CA1165647A - Soldering composition - Google Patents
Soldering compositionInfo
- Publication number
- CA1165647A CA1165647A CA000347351A CA347351A CA1165647A CA 1165647 A CA1165647 A CA 1165647A CA 000347351 A CA000347351 A CA 000347351A CA 347351 A CA347351 A CA 347351A CA 1165647 A CA1165647 A CA 1165647A
- Authority
- CA
- Canada
- Prior art keywords
- present
- amount
- copper
- tin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Abstract of the Disclosure A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin, preferably minor amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The composition is particularly useful for joining copper and copper alloys because it will wet and readily flow on the copper or copper alloy surfaces. It also has reduced dissolving action on the copper and copper alloys due to its reduced reactivity with them. It also has improved conductivity vis-a-vis conventional lead-tin and lead-tin-silver solders.
Description
Back~round of the Invention Field of the Invention Traditionally, copper and copper allo~s have been soldered or joined with lead-tin or lead tin~silver solders.
The high cost and density of these types o solders - which - are used extensively in automobile and truck radia~ors -~ has to some extent-limited their use and has encouraged the search for suitable alternatives. A further drawback is,theix limited mechanical strength.which decreases as the temperatur~
... . .
rises.
An object of this invention is to provide an alternative to these conventional solders wh~ch is highly effective in joining copper and copper alloys, which is reasonable in cost and which maintains its strength over,a wide range of - t~mperatures. Additionally, the compositions provided by this invention readily wet and flow over copper and copper alloy surfaces during the jo.ining operakion and have reduced dissolving activity or reactivity -- ~is-a-vis conventional.
zinc alloys.
Description of Pxior Art High zinc content metallic rods for welding brass and similar allo~s have been previously disclosed. For example, U. S. P~tent No. 2,114,781 relates to metallic rods used for the welding of brass and similar alloys which have a high percentage of zinc and a comparatively low melting - point. Typical of the welding rods disclosed in that paten-t is one having the following composition:
ComponentPercent . Zinc' 54.2 ' Copper 41.0 Nickel & Cobalt 4.5 Silicon 0~3 ~,, 2 b ~,~
A somewhat related composition useful for solderiny and brazing cast iron is disclosed in U. S. Patent ~lo. 3,516,g25 wherein a solder consisting of 48-50% cvpper, 0 8~1.0% tin, 9.5-10~5% manganese, 3.5-4~S% nicke~, 0.15-0.25~ alumînum, and the remainder zinc is se~ out. This paten~ also discloses a prior art composition comprised of 38-50% zinc, 1% îron, 1% tin, 0.5% manganese, and the balance copper.
- U. S. Patent No. 3,684,946 discl~ses a soft solder having impro~ed strength at elevated temperatures. The solder consists of 0.5-7% silver, 0.5-2.5% copper, 0.05-2%
chromium! and~or 0.05-1% nickel, preferabl~ 0.1-2% aluminum and 0.01-0.3% magnesium and the balance zinc.
U. S. Patent No. 2,167,~78 discloses a metal allo~
intended for use as a solder consisting of the following materials.
Component Percent Zinc 42.0 Lead 23.0 Tin 22.0 Bismuth 10.0 Cadmi~m 2.95 Silver 0.05 U. S. Patent No. 3,591,368 discloses a copper based allo~ useful at high temperatures and comprised of 38 43gO
zinc, 5-15~ nickel, 0.1-1.0% chromium, 0.3% or less titanium, 0-0.5% silicon, 0% to not more than 0.5% lead, and the balance copper.
U. S. Patent No. 2,837,4~7 discloses a speci~ic composition for use in making jewelry comprising 70% zinc, 10~ tin and 20~ lead.
U. S. Patent No. 1,333,237 discloses a soldering substance composed essentiall~ of zinc, tin and lead in the following proportions:
'`~7 ' ' s~
Percent æ inc From 20 to 70 Tin From 15 to 60 Lead From 10 to 50 This composition.described as a "soldering suhstance" is described as useful for soldering aluminum.
U. S. Patent No. 2,254~5g8 discloses alloys capable of being hot pressed or extruded and valuable fox the fabrication of valve bodies, gears, pinions, spuds and other parts which are."at present" made from hot pressed brass.
.
