CA1165647A - Soldering composition - Google Patents

Soldering composition

Info

Publication number
CA1165647A
CA1165647A CA000347351A CA347351A CA1165647A CA 1165647 A CA1165647 A CA 1165647A CA 000347351 A CA000347351 A CA 000347351A CA 347351 A CA347351 A CA 347351A CA 1165647 A CA1165647 A CA 1165647A
Authority
CA
Canada
Prior art keywords
present
amount
copper
tin
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000347351A
Other languages
English (en)
French (fr)
Inventor
Roy E. Beal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Copper Development Association Inc
Original Assignee
Copper Development Association Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Copper Development Association Inc filed Critical Copper Development Association Inc
Application granted granted Critical
Publication of CA1165647A publication Critical patent/CA1165647A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/28Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282Zn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating With Molten Metal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA000347351A 1979-03-26 1980-03-10 Soldering composition Expired CA1165647A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US2400179A 1979-03-26 1979-03-26
US024,001 1979-03-26
US9795079A 1979-11-28 1979-11-28
US097,950 1979-11-28

Publications (1)

Publication Number Publication Date
CA1165647A true CA1165647A (en) 1984-04-17

Family

ID=26697899

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000347351A Expired CA1165647A (en) 1979-03-26 1980-03-10 Soldering composition

Country Status (4)

Country Link
CA (1) CA1165647A (it)
GB (1) GB2047740B (it)
IT (1) IT1194623B (it)
NL (1) NL8001776A (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
WO2013111143A1 (en) * 2012-01-24 2013-08-01 G D Abdhool Rahim Alloy containing precious metals and its method of preparation by using herbal extracts

Also Published As

Publication number Publication date
GB2047740B (en) 1983-03-16
IT8020710A0 (it) 1980-03-17
NL8001776A (nl) 1980-09-30
GB2047740A (en) 1980-12-03
IT1194623B (it) 1988-09-22

Similar Documents

Publication Publication Date Title
US4451541A (en) Soldering composition and method of use
US6231691B1 (en) Lead-free solder
US5422191A (en) Aluminum-lithium filler alloy for brazing
US5527628A (en) Pb-free Sn-Ag-Cu ternary eutectic solder
US6168071B1 (en) Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method
US6156132A (en) Solder alloys
JPH09326554A (ja) 電子部品接合用電極のはんだ合金及びはんだ付け方法
JP2008521619A (ja) はんだ合金
EP0695373A1 (en) Lead-free and bismuth-free tin alloy solder composition
KR0168964B1 (ko) 납땜성이 우수한 무연땜납
US5971258A (en) Method of joining aluminum parts by brazing using aluminum-magnesium-lithium-filler alloy
US5728479A (en) Aluminum-lithium-magnesium filler alloy for brazing
CA1165647A (en) Soldering composition
EP0729398B1 (en) A method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method
JP3346848B2 (ja) 無鉛はんだ合金
CA2540486A1 (en) Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), nickel (ni), phosphorus (p) and/or rare earth: cerium (ce) or lanthanum (la)
JP2681742B2 (ja) 無鉛はんだ合金
KR0158600B1 (ko) 기계적 특성이 우수한 무연땜납
US20040208779A1 (en) Lead-free alloy
JPS6238079B2 (it)
KR0151999B1 (ko) 무연땜납
KR100444786B1 (ko) 기계적 성질이 개선된 저융점의 무연땜납 조성물
KR100293180B1 (ko) 고온용무연땜납
JPS5812117B2 (ja) 金属ろう
KR0177681B1 (ko) 퍼짐성이 우수한 무연땜납

Legal Events

Date Code Title Description
MKEX Expiry