GB2047740A - A zinc-based alloy and applications thereof - Google Patents
A zinc-based alloy and applications thereof Download PDFInfo
- Publication number
- GB2047740A GB2047740A GB8008002A GB8008002A GB2047740A GB 2047740 A GB2047740 A GB 2047740A GB 8008002 A GB8008002 A GB 8008002A GB 8008002 A GB8008002 A GB 8008002A GB 2047740 A GB2047740 A GB 2047740A
- Authority
- GB
- United Kingdom
- Prior art keywords
- present
- copper
- amount
- alloy
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 66
- 239000000956 alloy Substances 0.000 title claims abstract description 66
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052725 zinc Inorganic materials 0.000 title claims abstract description 37
- 239000011701 zinc Substances 0.000 title claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052718 tin Inorganic materials 0.000 claims abstract description 24
- 230000004907 flux Effects 0.000 claims abstract description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000005304 joining Methods 0.000 claims abstract description 19
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 18
- 239000011651 chromium Substances 0.000 claims abstract description 18
- 238000005476 soldering Methods 0.000 claims abstract description 17
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000010936 titanium Substances 0.000 claims abstract description 15
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 150000003839 salts Chemical class 0.000 claims abstract description 7
- 239000011135 tin Substances 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010419 fine particle Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 150000004820 halides Chemical class 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 229910052786 argon Inorganic materials 0.000 description 6
- 230000006698 induction Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A zinc-based alloy comprising from 0 to 3 wt % copper, from 0 to 3 wt % chromium, from 0 to 3.0 wt % titanium, from 0 to 5 wt % nickel, from 0.01 to 5 wt % lead and from 0.01 to 20 wt % tin, the balance being zinc. The alloy can be employed for joining or soldering together copper and copper alloys. It can also be employed as a surfacing alloy for copper or copper alloy surfaces. A solder embodying the alloy includes a flux comprising minor amounts of iron, silver or tin present as fine particles of elemental metal or as a soluble salt.
Description
SPECIFICATION
A zinc-based alloy and applications thereof
This invention relates to a zinc-based alloy and to applications thereof.
Traditionally, copper and copper alloys have been soldered or joined with lead-tin or lead-tin-silver solders. The high cost and density of these types of solders, which are used extensively in automobile and truck radiators, has to some extent limited their use and has encouraged the search for suitable alternatives.
A further drawback is their limited mechanical strength which decreased as the temperature rises.
According to one aspect of the present invention there is provided a zinc-based alloy comprising from 0 to 3 wt % copper, from 0 to 3.0 wt % chromium, from 0 to 3.0 wt % titanium, from 0 to 5.0 wt % nickel, from 0.01 to 5.0 wt % lead, from 0.01 to 20 wt % tin, and the balance zinc.
According to another aspect of the present invention there is provided a solder for soldering copper or copper alloy surfaces, the solder comprising a flux and zinc-based alloy as described above.
According to yet another aspect of the present invention there is provided a method of joining copper or copper alloy surfaces comprising soldering or joining said surfaces together utilizing a flux and a zinc-based alloy as described above.
According to yet another aspect of the present invention there is provided an article of manufacture comprising a plurality of copper or copper alloy surfaces joined by a zinc-based alloy as described above as the soldering material.
According to yet another aspect of the present invention there is provided an article of manufacture comprising a copper or copper alloy surface to which has been joined a surfacing alloy consisting of a zinc-based alloy as described above.
The zinc-based alloys always contain lead, tin and a major proportion of zinc. Preferably the alloys also
contain chromium and/or titanium and/or nickel which enhance the useful properties of the alloys, in
particular by reducing the reactivity of the alloys with the copper or copper alloy interfaces. A minor amount
of copper may also be present to assist in reducing the reactivity of the composition with the copper or copper alloy interfaces. Ranges of the materials used in the soldering alloys are as follows: 0-3.0% Chromium 0-3.0% Copper 0.01-5% Lead 0-5.0% Nickel 0.01-20% Tin 0-3.0% Titanium
Balance Zinc
All percentages used herein are weight percentages.All parts are by weight and based on 100 total parts of the final alloy.