The alloys are described as falling within the general range of about 2-to about 15% copper, about 50 to about 75~ zinc, and the balance substantially manganese, in each case, however, the manganese being present in amounts at least equal to, and.preferabl~ substantially greaker than, the copper. Small proportions, for example, up to about 5~ of other alloying constituents such as lead or tin can also be utilize~ in compositions of this alloy where "special.
characteristics are desired, such as incxeased machinability or frictional resistance, but, in yeneral, the alloys contain substantially only copper, ~inc and manganese, such other elements as are present being intxoduced onl~ as impurities".
~Page.l, col. 1, lines 35-53).
U. S. Patent No. 2,360,784 disclosed metal coating compositions for producing "galvanized" coatings on a ferrous metal baseO The compositions disclosed are alloys containing minor amounts of copper and titanium with the balance being æinc. According to the patent, these ~aterials were developed to provide an alternative to what was apparentl~ at the timeS
the general practice of hot dip zinc coating where metallic tin had been used in the molten coating bath. The sc~rcity of tin ~ 4 is the stated reason or de~eloping alterna~.ive products for carrying out this galvanizing process.
U. S~ Patent No. 3,527,601 discloses a zinc-base alloy article in which at least one additive metal from a list set forth a-t column 2, lines 39-53 o~ "operable additive metals"
is included. The additive metals disclosed include 1.5 to 5.0% copper, 0.005 to 1.0% chromium, and O.Ul to 1.0% titanium.
U. S. Patent No. 2,472,402 discloses zinc base alloys containing from 0.5 to 1.5~ copper r from 0.12 to 0.5% titanium and ~he balance zinc. Commercial roll zinc is also described as useful. Accoraing to the patent, commercial roll zinc may contain, for example, 0.10~ lead, 0.012% iron and O.O05 cadmium.
~ n article by A. Passerone titled "Interfacial Tensions in Znr Zn-Sn and Zn-Sn-Pb Systems" appearing in the.Journal of the Less Common Metals, 52 (1977) 37-4g appears to disclose .
alloys containing 7% tin r 7 % lead, and ~he balance zinc The reference discusses the interfacial tension of alloys subjected to metallurgical processes.
Summary of the Invention The subject invention is directed to a ~inc-based composition comprised o~ from 0 to abou-t 3% chxomiumr 0 to about 3~ titanium, 0 to about 5% nickel, 0 to about 3%
copperr about 0.01 to about 5% lead, about 0.01 to 20~ tin, and the balance zinc. The compositions of the sub~ect invention are particularly useful for soldering or joining copper or copper allo~ surfaces,.such as those used in automobile and truck radiators. They also fi.nd use in joining copper or copper alloy surfaces în electrical motors and generators and in electronic modules such ~5 p~intea ci~cuiks.
The zinc-based compositions of the subject invention ~re substantially more economical than the conventional le~d-tin and lead-t.in-silver solders, have good wetting and spreadin~
- characteristics on the copper or copper alloy surfaces, relatively low dissolving acti~i~y or reactivity with the copper or copper alloy interfaces being ~oined and improved conauctivity with concomitant improved characteristics in electrical circuitry.
; , The subject invention is also directed to a process for utilizing the above-described composition to join copper and copper based alloys and to the article of manufacture resulting from the joining of a plurality of copper or copper alloy surfaces ~ith the subject,soldering composition. ln joining or soldering copper and copper'alioy surfaces, ~he compositions of this invention m _ be used with conventional or specifically developed fluxes. It is also, of course, possible to use the compositions of the subject in~ention as a surfacing alloy, i.e., a single coppex or copper alloy surface may be bonded to the zinc-based composition of this invention.
