JPH06126484A - Solder - Google Patents
SolderInfo
- Publication number
- JPH06126484A JPH06126484A JP27976692A JP27976692A JPH06126484A JP H06126484 A JPH06126484 A JP H06126484A JP 27976692 A JP27976692 A JP 27976692A JP 27976692 A JP27976692 A JP 27976692A JP H06126484 A JPH06126484 A JP H06126484A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- iii
- stirred
- metals
- prescribed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、強度および広がり率
が高く、融点における固相線と液相線の温度差が小さい
Ｓn−Ｐb系はんだに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Sn-Pb based solder which has a high strength and a high spreading rate and has a small temperature difference between a solidus line and a liquidus line at a melting point.
【０００２】電気電子部品等の接合で汎用されているＳ
n−Ｐb二元系はんだには、一般に次の様な問題点があ
る。即ち、強度が不十分なため(例えば、引張強さは約
４０〜５０Ｎ／mm2である)、はんだ付け部の接合強度を
十分に確保するためには、はんだ接合部に補強およびは
んだ付け面積の拡大等の処理をほどこさなければなら
ず、電気電子部品等の構造の複雑化と重量増およびコス
トアップ等が問題となっている。また、広がり性(濡れ
性)も十分に満足すべきものではないため、はんだ付け
性を向上させるためには、被接合材のめっき処理や酸洗
処理等の付加的な作業工程が必要となる。さらにまた、
融点における固相線と液相線の温度差が比較的大きいた
めに(通常、約１〜２０℃)、作業時間が付加的に長くな
るだけでなく、はんだの溶融から冷却固化までの間は、
特に慎重な作業が必要となる(はんだが半溶融の間に、
はんだ付け部に振動等を加えると、クラックが発生した
り、はんだの広がりが不均一になる)。S, which is widely used for joining electric and electronic parts, etc.
The n-Pb binary solder generally has the following problems. That is, since the strength is insufficient (for example, the tensile strength is about 40 to 50 N / mm 2 ), in order to sufficiently secure the bonding strength of the soldered portion, the soldered portion is reinforced and the soldering area is increased. However, the structure of electric and electronic parts is complicated, and the weight and cost are increased. Moreover, since the spreadability (wettability) is not sufficiently satisfactory, additional work steps such as plating treatment and pickling treatment of the materials to be joined are required to improve solderability. Furthermore,
Due to the relatively large temperature difference between the solidus line and the liquidus line at the melting point (usually about 1 to 20 ° C), not only the working time becomes longer, but also from the melting of the solder to the cooling and solidification. ,
Particularly careful work is required (while the solder is half melted,
If vibration is applied to the soldered part, cracks will occur or the solder will spread unevenly.)
【０００３】上記のような問題点を改良するために、被
接合部品等の種類に応じて、適当な金属を少量添加した
はんだが提供されているが、実用上十分に満足すべきも
のはない。例えば、Ｓb を添加することによって、はん
だの強度は若干高くなるが、広がり率は低下する。ま
た、銅細線等のはんだ付けに際して、所謂 「はんだ食わ
れ」 を防止するためにＣu を添加したはんだの場合に
は、強度はさらに高くなるが、融点における固相線と液
相線の温度差が大きくなって、作業性が悪くなる。さら
にまた、銀電極や銀めっき端子等のはんだ付けに際し
て、はんだ食われを防止するためにＡg を添加したはん
だの場合には、強度はかなり増加するが、非常に高価な
Ａg を必要とするために、汎用性がないという難点があ
る。(なお、ＳbやＣu 等を添加したこれらのＳn−Ｐb系
はんだの具体的な特性は、後述の表１に例示する。)In order to improve the above-mentioned problems, there are provided solders to which a suitable amount of a small amount of metal is added according to the kind of parts to be joined and the like, but none is sufficiently satisfactory for practical use. For example, by adding Sb, the strength of the solder is slightly increased, but the spread rate is decreased. In addition, when Cu is added to prevent the so-called "solder erosion" when soldering thin copper wires, etc., the strength is higher, but the temperature difference between the solidus line and the liquidus line at the melting point is higher. Becomes large and workability deteriorates. Furthermore, in the case of soldering Ag electrodes or silver-plated terminals etc., in the case of solder with Ag added to prevent solder erosion, the strength increases considerably, but very expensive Ag is required. However, there is a drawback that it is not versatile. (Note that specific characteristics of these Sn-Pb based solders to which Sb, Cu, etc. are added are shown in Table 1 below.)