In a preferred embodiment chromium is present in an amount of from 0.3 to 1% and most preferably 0.5%.
Titanium is preferably present in an amount of from 0.3 to 1% and most preferably 0.5%. Nickel is preferably
present in an amount of from 0.3 to 1% and most preferably 0.5% Preferably lead is present in an amount of
from 0.1 to 3% and most preferably 1%. The preferred amount of tin present in the alloy is from 0.1 to 15%,
more preferably from 5 to 10%. Copper, when present, is preferably present in an amount of from 0.1 to 3%,
more preferably 1%.
The alloys should not contain manganese in more than very minor amounts, preferably no more than
trace amounts. Manganese, if present in a significant amount i.e. 1% or more, detracts from the desirable
characteristics of the alloys by reducing their oxidation resistance and wetting properties. However, small
amounts of manganese will not detract from the performance of the alloys so that any of the metals used in
preparing the alloys may contain minor amounts of manganese, provided the total amount of manganese
present is less than 1%.
The alloys should not contain cadmium, indeed any present as even trace impurities should preferably be
eliminated, to the extent feasible, because of the strongly toxic nature of this metal.
Fluxes used in combination with these alloys when they are employed as solders will typically contain a
halide, e.g. a bromide or a chloride as an acid or a salt. Iron, silver or tin may also be present in a minor
amount in the flux either as fine particles of the elemental metal or as soluble salts such as the chlorides,
nitrates, bromides.
The alloys can be prepared by a straightforward melting operation. Preferably, induction melting is used
because it provides improved mixing. The melting operation is preferably carried out under an inert
atmosphere, e.g. a nitrogen or argon blanket, to avoid oxidation of the component metals, particularly
titanium. A nominal temperature in the range of from 850 to 900 F is typically reached during the melting
operation.
Alloys embodying the invention and methods according to the invention will now be particularly
described by way of example.
Commercial grade metals may for certain uses (e.g. joining radiator parts),be perfectly satisfactory as components of the alloys. However, for applications where high and uniform conductivity is important, it may be necessary to utilize more highly refined and purified metals in preparing the alloys.
EXAMPLES
Example 1
A zinc-based alloy useful as a solder for joining or soldering copper or chromium alloys is prepared by placing 0.5 parts chromium,0.5 parts titanium, 1 part lead, 5 parts tin and 93 parts zinc in a vessel in an induction furnace under an argon blanket and heating to 900 F. The resulting alloy has a tensile strength of 11,000 pounds per square inch and melting temperature of 745 C. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond is formed.
Example 2
A zinc-based alloy useful as a solder for joining or soldering copper or copper alloys is prepared by placing 0.5 parts chromium, 0.5 parts titanium, 1 part lead, 9 parts tin and 89 parts zinc in a vessel in an induction furnace under an argon blanket and heating to 900 F. The resulting alloy has a tensile strength of 12,000 pounds per square inch and melting temperature of745'C. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond is formed.
Example 3
A zinc-based alloy useful as a solder for joining or soldering copper or copper alloys is prepared by placing 0.5 parts chromium, 0.5 parts titanium, 1 part lead, 15 parts tin and 83 parts zinc in a vessel in an induction furnace under an argon blanket and heating to 900 F. The resulting alloy has a tensile strength of 14,000 pounds per square inch and a melting temperature of 735 F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond is formed.
Example 4
A zinc-based alloy useful as a solder for joining or soldering copper or copper alloys is prepared by placing 1 part chromium, 1 part copper, 9 parts tin, 1 part lead and 88 parts zinc in a vessel in an induction furnace under an argon blanket and heating to 900 F. The resulting alloy has a tensile strength of 14,000 pounds per square inch and melting temperature of745'F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond is formed.
Example 5
A zinc-based alloy useful as a solder for joining or soldering copper or copper alloys is prepared by placing 0.5 parts chromium, 0.5 parts nickel, 1 part lead, 9 parts tin and 89 parts zinc in a vessel in an induction furnace under an argon blanket and heating to 900 F. The resulting alloy has a tensile strength of 12,000 pounds per square inch and a melting temperature of 730 F. When used as a solder with an appropriate flux to join copper alloy surfaces, a high strength bond is formed.