Description of the Preferred Embodiments The compositions of the subject invention as outlined above have paxticular use in the joining or sol,dering of copper or copper alloy struckures, e.g., radiators; in joinin~
copper or copper alloy,surfaces in electrical motors and generators; and in electronic modules such as printed circuits~
$
~ç;t~
The æinc-based compositions of the subject inven-tion have as basic components lead, tin and a major proportion o~
zinc. Additionally, the compositions of the subject invention preferably also contain chromium and/or titanium and/or nickel which enhance the properties of the subject compositions as outlined above, particularly in reducing the reactivity of the compositions with the copper or copper alloy interfaces. A
minor amount of copper may also be present to assist in reducing the reacti~ity of the composition with the copper or copper L0 alloy interfaces. Ranges on the materials useful in the new soldering co~.positions of the subject invention are as follows:
0-3.0% Chromium 0-3.0% Copper 0.01-5% Lead 0-5.0~ Nickel 0O01-20~ Tin 0-3.0% ' Titanium Balance Zinc Chromium, when present, is pre'ferably present in an amount from about 0.3 to about 1% and most preferably about 0.5%; titanium, when present, i5 preferably present in an amount from about 0.3 to about'1% and most preferably about 0.5%; nickel, when present, '' is preferably present in an amount of from about 0.3 to about 1%
and most preferably about 0.5%; preferably, the lead.is present in an amount of from about 0.1 to about 3~ and most.preferably ahout 1%; preferably, the tin is present in an amount of fxom 0.1 to about 15%, more preferably from about 5 to about 10%.
Copper, when present, is preferably present in an amount of from about Ool to about 3%, more preferably about 1~.
All percentages used herein are weight percentages.
All parts are by weight and based on 100 total parts of the final composition.
The compositions of the subject invention should not contain manganese in more than very minor amounts, preferably no moxe than ~race amounts. Manganese, if prese~t in a significant amount, i.e., 1% or more, detracts from the desirable characteristics of the compositions of the subject invention by reducing oxidation resiskance and wetting properties of the alloys. Small amounts of manganese will not detract from the perfoxmance of the compositions of this invention. To the extent that any of the metals used in preparing the compositions of this invention-contain minor amounts of manganese, this is not deleterious provided that the total amount of manganese is less than l~.
The compositions of this invention sh3uld not contain cadmium, indeed any present as even trace impurities should preferably be eliminated, to the extent feasible, because of the strongly toxic nature of this metal~ `
The fluxes used with the compositions o the subject invention typically wlll contain a halide, e.g~, a bromide or a chloride as an acid or a salt. Iron, silver or tin may also be present in the flux ei-ther as fine paxtlcles o~ the elemental metal or as s~luble salts such as the chlorides, nitrates, bromides, etc.
The compositions of the subject invention can be prepared by a straightforward meltiny operation. Preferably, induction melting is used because it pro~ides improved mixing.
The melting operation is also preferably carried out under an inert atmosphere, e.g., a nitrogen or argon blanket, to avoid oxidatlon of the component metals, particularly titanium.
A nominal temperature in the range of from about B50~ to 900~F
is typically reached during the meltiny operation.
The following examples are illustrative of the present invention and are not intended as a limita-tion upon the scope thereof. While the invention is susceptiblo oE variou~
modifications and alternative forms, specific ernbodiments ` thereof will hereinaftex be described in detail. It should be understood that it is not intended to limit the invention to the particular forms aisclosed, but, on the contrary, ~he invention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the invention as expressed in the appended claims~ For example, commercial grade metals may for certain uses, e.g. t joining radiator parts, be perfectly satisfactory. However, for applications where high and uniform conductivity is important, it may be necessary to utilize more highly refined and purified metals in preparing the compositions of the subject invention.
It should also be noted that an additional advantage of the compositions of this invention is that they are compatible with and pxoduce strong joints wi~h conventîonal lead-tin or lead-tin-silver solders. Additional~y, it is possible to incorporate certain metal componen-ts, e.g., iron, silver and/or tin, into the flwx to provide additional enhance~ent of the wetting characteristics of the compositions of this inventîon.
EXAMPLES
Example 1 A zinc-based alloy useful as a solder for joining or soldering copper or copper alloys is prepared as ollows:
0.5 parts chromium, a. s parts titanium, 1 part lead, 5 parts tin and 93 parts zinc are placed in a vessel in an induction furnace under an argon blanket and heated to about ~00F. The resultin~ composition ~a~ a tensile strength of 11,000 pounds per square inch and a melting temperature of 745~F. When used as a solder with an appropriate flux to joi.n copper alloy sur~aces, a high streng-th bond was formed.
Example 2 A zinc-based alloy useful as a solder for ~oininy or soldering copper or copper alloys is prepared as follows:
.
0.5 parts chromium, 0.5 parts titanium, 1 part lead, 9 parts tin and 89 parts zinc are placed . in a vessel in an induction furnace under an argGn blanket and heated to about 900F. The resulting composition has a tensile strength of 12,000 pounds per sguare inch and a melting temperature of ~45F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond was formed.