【０００４】[0004]
【発明が解決しようとする課題】この発明は、上記の問
題点を解決し、強度および広がり率が高く、融点におけ
る固相線と液相線の温度差が小さいＳn−Ｐb系はんだを
提供するためになされたものである。SUMMARY OF THE INVENTION The present invention solves the above problems and provides a Sn-Pb based solder having a high strength and a high spreading rate and a small temperature difference between a solidus line and a liquidus line at a melting point. It was done for good.
【課題を解決するための手段】即ちこの発明は、Ｓn ５
５〜６５％および下記(i)、(ii)または(iii)の所定量の
添加金属を含有し、残部がＰb から成るはんだに関す
る: (i) Ｂi １〜３％ (ii) Ｂi ０．２〜２％およびＳb ０．１〜１．０％ (iii)Ｂi ０．２〜２％およびＩn ０．２〜２％Means for Solving the Problems That is, the present invention provides Sn 5
5 to 65% and a solder containing a prescribed amount of an additive metal of (i), (ii) or (iii) below, with the balance being Pb: (i) Bi 1-3% (ii) Bi 0.2 .About.2% and Sb 0.1 to 1.0% (iii) Bi 0.2 to 2% and In 0.2 to 2%
【０００６】本発明によるＳn−Ｐb系はんだのＳn含有
量は５５〜６５％、好ましくは５８〜６３％であり、５
５％よりも少なくなると、液相線温度が高くなり、作業
性が悪くなり、また、６５％よりも多くなると、Ｓｎが
高価であるため、コストアップとなる。The Sn content of the Sn-Pb type solder according to the present invention is 55 to 65%, preferably 58 to 63%.
If it is less than 5%, the liquidus temperature becomes high and the workability is deteriorated, and if it is more than 65%, Sn is expensive and the cost increases.
【０００７】本発明によるＳn−Ｐb系はんだには、添加
金属として、(i)Ｂi １〜３％、好ましくは１．５〜
２．５％、(ii)Ｂi ０．２〜２％、好ましくは０．５〜
１．５％およびＳb ０．１〜１．０％、好ましくは０．
２〜０．７％、または(iii)Ｂｉ０．２〜２％、好まし
くは０．５〜１．５％およびＩｎ ０．２〜２％、好ま
しくは０．５〜１．５％含有される。(i)の場合、Ｂiの
含有量が１％よりも少なくなると、本発明の所期の目的
は達成されず、また、３％よりも多くなると、融点が大
きく低下してはんだ付け部の耐熱性が悪くなるだけでな
く、はんだの金属光沢が消失すると共に、はんだが脆化
する。(ii)の場合、Ｂi およびＳb の含有量がそれぞれ
０．２％および０．１％よりも少なくなると、本発明の
所期の目的は達成されず、Ｂi の含有量が２％よりも多
くなると、上記(i)の場合と同様の効果がもたらされ、
Ｓb の含有量が１．０％よりも多くなると、はんだの広
がり性が低下する。さらに、(iii)の場合、Ｂi または
Ｉn の含有量が０．２％よりも少なくなると、本発明の
所期の目的は達成されず、Ｂiの含有量が２％よりも多
くなると、(i)の場合と同様の効果がもたらされ、ま
た、Ｉn の含有量が２％よりも多くなると、はんだの融
点や広がり率が低下するだけでなく、はんだが脆化する
ようになる。In the Sn-Pb type solder according to the present invention, as an additive metal, (i) Bi is 1 to 3%, preferably 1.5 to
2.5%, (ii) Bi 0.2-2%, preferably 0.5-
1.5% and Sb 0.1-1.0%, preferably 0.1.
2 to 0.7%, or (iii) Bi 0.2 to 2%, preferably 0.5 to 1.5% and In 0.2 to 2%, preferably 0.5 to 1.5%. . In the case of (i), if the content of Bi is less than 1%, the intended purpose of the present invention is not achieved, and if it exceeds 3%, the melting point is greatly reduced and the heat resistance of the soldered portion is reduced. Not only does the property deteriorate, but the metallic luster of the solder disappears and the solder becomes brittle. In the case of (ii), if the Bi and Sb contents are less than 0.2% and 0.1%, respectively, the intended object of the present invention is not achieved, and the Bi content is more than 2%. Then, the same effect as in the case of (i) above is brought about,
If the Sb content is more than 1.0%, the spreadability of the solder is reduced. Further, in the case of (iii), if the Bi or In content is less than 0.2%, the intended object of the present invention is not achieved, and if the Bi content is more than 2%, (i) The same effect as in the case of (1) is brought about, and when the content of In exceeds 2%, not only the melting point and spread rate of the solder are lowered but also the solder becomes brittle.
