NL8001776A - Soldeerpreparaat, werkwijze voor het solderen, alsmede voortbrengsels verkregen met toepassing van het soldeerpreparaat. - Google Patents
Soldeerpreparaat, werkwijze voor het solderen, alsmede voortbrengsels verkregen met toepassing van het soldeerpreparaat. Download PDFInfo
- Publication number
- NL8001776A NL8001776A NL8001776A NL8001776A NL8001776A NL 8001776 A NL8001776 A NL 8001776A NL 8001776 A NL8001776 A NL 8001776A NL 8001776 A NL8001776 A NL 8001776A NL 8001776 A NL8001776 A NL 8001776A
- Authority
- NL
- Netherlands
- Prior art keywords
- present
- amount
- copper
- tin
- zinc
- Prior art date
Links
- 238000002360 preparation method Methods 0.000 title claims description 21
- 238000005476 soldering Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
- 229910052802 copper Inorganic materials 0.000 claims description 47
- 239000010949 copper Substances 0.000 claims description 47
- 229910052725 zinc Inorganic materials 0.000 claims description 46
- 239000011701 zinc Substances 0.000 claims description 46
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 45
- 239000000203 mixture Substances 0.000 claims description 34
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 239000011135 tin Substances 0.000 claims description 30
- 229910052718 tin Inorganic materials 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 22
- 229910052804 chromium Inorganic materials 0.000 claims description 22
- 239000011651 chromium Substances 0.000 claims description 22
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 21
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 20
- 239000010936 titanium Substances 0.000 claims description 20
- 229910052719 titanium Inorganic materials 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000005304 joining Methods 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 238000005219 brazing Methods 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 239000010419 fine particle Substances 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 21
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 7
- 230000006698 induction Effects 0.000 description 6
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 5
- 239000012300 argon atmosphere Substances 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 5
- 239000011572 manganese Substances 0.000 description 5
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 5
- 229910052793 cadmium Inorganic materials 0.000 description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910007610 Zn—Sn Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000010310 metallurgical process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2400179A | 1979-03-26 | 1979-03-26 | |
US2400179 | 1979-03-26 | ||
US9795079A | 1979-11-28 | 1979-11-28 | |
US9795079 | 1979-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL8001776A true NL8001776A (nl) | 1980-09-30 |
Family
ID=26697899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8001776A NL8001776A (nl) | 1979-03-26 | 1980-03-26 | Soldeerpreparaat, werkwijze voor het solderen, alsmede voortbrengsels verkregen met toepassing van het soldeerpreparaat. |
Country Status (4)
Country | Link |
---|---|
CA (1) | CA1165647A (it) |
GB (1) | GB2047740B (it) |
IT (1) | IT1194623B (it) |
NL (1) | NL8001776A (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000326088A (ja) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
WO2013111143A1 (en) * | 2012-01-24 | 2013-08-01 | G D Abdhool Rahim | Alloy containing precious metals and its method of preparation by using herbal extracts |
-
1980
- 1980-03-10 CA CA000347351A patent/CA1165647A/en not_active Expired
- 1980-03-10 GB GB8008002A patent/GB2047740B/en not_active Expired
- 1980-03-17 IT IT20710/80A patent/IT1194623B/it active
- 1980-03-26 NL NL8001776A patent/NL8001776A/nl not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
IT8020710A0 (it) | 1980-03-17 |
CA1165647A (en) | 1984-04-17 |
GB2047740B (en) | 1983-03-16 |
IT1194623B (it) | 1988-09-22 |
GB2047740A (en) | 1980-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4451541A (en) | Soldering composition and method of use | |
CN100534699C (zh) | 无铅焊料合金 | |
KR101339025B1 (ko) | 솔더 합금 | |
US4525434A (en) | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy | |
CN101380700B (zh) | 一种锡铋铜系无铅焊料及其制备方法 | |
US6156132A (en) | Solder alloys | |
JP2001504760A (ja) | 鉛を含まないはんだ | |
US20070172381A1 (en) | Lead-free solder with low copper dissolution | |
JP2008521619A (ja) | はんだ合金 | |
JPH06344181A (ja) | 改良された力学的性質を持つPbを含まない半田 | |
WO2007081775A2 (en) | Lead-free solder with low copper dissolution | |
JPH09155586A (ja) | 無鉛はんだ合金 | |
CN100467192C (zh) | 基本上包括锡(Sn)、银(Ag)、铜(Cu)和磷(P)的无Pb焊料合金组合物 | |
EP1707302B1 (en) | Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P) | |
CN1203960C (zh) | 具有抗氧化能力的无铅焊料 | |
GB2431412A (en) | Lead-free solder alloy | |
WO1999004048A1 (en) | Tin-bismuth based lead-free solders | |
CN103934590A (zh) | 一种ZnAlMgIn高温无铅钎料 | |
CA2540486A1 (en) | Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), nickel (ni), phosphorus (p) and/or rare earth: cerium (ce) or lanthanum (la) | |
NL8001776A (nl) | Soldeerpreparaat, werkwijze voor het solderen, alsmede voortbrengsels verkregen met toepassing van het soldeerpreparaat. | |
WO2007014530A1 (fr) | Alliage de brasage sans plomb contenant un systeme sn-ag-cu-ni-al | |
JP2001287082A (ja) | はんだ合金 | |
JP3346848B2 (ja) | 無鉛はんだ合金 | |
CN1281372C (zh) | SnZn系无铅钎料 | |
JP2681742B2 (ja) | 無鉛はんだ合金 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1A | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BV | The patent application has lapsed |