Example 3 A zinc-based alloy useful as a solder for joi.ning or soldering copper or copper alloys is prepared as ~ollows:
0.5 parts chromium, 0.5 parts titanium r 1 part lead, 15 parts tin and 83 parts zinc are placed in a vessel in an induction furnace under an argon blanket and heated to about 900F. The resultiny composition has a tensile strength of 14,000 pounds per sguare inch and a meltin~ temperature of 735F.
When used as a solder with an appropriate flux to join copper alloy suxfaces, a hiyh strenyth bond was formed.
Examp]e 4 A zinc-based alloy useful as a solder for joining or soldering copper or copper allo~s is prepared as follows:
1 part chromium, 1 part copper, 9 parts tin, 1 part lead and 88 parts zinc are placed in a vessel in an induction furnace under an argon hlanket and heated to abou~ 900F.
The resulting composition has a tensile strength of 14,000 pounds per square inch and a melting temperature of 745F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond was foxmed.
Example 5 A zinc-base~ alloy useful as a solder or joining or soldering copper or copper alloys is prepared as follows:
0.5 parts chromi.um, O~S parts nickel, 1 part lead, 9 par~s tin ancl 8~ parts zinc are placed in a vessel in an induction furnace under an argon blanket and heated to about 900F. q'he resulting composition has a -tensile strength of 12,000 pounds per square inch and a melting temperature of 730F.
When used as a solder with an appropriate flux to join copper alloy suraces, a high strength bond was formed.
. .'~. 11 -` ,..'l '
The high cost and density of these types o solders - which - are used extensively in automobile and truck radia~ors -~ has to some extent-limited their use and has encouraged the search for suitable alternatives. A further drawback is,theix limited mechanical strength.which decreases as the temperatur~
... . .
rises.
An object of this invention is to provide an alternative to these conventional solders wh~ch is highly effective in joining copper and copper alloys, which is reasonable in cost and which maintains its strength over,a wide range of - t~mperatures. Additionally, the compositions provided by this invention readily wet and flow over copper and copper alloy surfaces during the jo.ining operakion and have reduced dissolving activity or reactivity -- ~is-a-vis conventional.
zinc alloys.
Description of Pxior Art High zinc content metallic rods for welding brass and similar allo~s have been previously disclosed. For example, U. S. P~tent No. 2,114,781 relates to metallic rods used for the welding of brass and similar alloys which have a high percentage of zinc and a comparatively low melting - point. Typical of the welding rods disclosed in that paten-t is one having the following composition:
ComponentPercent . Zinc' 54.2 ' Copper 41.0 Nickel & Cobalt 4.5 Silicon 0~3 ~,, 2 b ~,~
A somewhat related composition useful for solderiny and brazing cast iron is disclosed in U. S. Patent ~lo. 3,516,g25 wherein a solder consisting of 48-50% cvpper, 0 8~1.0% tin, 9.5-10~5% manganese, 3.5-4~S% nicke~, 0.15-0.25~ alumînum, and the remainder zinc is se~ out. This paten~ also discloses a prior art composition comprised of 38-50% zinc, 1% îron, 1% tin, 0.5% manganese, and the balance copper.
- U. S. Patent No. 3,684,946 discl~ses a soft solder having impro~ed strength at elevated temperatures. The solder consists of 0.5-7% silver, 0.5-2.5% copper, 0.05-2%
chromium! and~or 0.05-1% nickel, preferabl~ 0.1-2% aluminum and 0.01-0.3% magnesium and the balance zinc.
U. S. Patent No. 2,167,~78 discloses a metal allo~
intended for use as a solder consisting of the following materials.
Component Percent Zinc 42.0 Lead 23.0 Tin 22.0 Bismuth 10.0 Cadmi~m 2.95 Silver 0.05 U. S. Patent No. 3,591,368 discloses a copper based allo~ useful at high temperatures and comprised of 38 43gO
zinc, 5-15~ nickel, 0.1-1.0% chromium, 0.3% or less titanium, 0-0.5% silicon, 0% to not more than 0.5% lead, and the balance copper.
U. S. Patent No. 2,837,4~7 discloses a speci~ic composition for use in making jewelry comprising 70% zinc, 10~ tin and 20~ lead.
