL (1) NL8001999A (da)
SE (1) SE8002598L (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609309A1 (de) * 1986-03-20 1987-09-24 Duerrwaechter E Dr Doduco Bad zum elektrolytischen abscheiden von silber-palladium-legierungen
JPH051393A (ja) * 1990-07-19 1993-01-08 Electroplating Eng Of Japan Co 銀銅合金メツキ浴及び銀銅合金ロウ材
ES2117995T3 (es) * 1994-02-05 1998-09-01 Heraeus Gmbh W C Baño para deposito galvanico de aleaciones de plata-estaño.
DE4406419C1 (de) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen
JP2000212763A (ja) * 1999-01-19 2000-08-02 Shipley Far East Ltd 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法
JP4919430B2 (ja) * 1999-12-02 2012-04-18 株式会社日本キャリア工業 食肉の細断装置
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
CN102560571B (zh) * 2012-02-22 2015-08-05 江苏大学 无氰镀银稳定电镀液、制备方法及其镀银的方法
CN103741178B (zh) * 2014-01-20 2017-06-16 厦门大学 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
JP7353249B2 (ja) * 2020-08-19 2023-09-29 Ｅｅｊａ株式会社 シアン系電解銀合金めっき液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2410441C2 (de) * 1974-03-01 1982-11-11 Schering Ag, 1000 Berlin Und 4619 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Silber
JPS52105540A (en) * 1976-03-01 1977-09-05 Tech Inc Silver bath for lusterous plating of nonncyanide
US4088549A (en) * 1976-04-13 1978-05-09 Oxy Metal Industries Corporation Bright low karat silver gold electroplating
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method

Also Published As

Publication number Publication date
AR225759A1 (es) 1982-04-30
DE3013191A1 (de) 1980-10-23
NL8001999A (nl) 1980-10-07
BR8001854A (pt) 1980-11-18
DK146980A (da) 1980-10-05
AU5717880A (en) 1980-10-09
JPS55134191A (en) 1980-10-18
FR2453226A1 (fr) 1980-10-31
GB2046794A (en) 1980-11-19
SE8002598L (sv) 1980-10-05
IT8048317A0 (it) 1980-04-02

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