【０００７】本発明によるはんだの強度および広がり率
は従来の一般的なＳn−Ｐb二元系はんだに比べてそれぞ
れ約１５〜３０％および約０〜２％増加する。従って、
従来の一般的なＳn−Ｐb二元系はんだの使用に際して必
要とされるはんだ接合部の補強等の処理および被接合材
のめっき処理や酸洗処理は不要となる。The strength and spread of the solder according to the present invention are increased by about 15 to 30% and about 0 to 2%, respectively, as compared with the conventional general Sn-Pb binary solder. Therefore,
It is not necessary to reinforce the solder joints or to perform plating or pickling of the materials to be joined, which are required when using the conventional general Sn-Pb binary solder.
【０００８】本発明によるはんだの融点における固相線
温度および液相線温度は約１７５℃〜約１８５℃、好ま
しくは約１７８℃〜約１８３℃の範囲にあり、両者の差
は約５℃以下、好ましくは約２℃以下である。このた
め、はんだ付けに際して、はんだが半溶融状態で存在す
る時間が非常に短くなり、作業能率や歩留りが改良され
る。The solidus temperature and liquidus temperature at the melting point of the solder according to the present invention are in the range of about 175 ° C to about 185 ° C, preferably about 178 ° C to about 183 ° C, and the difference between the two is about 5 ° C or less. , Preferably about 2 ° C. or lower. Therefore, in soldering, the time during which the solder exists in a semi-molten state is very short, and the work efficiency and the yield are improved.
【０００９】本発明によるはんだの融点は従来品とほぼ
同じ温度範囲にあるため、従来のはんだ付けの装置や条
件(例えば、加熱方法、加熱温度および加熱時間等)を利
用できる。Since the melting point of the solder according to the present invention is in the same temperature range as that of the conventional product, the conventional soldering apparatus and conditions (for example, heating method, heating temperature and heating time) can be used.
【００１０】また、本発明によるはんだは、複雑な合金
系でないために、製造時の成分管理が容易である。な
お、本発明によるＳn−Ｐb系はんだに添加する金属の量
は微量であるために、コスト的にはほとんど問題がな
い。Further, since the solder according to the present invention is not a complex alloy system, it is easy to manage the components during manufacturing. Since the amount of metal added to the Sn-Pb-based solder according to the present invention is very small, there is almost no problem in terms of cost.
【００１１】次に、本発明によるはんだの一般的な製造
法を説明する。 (i)Ｓn−Ｂi−Ｐb系はんだ 所定量のＳnおよびＰbをるつぼに入れ、３５０℃で加熱
溶解し撹拌する。その後、所定量のＢiを添加し、溶解
撹拌した後、金型に鋳込む。このあと、必要に応じて、
棒状または糸状等に成形する。 (ii)Ｓn−Ｂi−Ｓb−Ｐb系はんだ 所定量のＳnおよびＰbをるつぼに入れ、３５０℃で加熱
溶解し撹拌する。その後、所定量のＢiおよびＳn−Ｓb
合金を添加し、溶解撹拌した後、金型に鋳込む。このあ
と、必要に応じて、棒状または糸状等に成形する。 (iii)Ｓn−Ｂi−Ｉn−Ｐb系はんだ 所定量のＳnおよびＰbをるつぼに入れ、３５０℃で加熱
溶解し撹拌する。その後、所定量のＢiおよびＩnを添加
し、溶解撹拌した後、金型に鋳込む。このあと、必要に
応じて、棒状または糸状等に成形する。Next, a general method for manufacturing the solder according to the present invention will be described. (i) Sn-Bi-Pb system solder Predetermined amounts of Sn and Pb are put in a crucible, heated and melted at 350 ° C and stirred. Then, a predetermined amount of Bi is added, and the mixture is melted and stirred, and then cast into a mold. After this, if necessary,
It is formed into a rod or thread. (ii) Sn-Bi-Sb-Pb system solder Predetermined amounts of Sn and Pb are put in a crucible, heated and melted at 350 ° C and stirred. Then, a predetermined amount of Bi and Sn-Sb
The alloy is added, melted and stirred, and then cast into a mold. Then, if necessary, it is formed into a rod shape or a thread shape. (iii) Sn-Bi-In-Pb system solder Predetermined amounts of Sn and Pb are put in a crucible, heated and melted at 350 ° C and stirred. Then, predetermined amounts of Bi and In are added, melted and stirred, and then cast into a mold. Then, if necessary, it is formed into a rod shape or a thread shape.