U. S. Patent No. 1,333,237 discloses a soldering substance composed essentiall~ of zinc, tin and lead in the following proportions:
'`~7 ' ' s~
Percent æ inc From 20 to 70 Tin From 15 to 60 Lead From 10 to 50 This composition.described as a "soldering suhstance" is described as useful for soldering aluminum.
U. S. Patent No. 2,254~5g8 discloses alloys capable of being hot pressed or extruded and valuable fox the fabrication of valve bodies, gears, pinions, spuds and other parts which are."at present" made from hot pressed brass.
.
The alloys are described as falling within the general range of about 2-to about 15% copper, about 50 to about 75~ zinc, and the balance substantially manganese, in each case, however, the manganese being present in amounts at least equal to, and.preferabl~ substantially greaker than, the copper. Small proportions, for example, up to about 5~ of other alloying constituents such as lead or tin can also be utilize~ in compositions of this alloy where "special.
characteristics are desired, such as incxeased machinability or frictional resistance, but, in yeneral, the alloys contain substantially only copper, ~inc and manganese, such other elements as are present being intxoduced onl~ as impurities".
~Page.l, col. 1, lines 35-53).
U. S. Patent No. 2,360,784 disclosed metal coating compositions for producing "galvanized" coatings on a ferrous metal baseO The compositions disclosed are alloys containing minor amounts of copper and titanium with the balance being æinc. According to the patent, these ~aterials were developed to provide an alternative to what was apparentl~ at the timeS
the general practice of hot dip zinc coating where metallic tin had been used in the molten coating bath. The sc~rcity of tin ~ 4 is the stated reason or de~eloping alterna~.ive products for carrying out this galvanizing process.
U. S~ Patent No. 3,527,601 discloses a zinc-base alloy article in which at least one additive metal from a list set forth a-t column 2, lines 39-53 o~ "operable additive metals"
is included. The additive metals disclosed include 1.5 to 5.0% copper, 0.005 to 1.0% chromium, and O.Ul to 1.0% titanium.
U. S. Patent No. 2,472,402 discloses zinc base alloys containing from 0.5 to 1.5~ copper r from 0.12 to 0.5% titanium and ~he balance zinc. Commercial roll zinc is also described as useful. Accoraing to the patent, commercial roll zinc may contain, for example, 0.10~ lead, 0.012% iron and O.O05 cadmium.
~ n article by A. Passerone titled "Interfacial Tensions in Znr Zn-Sn and Zn-Sn-Pb Systems" appearing in the.Journal of the Less Common Metals, 52 (1977) 37-4g appears to disclose .
alloys containing 7% tin r 7 % lead, and ~he balance zinc The reference discusses the interfacial tension of alloys subjected to metallurgical processes.
Summary of the Invention The subject invention is directed to a ~inc-based composition comprised o~ from 0 to abou-t 3% chxomiumr 0 to about 3~ titanium, 0 to about 5% nickel, 0 to about 3%
copperr about 0.01 to about 5% lead, about 0.01 to 20~ tin, and the balance zinc. The compositions of the sub~ect invention are particularly useful for soldering or joining copper or copper allo~ surfaces,.such as those used in automobile and truck radiators. They also fi.nd use in joining copper or copper alloy surfaces în electrical motors and generators and in electronic modules such ~5 p~intea ci~cuiks.
The zinc-based compositions of the subject invention ~re substantially more economical than the conventional le~d-tin and lead-t.in-silver solders, have good wetting and spreadin~
- characteristics on the copper or copper alloy surfaces, relatively low dissolving acti~i~y or reactivity with the copper or copper alloy interfaces being ~oined and improved conauctivity with concomitant improved characteristics in electrical circuitry.
; , The subject invention is also directed to a process for utilizing the above-described composition to join copper and copper based alloys and to the article of manufacture resulting from the joining of a plurality of copper or copper alloy surfaces ~ith the subject,soldering composition. ln joining or soldering copper and copper'alioy surfaces, ~he compositions of this invention m _ be used with conventional or specifically developed fluxes. It is also, of course, possible to use the compositions of the subject in~ention as a surfacing alloy, i.e., a single coppex or copper alloy surface may be bonded to the zinc-based composition of this invention.