The above described alloys are highly effective as solders for joining copper and copper alloys, and are reasonable in cost. They maintain their strength over a wide range of temperatures. Additionally, these alloys readily wet and flow over copper and copper alloy surfaces during the joining operation and have a lower dissolving activity or reactivity than conventional zinc alloys.
They are particularly useful for soldering or joining copper or copper alloy surfaces, such as those used in automobile and truck radiators. They also find use in joining copper and copper alloy surfaces in electrical motors and generators and in electronic modules such as printed circuits. The zinc-based solder compositions are substantially more economical than conventional lead-tin and lead-tin-silver solders. They have good wetting and spreading characteristics on copper or copper alloy surfaces and relatively low dissolving activity of reactivity with the copper or copper alloy interfaces being joined. They have good conductivity and therefore show useful characteristics in electrical circuitry.
An additional advantage of the alloys is that they are compatible with and produce strong joints with conventional lead-tin or lead-tin-silver solders. Additionally, it is possible to incorporate certain metal components, e.g. iron, silver and/or tin, into the flux to provide additional enhancement of the wetting characteristics of the alloys.
Claims (22)
1. A zinc-based alloy comprising from 0 to 3 wt % copper, from 0 to 3.0 wt % chromium, from 0 to 3.0 wt % titanium, from 0 to 5.0 wt % nickel, from 0.01 to 5.0 wt % lead, from 0.01 to 20 wt % tin, and the balance zinc.
2. An alloy according to claim 1, wherein tin is present in an amount of from 0.1 to 15 wt %.
3. An alloy according to claim 1 or claim 2, wherein lead is present in an amount of from 0.1 to 3 wt %.
4. An alloy according to any one of claims 1 to 3, wherein the chromium is present in an amount of 0.5 wt %, titanium is present in an amount of 0.5 wt %, lead is present in an amount of 1 wt %, and tin is present in an amount of 5 wt %.
5. An alloy according to any one of claims 1 to 3, wherein chromium is present in an amount of 0.5 wt %, titanium is present in an amount of 0.5 wt %, lead is present in an amount of 1 wt %, and tin is present in an amount of 9 wt %.
6. An alloy according to any one of claims 1 to 3, wherein chromium is present in an amount of 0.5 wt %, titanium is present in an amount of 0.5 wt %, lead is present in an amount of 1 wt %, and tin is present in an amount of 15 wt %.
7. An alloy according to any one of claims 1 to 3, wherein copper is present in an amount of 1 wt %, chromium is present in an amount of 1 wt %, lead is present in an amount of 1 wt %, and tin is present in an amount of 9 wt %.
8. An alloy according to any one of claims 1 to 3, wherein chromium is present in an amount of 0.5 wt %, nickel is present in an amount of 0.5 wt %, lead is present in an amount of 1 wt %, and tin is present in an amount of 9 wt %.
9. An alloy according to any one of claims 1 to 3, wherein chromium is present in an amount of from 0.3 1 wt %, titanium is present in an amount of from 0.3 to 1 wt %, nickel is present in an amount of from 0.3 to 1 wt % and copper is present in an amount of from 0.1 to 3 wt %.
10. An alloy according to any one of claims 1 to 3, wherein chromium is present in an amount of 0.5 wt %, said titanium is present in an amount of 0.5 wt %, nickel is present in an amount of 0.5 wt % and copper is present in an amount of 1 wt %.
11. A zinc-based alloy substantially as hereinbefore described with reference to the Examples.
12. A solder for soldering copper or copper alloy surfaces, the solder comprising a flux and a zinc-based alloy according to any one of claims 1 to 11.
13. A solder according to claim 12, wherein the flux contains a halide.
14. A solder according to claim 12 or claim 13, wherein the flux contains iron, silver or tin present either in the form of fine particles or elemental metal or as a soluble salt.
15. A solder for joining copper or copper alloy surfaces substantially as hereinbefore described with reference to the Examples.
16. A method for joining copper or copper alloy surfaces comprising soldering or joining said surfaces together utilizing a flux and a zinc-based alloy according to any of claims 1 to 11.