【００１２】[0012]
【実施例】以下、本発明を実施例によって説明する。実施例１〜３ 以下の表１に示す配合処方により、前述の製造法に準拠
してはんだ１〜３を製造した。はんだ１〜３の融点、引
張強度および広がり率を次の方法によって測定し、結果
を表１に示す。 (i)融点の測定 被験はんだを液相線温度以上の温度に加熱した後、空冷
固化する過程の温度変化を熱電対で追跡し、温度の経時
変化曲線を作成し、該曲線から固相線と液相線の温度
(℃)を求めた。 (ii)引張強さの測定 図１に示す形状の被験はんだを室温下、引張速度１０mm
／分の条件下で引張り、引張強さ(Ｎ／mm2)を測定し
た。図１において(１)は標点を示す。 (iii)広がり率の測定 ＪＩＳ Ｚ ３１９７に準拠し、図２に示すように、未溶
融状態の球状被験はんだ(２)および溶融して広がったは
んだ(３)の酸化銅板(１５０℃で１時間の酸化処理に付
した銅板)(４)の表面からの高さＤおよびＨを測定し、
次式から広がり率(％)を求めた: 広がり率(％)＝{(Ｄ−Ｈ)／Ｄ}×１００ なお、試験時には液状の活性化ロジン系フラックスを使
用し、酸化銅板は２５０℃で１０秒間加熱した。EXAMPLES The present invention will be described below with reference to examples. Examples 1 to 3 Solders 1 to 3 were manufactured according to the above-described manufacturing method by the formulation shown in Table 1 below. The melting points, the tensile strengths, and the spreading rates of the solders 1 to 3 were measured by the following methods, and the results are shown in Table 1. (i) Measurement of melting point After heating the test solder to a temperature above the liquidus temperature, the temperature change in the process of air-cooling and solidification is followed by a thermocouple, and a time-dependent curve of temperature is created, and the solidus line is drawn from the curve. And liquidus temperature
(° C) was determined. (ii) Measurement of tensile strength The test solder having the shape shown in FIG.
Tensile strength (N / mm 2 ) was measured under the condition of / min. In FIG. 1, (1) indicates the reference point. (iii) Measurement of Spreading Rate According to JIS Z 3197, as shown in FIG. 2, a copper oxide plate of a spherical test solder (2) in an unmelted state and a solder (3) spread by melting (at 150 ° C. for 1 hour The height D and H from the surface of the copper plate (4) subjected to the oxidation treatment of (4) are measured,
The spread rate (%) was calculated from the following formula: Spread rate (%) = {(D−H) / D} × 100 At the time of the test, a liquid activated rosin-based flux was used, and the copper oxide plate was at 250 ° C. Heated for 10 seconds.
【００１３】比較例１〜６ 表１に示す配合処方により、前述の製造法に準拠しては
んだ１'〜６'を製造し、これらの融点等を前述のように
して測定し、結果を表１に示す。 Comparative Examples 1 to 6 Solders 1'to 6'were manufactured according to the above-mentioned manufacturing method according to the formulation shown in Table 1, and their melting points and the like were measured as described above. Shown in 1.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【発明の効果】強度および広がり率が高く、融点におけ
る固相線と液相線の温度差が小さい本発明によるＳn−
Ｐb系はんだを使用することによって、はんだ接合部の
補強等の処理および被接合材のめっき処理や酸洗処理は
不要となり、また、作業能率や歩留りが改良される。EFFECT OF THE INVENTION Sn-according to the present invention has a high strength and a high spread rate, and has a small temperature difference between the solidus and liquidus at the melting point.
The use of Pb-based solder eliminates the need for treatment such as reinforcement of solder joints, plating treatment and pickling treatment for materials to be joined, and improves work efficiency and yield.