Description of the Preferred Embodiments The compositions of the subject invention as outlined above have paxticular use in the joining or sol,dering of copper or copper alloy struckures, e.g., radiators; in joinin~
copper or copper alloy,surfaces in electrical motors and generators; and in electronic modules such as printed circuits~
$
~ç;t~
The æinc-based compositions of the subject inven-tion have as basic components lead, tin and a major proportion o~
zinc. Additionally, the compositions of the subject invention preferably also contain chromium and/or titanium and/or nickel which enhance the properties of the subject compositions as outlined above, particularly in reducing the reactivity of the compositions with the copper or copper alloy interfaces. A
minor amount of copper may also be present to assist in reducing the reacti~ity of the composition with the copper or copper L0 alloy interfaces. Ranges on the materials useful in the new soldering co~.positions of the subject invention are as follows:
0-3.0% Chromium 0-3.0% Copper 0.01-5% Lead 0-5.0~ Nickel 0O01-20~ Tin 0-3.0% ' Titanium Balance Zinc Chromium, when present, is pre'ferably present in an amount from about 0.3 to about 1% and most preferably about 0.5%; titanium, when present, i5 preferably present in an amount from about 0.3 to about'1% and most preferably about 0.5%; nickel, when present, '' is preferably present in an amount of from about 0.3 to about 1%
and most preferably about 0.5%; preferably, the lead.is present in an amount of from about 0.1 to about 3~ and most.preferably ahout 1%; preferably, the tin is present in an amount of fxom 0.1 to about 15%, more preferably from about 5 to about 10%.
Copper, when present, is preferably present in an amount of from about Ool to about 3%, more preferably about 1~.
All percentages used herein are weight percentages.
All parts are by weight and based on 100 total parts of the final composition.
The compositions of the subject invention should not contain manganese in more than very minor amounts, preferably no moxe than ~race amounts. Manganese, if prese~t in a significant amount, i.e., 1% or more, detracts from the desirable characteristics of the compositions of the subject invention by reducing oxidation resiskance and wetting properties of the alloys. Small amounts of manganese will not detract from the perfoxmance of the compositions of this invention. To the extent that any of the metals used in preparing the compositions of this invention-contain minor amounts of manganese, this is not deleterious provided that the total amount of manganese is less than l~.
The compositions of this invention sh3uld not contain cadmium, indeed any present as even trace impurities should preferably be eliminated, to the extent feasible, because of the strongly toxic nature of this metal~ `
The fluxes used with the compositions o the subject invention typically wlll contain a halide, e.g~, a bromide or a chloride as an acid or a salt. Iron, silver or tin may also be present in the flux ei-ther as fine paxtlcles o~ the elemental metal or as s~luble salts such as the chlorides, nitrates, bromides, etc.
The compositions of the subject invention can be prepared by a straightforward meltiny operation. Preferably, induction melting is used because it pro~ides improved mixing.
The melting operation is also preferably carried out under an inert atmosphere, e.g., a nitrogen or argon blanket, to avoid oxidatlon of the component metals, particularly titanium.
A nominal temperature in the range of from about B50~ to 900~F
is typically reached during the meltiny operation.
The following examples are illustrative of the present invention and are not intended as a limita-tion upon the scope thereof. While the invention is susceptiblo oE variou~
modifications and alternative forms, specific ernbodiments ` thereof will hereinaftex be described in detail. It should be understood that it is not intended to limit the invention to the particular forms aisclosed, but, on the contrary, ~he invention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the invention as expressed in the appended claims~ For example, commercial grade metals may for certain uses, e.g. t joining radiator parts, be perfectly satisfactory. However, for applications where high and uniform conductivity is important, it may be necessary to utilize more highly refined and purified metals in preparing the compositions of the subject invention.
It should also be noted that an additional advantage of the compositions of this invention is that they are compatible with and pxoduce strong joints wi~h conventîonal lead-tin or lead-tin-silver solders. Additional~y, it is possible to incorporate certain metal componen-ts, e.g., iron, silver and/or tin, into the flwx to provide additional enhance~ent of the wetting characteristics of the compositions of this inventîon.
EXAMPLES
Example 1 A zinc-based alloy useful as a solder for joining or soldering copper or copper alloys is prepared as ollows:
0.5 parts chromium, a. s parts titanium, 1 part lead, 5 parts tin and 93 parts zinc are placed in a vessel in an induction furnace under an argon blanket and heated to about ~00F. The resultin~ composition ~a~ a tensile strength of 11,000 pounds per square inch and a melting temperature of 745~F. When used as a solder with an appropriate flux to joi.n copper alloy sur~aces, a high streng-th bond was formed.