17. A method according to claim 16, wherein the flux contains a halide.
18. A method according to claim 16 or claim 17, wherein the flux contains a minor amount of iron, silver or tin, present as either fine particles of the elemental metal or as a soluble salt.
19. An article of manufacture comprising a plurality of copper or copper alloy surfaces joined by a zinc-based alloy according to any one of claims 1 to 11, as the soldering material.
20. An article of manufacture comprising a copper or copper alloy surface to which has been joined a surfacing alloy consisting of a zinc-based alloy according to any one of claims 1 to 11.
New claims or amendments to claims filed on 22 July 1980
Superseded claims 12 to 20
New or amended claims:
12. A solder for soldering copper or copper alloy surfaces, the solder comprising a zinc-based alloy according to any one of claims 1 to 11.
13. A solder according to claim 12 in combination with a flux.
14. A solder according to claim 13, wherein the flux contains a halide.
15. A solder according to claim 13 or claim 14, wherein the flux contains iron, silver or tin present either in the form of fine particles of elemental metal or as a soluble salt.
16. A solder for joining copper or copper alloy surfaces substantially as hereinbefore described with reference to the Examples.
17. A method for joining copper or copper alloy surfaces comprising soldering or joining said surfaces together utilizing a zinc-based alloy according to any one of claims 1 to 11.
18. A method according to claim 17 wherein the said zinc-based alloy is used in combination with a flux.
19. A method according to claim 18, wherein the flux contains a halide.
20. A method according to claim 18 or claim 19, wherein the flux contains a minor amount of iron, silver or tin present as either fine particles of the elemental metal or as a soluble salt.
21. An article of manufacture comprising a plurality of copper or copper alloy surfaces joined by a zinc-based alloy according to any one of claims 1 to 11, as the soldering material.
22. An article of manufacture comprising a copper or copper alloy surface to which has been joined a surfacing alloy consisting of a zinc-based alloy according to any one of claims 1 to 11.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2400179A | 1979-03-26 | 1979-03-26 | |
| US9795079A | 1979-11-28 | 1979-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2047740A true GB2047740A (en) | 1980-12-03 |
| GB2047740B GB2047740B (en) | 1983-03-16 |
Family
ID=26697899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8008002A Expired GB2047740B (en) | 1979-03-26 | 1980-03-10 | Zinc-based alloy and applications thereof |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA1165647A (en) |
| GB (1) | GB2047740B (en) |
| IT (1) | IT1194623B (en) |
| NL (1) | NL8001776A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1080824A1 (en) * | 1999-03-16 | 2001-03-07 | Nippon Sheet Glass Co., Ltd. | Leadless solder |
| WO2013111143A1 (en) * | 2012-01-24 | 2013-08-01 | G D Abdhool Rahim | Alloy containing precious metals and its method of preparation by using herbal extracts |
-
1980
- 1980-03-10 GB GB8008002A patent/GB2047740B/en not_active Expired
- 1980-03-10 CA CA000347351A patent/CA1165647A/en not_active Expired
- 1980-03-17 IT IT20710/80A patent/IT1194623B/en active
- 1980-03-26 NL NL8001776A patent/NL8001776A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1080824A1 (en) * | 1999-03-16 | 2001-03-07 | Nippon Sheet Glass Co., Ltd. | Leadless solder |
| EP1080824A4 (en) * | 1999-03-16 | 2004-08-04 | Nippon Sheet Glass Co Ltd | Leadless solder |
| WO2013111143A1 (en) * | 2012-01-24 | 2013-08-01 | G D Abdhool Rahim | Alloy containing precious metals and its method of preparation by using herbal extracts |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1165647A (en) | 1984-04-17 |
| NL8001776A (en) | 1980-09-30 |
| IT1194623B (en) | 1988-09-22 |
| IT8020710A0 (en) | 1980-03-17 |
| GB2047740B (en) | 1983-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 727 | Application made for amendment of specification (sect. 27/1977) | ||
| 727A | Application for amendment of specification now open to opposition (sect. 27/1977) | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| 727B | Case decided by the comptroller ** specification amended (sect. 27/1977) | ||
| SPA | Amended specification published | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19980310 |