【図１】 はんだの引張強さ測定用試験片の説明図であ
る。FIG. 1 is an explanatory view of a test piece for measuring the tensile strength of solder.
【図２】 はんだの広がり率測定法の説明図である。FIG. 2 is an explanatory diagram of a method for measuring a solder spread rate.
１ 標点 ２ 未溶融被験はんだ ３ 広がったはんだ ４ 酸化銅板 1 Mark 2 Unmelted test solder 3 Spread solder 4 Copper oxide plate
Claims (1)
または(iii)の所定量の添加金属を含有し、残部がＰbか
ら成るはんだ: (i) Ｂi １〜３％ (ii) Ｂi ０．２〜２％およびＳb ０．１〜１．０％ (iii)Ｂi ０．２〜２％およびＩn ０．２〜２％1. Sn 55 to 65% and the following (i) and (ii)
Or (iii) a solder containing a predetermined amount of added metal and the balance Pb: (i) Bi 1-3% (ii) Bi 0.2-2% and Sb 0.1-1.0% ( iii) Bi 0.2-2% and In 0.2-2%
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27976692A JPH06126484A (en) | 1992-10-19 | 1992-10-19 | Solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27976692A JPH06126484A (en) | 1992-10-19 | 1992-10-19 | Solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06126484A true JPH06126484A (en) | 1994-05-10 |
Family
ID=17615612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27976692A Pending JPH06126484A (en) | 1992-10-19 | 1992-10-19 | Solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06126484A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988007442A1 (en) * | 1987-03-30 | 1988-10-06 | Fanuc Ltd | Robot controller |
| EP3290147A1 (en) * | 2016-08-31 | 2018-03-07 | Hojin Platech Co. Ltd. | Tin-bismuth-lead ternary alloy solder composition using electroplating |
| CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
-
1992
- 1992-10-19 JP JP27976692A patent/JPH06126484A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988007442A1 (en) * | 1987-03-30 | 1988-10-06 | Fanuc Ltd | Robot controller |
| EP3290147A1 (en) * | 2016-08-31 | 2018-03-07 | Hojin Platech Co. Ltd. | Tin-bismuth-lead ternary alloy solder composition using electroplating |
| CN107779664A (en) * | 2016-08-31 | 2018-03-09 | 互进电镀科技有限公司 | Utilize the tin bismuth lead ternary alloy three-partalloy solder composition of plating |
| CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
| CN108161271B (en) * | 2017-12-27 | 2021-06-01 | 北京康普锡威科技有限公司 | SnPbBiSb series low-temperature reinforced solder and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5378294A (en) | Copper alloys to be used as brazing filler metals | |
| CN100534699C (en) | Lead-free welding flux alloy | |
| US6156132A (en) | Solder alloys | |
| JP2019527145A (en) | SnBiSb low-temperature lead-free solder | |
| CN108971793B (en) | Low-temperature lead-free solder | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| JPH0970687A (en) | Leadless solder alloy | |
| CN108994480A (en) | A kind of SnBiAgCu high-reliability lead-free solder alloy | |
| US4241148A (en) | Composite aluminum-containing workpieces | |
| US6299835B1 (en) | Cadmium-free silver alloy as low-melting brazing filler material | |
| US20070172381A1 (en) | Lead-free solder with low copper dissolution | |
| JP3736819B2 (en) | Lead-free solder alloy | |
| JP3081230B2 (en) | Copper alloy used as brazing filler metal | |
| WO2007082459A1 (en) | Lead-free solder and its preparation method | |
| CN101733575A (en) | Tin-zinc-bismuth-copper leadless solder with low cost and welding spot thereof | |
| JP2001287082A (en) | Solder | |
| CN114227057B (en) | Lead-free solder alloy and preparation method and application thereof | |
| EP3369520B1 (en) | Solder alloy for preventing fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method | |
| JPH06126484A (en) | Solder | |
| JP2012121047A (en) | Lead-free solder alloy | |
| JPH10230384A (en) | Solder material | |
| JPH06126483A (en) | Sn-pb solder | |
| CN1325680C (en) | Sn-Ag-Cu-Cr alloy lead-free solder preparation method | |
| US5178827A (en) | Copper alloys to be used as brazing filler metals | |
| JPH10249579A (en) | Solder material |