Example 2 A zinc-based alloy useful as a solder for ~oininy or soldering copper or copper alloys is prepared as follows:
.
0.5 parts chromium, 0.5 parts titanium, 1 part lead, 9 parts tin and 89 parts zinc are placed . in a vessel in an induction furnace under an argGn blanket and heated to about 900F. The resulting composition has a tensile strength of 12,000 pounds per sguare inch and a melting temperature of ~45F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond was formed.
Example 3 A zinc-based alloy useful as a solder for joi.ning or soldering copper or copper alloys is prepared as ~ollows:
0.5 parts chromium, 0.5 parts titanium r 1 part lead, 15 parts tin and 83 parts zinc are placed in a vessel in an induction furnace under an argon blanket and heated to about 900F. The resultiny composition has a tensile strength of 14,000 pounds per sguare inch and a meltin~ temperature of 735F.
When used as a solder with an appropriate flux to join copper alloy suxfaces, a hiyh strenyth bond was formed.
Examp]e 4 A zinc-based alloy useful as a solder for joining or soldering copper or copper allo~s is prepared as follows:
1 part chromium, 1 part copper, 9 parts tin, 1 part lead and 88 parts zinc are placed in a vessel in an induction furnace under an argon hlanket and heated to abou~ 900F.
The resulting composition has a tensile strength of 14,000 pounds per square inch and a melting temperature of 745F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond was foxmed.
Example 5 A zinc-base~ alloy useful as a solder or joining or soldering copper or copper alloys is prepared as follows:
0.5 parts chromi.um, O~S parts nickel, 1 part lead, 9 par~s tin ancl 8~ parts zinc are placed in a vessel in an induction furnace under an argon blanket and heated to about 900F. q'he resulting composition has a -tensile strength of 12,000 pounds per square inch and a melting temperature of 730F.
When used as a solder with an appropriate flux to join copper alloy suraces, a high strength bond was formed.
. .'~. 11 -` ,..'l '
Claims (21)
1. A zinc-based composition useful for soldering or joining copper or copper alloy surfaces comprising from 0 to about 3% copper, 0 to about 3.0% chromium, 0 to about 3.0%
titanium, 0 to about 5.0% nickel, about 0.01 to about 5.0%
lead, about 0.01 to about 20% tin, and the balance zinc.
titanium, 0 to about 5.0% nickel, about 0.01 to about 5.0%
lead, about 0.01 to about 20% tin, and the balance zinc.
2. The composition of claim 1 wherein said tin is present in an amount of from about 0.1 to 15%.
3. The composition of claim 1 wherein said lead is present in an amount of from about 0.1 to 3%.
4. The composition of claim 1 wherein said chromium is present in an amount of about 0.5%, said titanium is present in an amount of about 0.5%, said lead is present in an amount of about 1%, and said tin is present in an amount of about 5
5. The composition of claim 1 wherein said chromium is present in an amount of about 0.5%, said titanium is present in an amount of about 0.5%, said lead is present in an amount of about 1%, and said tin is present in an amount to about 9%.
6. The composition of claim 1 wherein said chromium is present in an amount of about 0.5%, said titanium is present in an amount of about 0.5%, said lead is present in an amount of about 1%, and said tin is present in an amount of about 15%.
7. The composition of claim 1 wherein said copper is present in an amount of about 1% said chromium is present in an amount of about 1%, said lead is present in an amount of about 1%, and said tin is present in an amount of about 9%.
8. The composition of claim 1 wherein said chromium is present in the amount of about 0.5%, said nickel is present in an amount of about 0.5%, said lead is present in an amount of about 1%, and said tin is present in an amount of about 9%.
9. The composition of claim 1 wherein said chromium is present in an amount of from about 0.3 to about 1%, said titanium is present in an amount of from about 0.3 to about 1%, said nickel is present in an amount of from about 0.3 to about 1% and said copper is present in an amount of about 0.1% to about 3%.
10. The composition of claim 9 wherein said chromium is present in an amount of about 0.5%, said titanium is present in an amount of about 0.5%, said nickel is present in an amount of about 0.5% and said copper is present in an amount of about 1%.
11. A method for joining copper or copper alloy surfaces comprising soldering or joining said surfaces together utilizing a flux and a zinc-based composition comprising 0 to about 3.0%
copper, 0 to about 3.0% chromium, 0 to about 3.0% titanium, 0 to about 5.0% nickel, from about 0.01 to about 5.0% lead, from about 0.01 to about 20% tin, and the balance zinc.
copper, 0 to about 3.0% chromium, 0 to about 3.0% titanium, 0 to about 5.0% nickel, from about 0.01 to about 5.0% lead, from about 0.01 to about 20% tin, and the balance zinc.
12. The method of claim 11 wherein said flux contains a halide.
13. The method of claim 11 wherein said flux contains a minor amount of a metal selected from the group consisting of iron, silver and tin, said metal present as either fine particles of the elemental metal or as a soluble salt.
14. An article of manufacture comprising a plurality of copper or copper alloy surfaces joined by a zinc-based composition as the soldering material comprised of from 0 to about 3.0% copper, 0 to about 3.0% chromium, 0 to about 3.0 titanium, 0 to about 5.0% nickel, about 0.01 to about 5.0%
lead, about 0.01 to about 20% tin and the balance zinc.
lead, about 0.01 to about 20% tin and the balance zinc.
15. An article of manufacture comprising a copper or copper alloy surface to which has been joined a zinc-based composition comprised of from 0 to about 3.0% copper, 0 to about 3.0% chromium, 0 to about 3.0% titanium, 0 to about 5.0%
nickel, about 0.01 to about 5.0% lead, about 0.01 to about 20%
tin and the balance zinc as a surfacing alloy.
nickel, about 0.01 to about 5.0% lead, about 0.01 to about 20%
tin and the balance zinc as a surfacing alloy.
16. A method for joining copper or copper alloy surfaces comprising soldering or joining said surfaces together utilizing a zinc-based composition comprising by weight 0 to about 3.0% copper, 0 to about 3.0% chromium, 0 to about 3.0% titanium, 0 to about 5.0% nickel, from about 0.01 to about 5.0% lead, from about 0.01 to about 20%
tin, and the balance zinc.
tin, and the balance zinc.
17. The method of claims 11 or 16 wherein said tin is present in an amount of from about 0.1 to about 15%.
18. The method of claims 11 or 16 wherein said tin is present in an amount of from about 3 to about 10%.
19. The method of claims 11 or 16 wherein said lead is present in an amount of from about 0.1 to about 3%.
20. The method of claims 11 or 16 wherein said chromium is present in an amount of about 0.5%, said titanium is present in an amount of about 0.5%, said lead is present in an amount of about 1%, and said tin is present in an amount of about 5%.
21. The method of claims 11 or 16 wherein said chromium is present in an amount of about 0.5%, said titanium is present in an amount of about 0.5% said lead is present in an amount of about 1%, and said tin is present in an amount of about 9%.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2400179A | 1979-03-26 | 1979-03-26 | |
| US024,001 | 1979-03-26 | ||
| US9795079A | 1979-11-28 | 1979-11-28 | |
| US097,950 | 1979-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1165647A true CA1165647A (en) | 1984-04-17 |
Family
ID=26697899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000347351A Expired CA1165647A (en) | 1979-03-26 | 1980-03-10 | Soldering composition |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA1165647A (en) |
| GB (1) | GB2047740B (en) |
| IT (1) | IT1194623B (en) |
| NL (1) | NL8001776A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000326088A (en) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | Lead-free solder |
| WO2013111143A1 (en) * | 2012-01-24 | 2013-08-01 | G D Abdhool Rahim | Alloy containing precious metals and its method of preparation by using herbal extracts |
-
1980
- 1980-03-10 CA CA000347351A patent/CA1165647A/en not_active Expired
- 1980-03-10 GB GB8008002A patent/GB2047740B/en not_active Expired
- 1980-03-17 IT IT20710/80A patent/IT1194623B/en active
- 1980-03-26 NL NL8001776A patent/NL8001776A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| IT8020710A0 (en) | 1980-03-17 |
| GB2047740B (en) | 1983-03-16 |
| IT1194623B (en) | 1988-09-22 |
| NL8001776A (en) | 1980-09-30 |
| GB2047740A (en) | 1980-12-03 |
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| MKEX | Expiry |